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Binding composition, electric circuit connecting material, electric component connecting structure and production thereof

A technology for circuit connection materials and circuit components, applied in the direction of circuits, adhesives, electrical components, etc., can solve problems such as the adverse effects of surrounding components, and achieve the effects of low connection resistance, good stability, and high bonding strength

Inactive Publication Date: 2005-10-12
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, when heat treatment is performed at a temperature of 170 to 250°C as described above, the heating during curing may have adverse effects on surrounding components

Method used

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  • Binding composition, electric circuit connecting material, electric component connecting structure and production thereof
  • Binding composition, electric circuit connecting material, electric component connecting structure and production thereof
  • Binding composition, electric circuit connecting material, electric component connecting structure and production thereof

Examples

Experimental program
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Effect test

no. 1 Embodiment approach

[0029] adhesive composition

[0030] The adhesive composition of the present invention contains a radical polymerizable compound, a radical polymerization initiator, and a compound having a nitrogen-silicon bond.

[0031]A radically polymerizable compound is a compound having a functional group polymerizable by radicals. Radical polymerizable compounds include, for example, (meth)acrylate compounds, maleimide compounds, citraconimide compounds, indophenolimide (najimid) compounds, and the like. These may be used alone or in combination of two or more. In addition, the radically polymerizable compound may be used either in the form of a monomer or an oligomer, or may be used as a mixture of monomers and oligomers.

[0032] Examples of (meth)acrylate compounds include: methyl (meth)acrylate, ethyl (meth)acrylate, isopropyl (meth)acrylate, isobutyl (meth)acrylate, ethyl (meth)acrylate Diol ester, diethylene glycol di(meth)acrylate, trimethylolpropyl tri(meth)acrylate, tetramet...

no. 2 Embodiment approach

[0097] Circuit connection material

[0098] The circuit connection material of the present embodiment is used for a first circuit member having a first circuit electrode formed on a main surface of a first circuit board and a second circuit member having a second circuit electrode formed on a main surface of a second circuit board. The first circuit electrode and the second circuit electrode are connected in the state of facing each other, including an adhesive composition having a radical polymerizable compound and a radical polymerization initiator, and a conductive material having a surface treated with a compound having a nitrogen-silicon bond. particle.

[0099] First, the adhesive composition contained in the circuit connection material in this embodiment is demonstrated. The adhesive composition contains at least a radical polymerizable compound and a radical polymerization initiator.

[0100] As the radical polymerizable compound and the radical polymerization initia...

Embodiment 1

[0141] Dissolve 50 g of phenoxy resin (manufactured by Union Carbide Co., Ltd., trade name PKHC, average molecular weight 45,000) in toluene (boiling point 110.6°C, SP value 8.90) / ethyl acetate (boiling point 77.1°C, SP value) at a mass ratio of 50 / 50 In the mixed solvent of 9.10), a phenoxy resin solution having a solid content of 40% by mass was obtained.

[0142] As the radical polymerizable compound, hydroxyethylethylene glycol dimethacrylate (manufactured by Kyoeisha Chemical Co., Ltd., trade name 80MFA) and phosphate dimethacrylate (manufactured by Kyoeisha Chemical Co., Ltd., trade name P- 2M).

[0143] As a silazane compound (a compound having a nitrogen-silicon bond), 1,3,5,7-tetraethenyl-1,3,5,7-tetramethylcyclotetrasilazane (manufactured by Chisso Corporation) was used.

[0144] As a radical polymerization initiator, di-2-ethylhexylperoxydicarbonate (manufactured by NOF Corporation, trade name Pa-Roil OPP) was used.

[0145] On the surface of the polystyrene core ...

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Abstract

The invention provides an adhesive composition, which contains a radically polymerizable compound, a radical polymerization initiator and a compound having a nitrogen-silicon bond.

Description

technical field [0001] The present invention relates to an adhesive composition, a film-like adhesive using the adhesive composition, a circuit connecting material, a film-like circuit connecting material using the circuit connecting material, a connection structure of circuit components, and a connection structure of circuit components manufacturing method. Background technique [0002] In the fields of electric power industry and electronic industry, various adhesive materials are often used in order to join components such as various circuit components. Especially in the field of semiconductor elements and liquid crystal display elements, with the development of high density and high precision, the adhesives used for these applications are required to have high adhesive strength, especially under high temperature and high humidity conditions Has excellent bonding strength. [0003] In addition, in the covering body bonded by an adhesive, metals such as copper, aluminum,...

Claims

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Application Information

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IPC IPC(8): C08K9/08C09J9/00C09J201/00H01L21/58
CPCH01L2224/83101E02B15/0814E02B15/085E02B15/0864
Inventor 加藤木茂树须藤朋子汤佐正己
Owner HITACHI CHEM CO LTD
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