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Plating solution, conductive material, and surface treatment method of conductive material

A conductive material and plating solution technology, applied in the direction of magnetic materials, magnetic film to substrate application, circuits, etc., can solve the problems of plating solution deterioration, high cost, dark brown color of Cu appearance, etc., and achieve good appearance , High adhesion effect

Active Publication Date: 2006-12-06
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in this Japanese Patent No. 3614754, in the actual manufacturing process, if the plating treatment is repeated using the same plating solution, there is a problem that the plating solution deteriorates and the color of Cu changes from skin color to dark brown.
Therefore, in the method described in this document, it is necessary to exchange a new plating solution (plating solution not used for the plating treatment) at a frequency of about once every tens of batches, for example, to carry out the plating treatment, which causes high cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] In the Ar atmosphere, at 600 ° C, the sintered body produced by powder metallurgy with the composition of 14Nd-1Dy-7B-78Fe (the number is the atomic ratio) is heat-treated for 2 hours, and processed into 50 × 50 × 5 (mm ) size, and then be chamfered by barrel polishing to obtain a permanent magnet.

[0091] Next, after the permanent magnet sample was washed with an alkaline degreasing solution, the surface was activated with a 3% nitric acid solution, and after sufficiently washed with pure water, a protective film was formed on the surface of the permanent magnet sample by the following method.

[0092] First, as a plating bath for forming a protective film, 0.2 mol / l of copper sulfate, 0.6 mol / l of aminotrimethylene phosphonic acid, 0.01 mol / l of ammonium sulfate, 2 mol / l of potassium hydroxide and bright agent, prepare a 1L plating bath with a pH of 8.0 at 60°C.

[0093] Next, in this plating bath, using an electrolytic copper plate as an anode, the permanent magnet...

Embodiment 2

[0098] In addition to using copper phosphate comprising 0.3mol / l, diethylenetriaminepentamethylenephosphonic acid of 1.0mol / l, sodium carbonate of 0.5mol / l, sodium hydroxide of 2mol / l and a plating bath of brightener ( pH = 9.0), as in Example 1, 100 batches of plating were performed to obtain 100 samples. The obtained samples were evaluated in the same manner as in Example 1 for corrosion resistance, heat resistance, and adhesion of the protective film. As a result, it was confirmed that neither the samples of the first batch nor the samples of the 100th batch had rust spots or bumps, and the rate of property degradation was 0.01%, and the peeling force was 50 MPa or more, which was a good result.

Embodiment 3

[0100] Except using a plating bath containing 0.5 mol / l copper acetate, 0.1 mol / l diethylenetriaminepentamethylenephosphonic acid, 0.5 mol / l alanine, 2 mol / l potassium hydroxide and brightener (pH = 12), in the same manner as in Example 1, 100 batches of plating were performed to obtain 100 samples. The obtained samples were evaluated in the same manner as in Example 1 for corrosion resistance, heat resistance, and adhesion of the protective film. As a result, it was confirmed that neither the samples of the first batch nor the samples of the 100th batch had rust spots or bumps, and the rate of property degradation was 0.01%, and the peeling force was 50 MPa or more, which was a good result.

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Abstract

A plating solution including a copper salt, an organic phosphonic acid compound, and at least one compound or ions selected from an amine, alpha-amino acid, ammonium ions, carbonic acid ions, carboxylic acid ions, dicarboxylic acid ions, sulfuric acid ions, and thiosulfuric acid ions and a method of treating the surface of a conductive material using this plating solution.

Description

technical field [0001] The present invention relates to a plating solution, a surface treatment method of a conductive material using the plating solution, and a conductive material obtained by surface treatment by the surface treatment method. Background technique [0002] Permanent magnets, one of the conductive materials, are widely used in motors and transmissions of various machines. As such permanent magnets, since they have high performance, Sm—Co-based rare earth permanent magnets are mass-produced by powder metallurgy. However, this Sm—Co-based rare earth permanent magnet has a problem of high cost because expensive Sm and Co are used as raw materials. [0003] Among rare earths, rare earth elements with small atomic weights, such as cerium (Ce), praseodymium (Pr), and neodymium (Nd), are more abundant than samarium (Sm), and are relatively cheap. In addition, iron (Fe) is also cheap. [0004] Therefore, in recent years, using relatively cheap raw materials, Nd—F...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38H01F1/053
CPCC25D7/001C25D3/38H01F41/026H01F41/26C25D7/00
Inventor 坂本健森川弘康山本恭之福田启一
Owner TDK CORPARATION
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