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Ultralow dielectric constant polyimide film and its preparation method

An ultra-low dielectric constant, polyimide film technology, applied in the field of polymer dielectric materials and their preparation, can solve the conflict between composition and thermal/chemical stability and dielectric properties, is not easy to scale application, process and technical complexity, to achieve the effect of improved preparation efficiency, low cost, simple process and equipment

Inactive Publication Date: 2007-02-14
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

, to solve the problem that the existing low dielectric constant polyimide material structure and composition conflict with thermal / chemical stability and dielectric properties; to solve the existing low dielectric constant polyimide porous film preparation method The problems of expensive raw materials, complex process and technology, high cost, and difficulty in large-scale application

Method used

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  • Ultralow dielectric constant polyimide film and its preparation method
  • Ultralow dielectric constant polyimide film and its preparation method
  • Ultralow dielectric constant polyimide film and its preparation method

Examples

Experimental program
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preparation example Construction

[0047] (1) Preparation of film-making solution—polyamic acid solution

[0048] Dissolve polyamic acid solids in polar solvents to prepare polyamic acid solutions, or directly add dianhydride and diamine monomers in a molar ratio of 1 / 1 to polar solvents, and stir at 15-30°C for 15- After 24 hours, the polyamic acid solution was obtained, and then vacuum degassed at room temperature for 1-12 hours to obtain the membrane-forming solution.

[0049] The dianhydride monomer of the polyamic acid is any one of pyromellitic dianhydride (PMDA) or 3,3',4,4'-benzophenone tetraacid dianhydride (BTDA), and the diamine monomer Any one of 4,4'-diaminodiphenyl ether (ODA) or p-phenylenediamine (PDA);

[0050] The polar solvent is any one of N,N-dimethylacetamide (DMAc), N,N-dimethylformamide (DMF) or N-methylpyrrolidone (NMP);

[0051] The mass concentration of the polyamic acid in the film forming liquid is 10-30%, and the mass concentration of the solvent is 70-90%.

[0052] The purpose ...

Embodiment 1

[0083] Example 1: Various implementation conditions and the structure and performance of the obtained ultra-low dielectric constant polyimide porous membrane are shown in Table 1.

[0084] Casting solution

Embodiment 2

[0085] Example 2: The various implementation conditions and the structure and performance of the obtained ultra-low dielectric constant polyimide porous membrane are shown in Table 2.

[0086] Casting solution

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Abstract

The present invention discloses one kind of ultra low dielectric constant polyimide film and its preparation process. The polyimide film features its honeycomb structure of 5-2000 nm size, two compact surface layers, thickness of 10-200 microns and porosity of 30-85 %. The preparation process includes the following steps: 1. dissolving polyamic acid as the precursor of polyimide in polar solvent to compound filming liquid of 10-30 wt% concentration; 2. flow casting the filming liquid on some support to form liquid film of 50-500 micron thickness; 3. soaking the liquid film inside coagulating bath to solidify into polyamic acid film; 4. soaking and cleaning in detergent, and drying to obtain honeycombed polyamic acid film; and 5. heat treating the polyamic acid film at 100-300 deg.c to iminate so as to obtain honeycombed polyimide film of dielectric constant 1.45-2.50.

Description

technical field [0001] The technical field that the present invention relates to is polymer dielectric material and its preparation technology, especially relates to an ultra-low dielectric constant polyimide film and its preparation method. Background technique [0002] With the continuous development of electronic and electrical technology, the size of electronic and electrical equipment and its components is getting smaller and larger, and the power is getting bigger and bigger. Interference between the lines requires the use of interlayer materials with low dielectric constants to reduce capacitive effects or conductive coupling, thereby shortening the cycle time of signals and energy between conductor lines, reducing transmission lag, cross-interference between lines, and capacitive coupling, creating a larger capacity , Higher integration equipment or components. Therefore, the development of electronics and electrical technology not only puts forward higher requireme...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08
Inventor 朱宝库楚晖娟张梅徐又一
Owner ZHEJIANG UNIV
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