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Conductive microparticle, process for producing the same and anisotropic conductive material

A manufacturing method and a conductive technology, applied in the field of anisotropic conductive materials, can solve the problems of harmful environment, lack of stability of plating bath, strong corrosion of core material particles, etc.

Inactive Publication Date: 2007-06-13
SEKISUI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the methods using these plating solutions are very sensitive to contaminants such as nickel, and there is a problem that the plating bath lacks stability.
[0009] In addition, the stability of the plating bath for gold plating is generally excellent, so a cyanide bath using gold cyanide or the like is used, but a cyanide bath is used in a strong alkalinity, so the corrosion of the core material particles is strong, and it is harmful to the environment, so it is expected Non-cyanide electroless gold plating

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] With a 10% by weight solution of an ion adsorbent, treat divinylbenzene-based polymer resin particles (manufactured by Sekisui Chemical Industry Co., Ltd.) with a particle diameter of 4 μm for 5 minutes, then treat with a 0.01% by weight aqueous solution of palladium sulfate for 5 minutes, and then add Dimethylamine borane was subjected to a reduction treatment, filtered, washed, immersed in a nickel plating solution, and reacted to obtain nickel-plated fine particles.

[0063] Next, a solution containing 10 g of sodium gold chloride and 1000 ml of ion-exchanged water was prepared, and 10 g of the obtained nickel-plated fine particles were mixed to prepare an aqueous suspension.

[0064] 30 g of ammonium thiosulfate, 80 g of ammonium sulfite, and 40 g of ammonium hydrogenphosphate were added to the obtained aqueous suspension to prepare a plating solution.

[0065] After adding 10 g of hydroxylamine to the obtained plating solution, the pH was adjusted to 10 with ammoni...

Embodiment 2

[0068] For the nickel-plated fine particles obtained in Example 1, a solution containing 16 g of auric chloride acid and 1000 mL of ion-exchanged water was prepared, and 10 g of the obtained nickel-plated fine particles were mixed to prepare an aqueous suspension.

[0069] 30 g of ammonium thiosulfate, 80 g of ammonium sulfite, and 40 g of ammonium hydrogen phosphate were added to the obtained aqueous suspension to prepare a plating solution. After adding 5 g of aminopyridine to the obtained plating solution, the pH was adjusted to 7 with ammonia water, and the bath temperature was set at 60° C., and reacted for about 15 to 20 minutes to obtain gold-coated conductive fine particles.

[0070] The obtained conductive fine particles were immersed in a 1% by weight nitric acid solution for 15 minutes, and the amount of eluted nickel was measured by acid-base titration. An elution test with nitric acid was performed. As a result, the eluted amount of nickel was 52 μg / g.

Embodiment 3

[0078] To 100 parts by weight of epoxy resin (manufactured by Yuka-Shell Epoxy Company, "Epicoat 828"), 2 parts by weight of tris(dimethylaminoethyl)phenol and 100 parts by weight of toluene as the resin of the resin binder, add The conductive fine particles obtained in Example 1 were thoroughly mixed using a planetary mixer, and then coated on a release film to a thickness of 7 μm after drying, and toluene was evaporated to obtain an adhesive film containing conductive fine particles. In addition, in terms of the compounding amount of conductive fine particles, the content in the film is 50,000 particles / cm 2 .

[0079] Then, the adhesive film containing conductive fine particles and the adhesive film not containing conductive fine particles were bonded together at room temperature to obtain an anisotropic conductive film having a thickness of 17 μm and a two-layer structure.

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PUM

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Abstract

Conductive microparticles that have a gold coating of low porosity, exhibiting high electrical conductivity; a process for producing the conductive microparticles, that excels in the stability of plating bath, being of non-cyanide type; and an anisotropic conductive material making use of the conductive microparticles. There are provided conductive microparticles having a foundation nickel coating at its surface furnished with a gold coating by electroless gold plating, which conductive microparticles when subjected to an elution test using nitric acid, exhibit a nickel elution of 30 to 100 [mu]g / g. Further, there is provided a process for producing the conductive microparticles, comprising causing a reducing agent having the property of inducing an oxidation reaction on the surface of a foundation nickel coating but not inducing any oxidation reaction on the surface of gold being a deposited metal to be present on the surface of a foundation nickel coating and realizing reduction of sodium chloroaurate to thereby effect gold deposition. Still further, there is provided an anisotropic conductive material having the above conductive microparticles dispersed in a resin binder.

Description

technical field [0001] The present invention relates to conductive fine particles, a method for producing conductive fine particles, and an anisotropic conductive material, and more specifically, to conductive fine particles having a gold coating with few pores and excellent conductivity, a method for producing the conductive fine particles, And an anisotropic conductive material using the conductive fine particles. Background technique [0002] Conventionally, metal particles such as gold, silver, and nickel have been used as conductive particles, but due to their large specificities and uncertain shapes, they cannot be uniformly dispersed in binder resins, resulting in poor conductivity of anisotropic conductive materials. all. [0003] In contrast, it has been reported that electroless plating is used to plate conductive particles of metal films such as nickel or nickel-gold on the surface of non-conductive particles such as resin particles and glass beads as core partic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/00H01B1/22H01B13/00B22F1/02C23C18/31C23C18/44H01R11/01B22F1/10B22F1/18
CPCH01R13/03C23C18/42B22F1/0059H01B1/22C23C18/44B22F1/025H05K3/323C23C18/1651B22F1/10B22F1/18H01B5/00
Inventor 久保田敬士
Owner SEKISUI CHEM CO LTD