Light sensitive resin composition

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of unevenness, uneven coating of interlayer insulating film, poor flatness and the like

Active Publication Date: 2005-11-30
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned acetates have problems such as non-planarization of the interlayer insulating film and uneven coating, which cause problems such as poor flatness after the light irradiation process.

Method used

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  • Light sensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] (manufacture of acrylic copolymer)

[0074] In a flask with a cooling tube and a stirrer, add 10 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile), 500 parts by weight of tetrahydrofuran, 20 parts by weight of methacrylic acid, 25 parts by weight Glycidyl methacrylate, 40 parts by weight of styrene, 5 parts by weight of 2-hydroxyethyl acrylate, and 10 parts by weight of isobornyl acrylate were replaced with nitrogen and slowly stirred. The reaction solution was heated to 62° C. and maintained at this temperature for 5 hours to produce a polymer solution containing an acrylic copolymer.

[0075] In order to remove unreacted monomers in the polymer solution, 100 parts by weight of the polymer solution were precipitated with respect to 100 parts by weight of a poor solvent formed by mixing ether and n-hexane at a ratio of 1:1. . Subsequently, the poor solvent in which the unreacted substance was dissolved was removed by a filtration step using a mesh. Then, vacu...

Embodiment 2

[0081] Except having used hexanol instead of the benzyl alcohol which is a solvent in the said Example 1, it implemented by the method similar to the said Example 1, and manufactured the photosensitive resin composition.

Embodiment 3

[0083] Except having used diethylene glycol methyl ethyl ether instead of the benzyl alcohol which is a solvent in the said Example 1, it carried out by the method similar to the said Example 1, and manufactured the photosensitive resin composition.

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Abstract

The photosensitive resin composition comprises (a) an acrylic copolymer obtained by copolymerizing (i) an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride or a mixture of them, (ii) an epoxy-containing unsaturated compound and (iii) an olefinically unsaturated compound, (b) a 1,2-quinonediazido compound and (c) one or more solvents selected from the group consisting of benzyl alcohol, hexyl alcohol, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, diethylene glycol diethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dimethyl ether and dipropylene glycol methylethyl ether. So this invention provides a photosensitive resin composition which is excellent in performances such as sensitivity transmittance, insulation and chemical resistance, remarkably improves flatness and coating property in particular, and is suitable for forming an interlayer insulating film in a process for fabricating LCD, etc.

Description

technical field [0001] The present invention relates to a photosensitive resin composition. More specifically, the photosensitive resin composition involved not only has excellent properties such as photosensitivity, transmittance, insulation, and chemical resistance, but also can significantly improve flatness and Coatability, suitable for forming an interlayer insulating film in the liquid crystal display (LCD) manufacturing process. Background technique [0002] In a TFT liquid crystal display device and an integrated circuit element, an interlayer insulating film is used to insulate wiring arranged between layers. [0003] When forming such an interlayer insulating film, in order to obtain an interlayer insulating film having a required pattern shape, a photosensitive material having few steps and excellent flatness is used. [0004] Recently, along with the increase in the size of the substrate, a low-viscosity photoresist (photoresist) is required for an interlayer in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/023C08F220/00G03F7/004G03F7/008G03F7/027G03F7/033
CPCG02F1/133345G03F7/0045G03F7/0226G03F7/0233G03F7/027G03F7/033G03F7/0392
Inventor 吕泰勳金柄郁金东敏尹赫敏丘冀赫尹柱豹郑义澈金东明
Owner DONGJIN SEMICHEM CO LTD
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