Nano line array in multiplayer structure, and preparation method
A nanowire array and multilayer structure technology, which is applied in nanostructure manufacturing, nanotechnology, nanotechnology, etc., can solve the problem that there are no public reports on oxide multilayer nanowires, and it is difficult to obtain sulfide multilayer nanowires and devices. Unfavorable production and other problems, to achieve the effect of low cost, orderly arrangement and high production efficiency
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[0017] Example 1: Preparation of sulfide semiconductor / sulfide semiconductor nanowire arrays.
[0018] A porous aluminum oxide template plated with a 2 μm thick gold film on one side is selected, the template has a pore diameter of 100 nm, a hole spacing of 100 nm, and a thickness of 10 μm. Electrochemical deposition of nickel / copper multilayer nanowire arrays. The nickel / copper electrolyte is composed of a mixed aqueous solution of copper sulfate (final concentration 0.2M) and nickel sulfate (final concentration 2M). The nickel (-1.4V) / copper (-0.3V) pulse alternating constant voltage growth method was used, and the deposition time was 1 s and 10 s, respectively. The thickness of the nickel / copper multilayer is 40nm / 20nm. The length of the nanowire is 1 μm. The template with nickel / copper multilayer nanowires grown in the holes is immersed in a 3M NaOH solution to remove the alumina template, and a nickel / copper multilayer nanowire array regularly arranged on the surface of the g...
Example Embodiment
[0021] Embodiment 2: Preparation of oxide semiconductor / oxide semiconductor nanowire array.
[0022] A nickel / copper multilayer nanowire array is electrochemically deposited on an aluminum oxide porous template plated with a nickel film of 5 μm on one side. The template has a pore size of 50 nm, a hole spacing of 100 nm, and a thickness of 10 μm. The nickel / copper electrolyte is composed of a mixed aqueous solution of copper sulfate (final concentration 0.2M) and nickel sulfate (final concentration 2M). The nickel (-1.4V) / copper (-0.3V) pulse alternating constant voltage growth method was adopted, and the deposition time was 1 s and 10 s, respectively. The thickness of the nickel / copper multilayer is 20nm / 40nm. The length of the nanowire is 1 μm.
[0023] The template with nickel / copper multilayer nanowires grown in the holes is immersed in a 3M NaOH solution to remove the alumina template, and a nickel / copper multilayer nanowire array regularly arranged on the surface of the meta...
Example Embodiment
[0026] Example 3: Preparation of metal / sulfide semiconductor nanowire arrays.
[0027] A gold / iron multi-layer nanowire array is electrochemically deposited on an aluminum oxide porous template plated with a gold film of 1 μm on one side. The template has a pore size of 80 nm, a pore spacing of 100 nm, and a thickness of 20 μm. Gold plating solution made of HAuCl 4 ·3H 2 O(1gl -1 ) And H 2 SO 4 (7gl -1 ), the iron plating bath consists of 0.5M FeSO4 and 0.5M H 2 Composition of SO4 solution. Using the double-slot alternate electrochemical constant-voltage deposition method, the process parameters of the gold / iron multi-layer are 10V, 2S and -1.5V, 3S, respectively. The thickness of the obtained gold / iron multilayer is 20nm / 30nm. The length of the nanowire is 2μm.
[0028] The template with gold / iron multilayer nanowires grown in the holes is immersed in a 3M NaOH solution to remove the alumina template to obtain a gold / iron multilayer nanowire array regularly arranged on the surfac...
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