Liquid photo-imaging alkali developable electronic solder-proof ink and its preparing method

A technology of photoimaging and alkali development, applied in the chemical field, can solve problems such as unsatisfactory solder resistance, failure to meet manufacturing requirements, and unsatisfactory resolution, and achieve excellent adhesion, high hardness, and convenient construction.

Inactive Publication Date: 2007-05-30
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solder resist ink made of these main resins, because the main resin determines its heat resistance limitation, its solder resistance is not very ideal (generally 260 ° C, 10s, three times)
In addition, the ink made of ordinary bisphenol A modified epoxy resin with high softening point is easy to stick to Feilin, and the resolution is not ideal, which cannot meet the manufacturing requirements of high-quality PCB boards that require high solder resistance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The following components are proportioned by weight percentage: according to the synthesis method one homemade alkali-soluble photosensitive resin: 30.0%, heat-resistant novolac epoxy resin: 20.0%, superfine talcum powder: 22.0%, trimethylolpropane triacrylic acid Esters: 5.0%, Tripropylene glycol diacrylate: 8.0%, 2-Methyl-1-(4-methylmercaptophenyl)-2-morpholine-1-propanone: 2.0%, Isopropylthioxanthone: 1.0%, dicyandiamide: 1.2%, imidazole type curing accelerator: 0.3%, phthalocyanine green: 0.5%, polymer polysiloxane solution dispersant: 0.3%, alkylbenzene modified polydimethylsiloxane Oxylkane leveling agent: 1.0%, solvent divalent acid value (DBE): 5.0%, ethylene glycol ethyl ether acetate: 3.7%, the above-mentioned substances are uniformly dispersed under a high-speed disperser, and then ground on a three-roller until fine The viscosity is less than or equal to 15 μm, and finally the viscosity is adjusted to 65 ps with 8 parts of ethylene glycol ether acetate to ob...

Embodiment 2

[0043] The following components are proportioned by weight percentage: self-made alkali-soluble photosensitive resin according to Synthesis Method 2: 42.6%, novolac epoxy resin: 6.6%, superfine talcum powder: 27%, trimethylolpropane triacrylate: 3 %, tripropylene glycol diacrylate: 2%, 2-methyl-1-(4-methylmercaptophenyl)-2-morpholine-1-propanone: 3.3%, isopropylthioxanthone: 0.5%, Dicyandiamide: 0.4%, imidazole type curing accelerator: 0.1%, phthalocyanine green: 0.8%, polymer polysiloxane solution dispersant: 0.5%, alkylbenzene modified polydimethylsiloxane flow Leveling agent: 1%, DBE: 5%, ethylene glycol ethyl ether acetate: 7.2%, the above-mentioned substances are uniformly dispersed under the high-speed disperser, and then ground on a three-roll machine to a fineness ≤ 15 μm, and finally ethylene glycol ether Adjust the viscosity to 60 ps with 10 parts of acetate to obtain the liquid photo-imaging alkali-developable electronic solder resist ink of the present invention. ...

Embodiment 3

[0053] The following components are proportioned by weight percentage: according to the synthesis method one self-made alkali-soluble photosensitive resin: 50.0%, novolac epoxy resin: 5.0%, superfine talcum powder: 25.0%, trimethylolpropane triacrylate: 3.0% %, tripropylene glycol diacrylate: 2.0%, 2-methyl-1-(4-methylmercaptophenyl)-2-morpholine-1-propanone: 3.0%, isopropylthioxanthone: 0.8%, Dicyandiamide: 0.3%, imidazole type curing accelerator: 0.1%, phthalocyanine green: 0.8%, polymer polysiloxane solution dispersant: 0.7%, alkylbenzene modified polydimethylsiloxane flow Leveling agent: 1.3%, DBE: 4.0%, ethylene glycol ethyl ether acetate (CAC): 4.0%, the above-mentioned substances are uniformly dispersed under a high-speed disperser, and then ground on a three-roll machine to a fineness of ≤ 15 μm, and finally with a solvent Adjust the viscosity to 60 ps with 13 parts of ethylene glycol ethyl ether acetate to obtain the liquid photoimaging alkali-developable electronic s...

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Abstract

The invention discloses liquid photosensitive imaging alkali developing electric resistance welding ink and production method. The ink comprises alkali solulbility photosensitive resin 30-50 %, heat-proof novolac epoxy 5-20 %, firming agent 0.3-1.2 %, firming accelerant 0.1-0.3 %, active diluent 5-15 %, solvent 5-15 %, photo-initiation agent 3-9 %, auxiliary agent 1-3 %, pigment 0.5-0.8 %, brasque 15-30 %; When it is produced, the alkali solulbility photosensitive resin is weighted by mass percent and dispersed evenly by dispersion machine, it is abraded to that fineness is smaller than 15 mum, the viscosity is adjusted by solvent to 50-80ps(25DEG C), the liquid photosensitive imaging alkali developing electric resistance welding ink in the invention is obtained. The operational charactisteric of the invention is simple, development is quick, and the ink also possesses characteristics that heat-proof quality is good; construction is convenient, adhesive force achieves first class; solidness is bigger than 4H.

Description

technical field [0001] The invention relates to an ink in the chemical field, in particular to a liquid photosensitive imaging alkali-developing electronic solder resist ink and a preparation method thereof. Background technique [0002] With the continuous advancement and development of the modern electronics industry, my country has leapt from a backward printed circuit board (PCB) production country to an advanced country in the world. In 2003, my country's total output value of PCB ranked second in the world rankings. Soon led to the development of surrounding industries and related industries. At present, PCB ink manufacturers in Hong Kong, Japan, the United States, Taiwan, etc. or joint ventures in my country produce PCB inks that occupy a large domestic PCB market share. With the expansion of the high-precision circuit board market, UV-curable inks have become the ink of choice in PCB manufacturing. The existing dilute alkali developing photoimaging liquid solder res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/027G03F7/028C09D11/10C09D11/00C09D11/101C09D11/107
Inventor 任碧野邓光万刘新星童真
Owner SOUTH CHINA UNIV OF TECH
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