Collector grid, electrode structures and interrconnect structures for photovoltaic arrays and methods of manufacture

Abstract

The invention teaches novel structure and methods for producing electrical current collectors and electrical interconnection structure. Such articles find particular use in facile production of modular arrays of photovoltaic cells. The current collector and interconnecting structures may be initially produced separately from the photovoltaic cells thereby allowing the use of unique materials and manufacture. Subsequent combination of the structures with photovoltaic cells allows facile and efficient completion of modular arrays. Methods for combining the collector and interconnection structures with cells and final interconnecting into modular arrays are taught

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a Continuation-in-Part of U.S. patent application Ser. No. 11 / 824,047 filed Jun. 30, 2007, entitled Collector Grid, Electrode Structures and Interconnect Structures for Photovoltaic Arrays and other Optoelectric Devices, which is a Continuation-in-Part of U.S. application Ser. No. 11 / 404,168 filed Apr. 13, 2006, entitled Substrate and Collector Grid Structures for Integrated Photovoltaic Arrays and Process of Manufacture of Such Arrays, which is a Continuation-in-Part of U.S. application Ser. No. 10 / 776,480 filed Feb. 11, 2004, entitled Methods and Structures for the Continuous Production of Metallized or Electrically Treated Articles, now abandoned, which is a Continuation-in-Part of U.S. patent application Ser. No. 10 / 682,093 filed Oct. 8, 2003 entitled Substrate and Collector Grid Structures for Integrated Series Connected Photovoltaic Arrays and Process of Manufacture of Such Arrays, which is a Continuation-in-Part...

AI Technical Summary

Benefits of technology

[0090]A further object of the present invention is to provide improved processes whereby interconnected photovoltaic modules can be economically mass produced.

[0093]The current invention provides a solution to the stated needs by producing the active photovoltaic cells and interconnecting structures separately and subsequently combining them to produce the desired interconnected array or module. One embodiment of the invention contemplates deposition of thin film photovoltaic junctions on metal foil substrates which may be heat treated following deposition if required in a continuous fashion without deterioration of the metal support structure. In a separate operation, interconnection structures are produced. In an embodiment, interconnection structures are produced in a continuous roll-to-roll fashion. In an embodiment, the interconnecting structure is laminated to the foil supported photovoltaic cell and conductive connections are applied to complete the array. Application of a separate interconnection structure subsequent to cell manufacture allows the interconnection structures to be uniquely formulated using polymer-based materials. Interconnections are achieved without the need to use the expensive and intricate material removal operations currently taught in the art to achieve interconnections.

Problems solved by technology

Despite good conversion efficiencies and long-term reliability, widespread energy collection using single-crystal silicon cells is thwarted by the high cost of single crystal silicon material and interconnection processing.

Despite significant improvements in individual cell conversion efficiencies for both single crystal and thin film approaches, photovoltaic energy collection has been generally restricted to applications having low power requirements.

Thus a challenge to implementing bulk power systems is the problem of economically collecting the photogenerated power from an expansive surface.

Thus the conductive surface itself is limited in its ability to collect and transport current and efforts must be made to minimize resistive losses in transport of current through the TCO layer.

This problem increases in severity as individual cell sizes increase.

The wire approach requires positioning and fixing of multiple fine fragile wires which makes mass production difficult and expensive.

Silver pastes are expensive and require high fusion temperatures which not all photovoltaic semiconductors can tolerate.

However, this ink approach requires the use of relatively expensive inks because of the high loading of finely divided silver particles.

In addition, batch printing on the individual cells is laborious and expensive.

However, it is readily recognized that making effective, durable series connections among multiple small cells can be laborious, difficult and expensive.

The cell connections often involve tedious manual operations such as soldering and handling of multiple interconnected cells.

Next, unwieldy flexible leads from the terminal cells must be directed and secured in position for outside connections, again a tedious operation.

Finally, weight and assembly concerns limit the ultimate size of the module.

These limitations impede adoption of the modules for large scale power generation.

In addition, many monolithic approaches are not compatible with the use of a current collector grid and therefore cell sizes (in the direction of current flow) are constrained.

These small cell widths demand very fine interconnect area widths, which dictate delicate and sensitive techniques to be used to electrically connect the top TCO surface of one cell to the bottom electrode of an adjacent series connected cell.

Furthermore, achieving good stable ohmic contact to the TCO cell surface has proven difficult, especially when one employs those sensitive techniques available when using the TCO only as the top collector electrode.

However, a challenge still remains regarding subdividing the expansive films into individual cells followed by interconnecting into a series connected array.

The electrical resistance of thin vacuum metallized layers may significantly limit the active area of the individual interconnected cells.

However, the subsequent conversion to an interconnected module of multiple cells has proven difficult, in part because the metal foil substrate is electrically conducting.

These operations add considerably to the final interconnected array cost.

These material removal techniques are troublesome for a number of reasons.

First, many of the chemical elements involved in the best photovoltaic semiconductors are expensive and environmentally unfriendly.

This removal subsequent to controlled deposition involves containment, dust and dirt collection and disposal, and possible cell contamination.

This is not only wasteful but considerably adds to expense.

Secondly, the removal processes are difficult to control dimensionally.

Thus a significant amount of the valuable photovoltaic semiconductor is lost to the removal process.

Ultimate module efficiencies are further compromised in that the spacing between adjacent cells grows, thereby reducing the effective active collector area for a given module area.

A further issue that has impeded adoption of photovoltaic technology, especially for bulk power collection in the form of solar farms, involves installation of multiple modules over expansive regions of surface.

First, traditional modules are limited in size due to weight and manufacturing constraints.

These are intrinsically tedious manual operations.

The process is very sensitive to processing variables used to fabricate the plastic substrate, limiting applications to carefully prepared parts and designs.

In addition, the many steps employing harsh chemicals make the process intrinsically costly and environmentally difficult.

Finally, the sensitivity of ABS plastic to liquid hydrocarbons has prevented certain applications.

This is a misnomer in the strict sense, since ABS (and other nonconductive polymers) are incapable of accepting an electrodeposit directly and must be first metallized by other means before being finally coated with an electrodeposit.

None of these attempts at simplification have achieved any recognizable commercial application.

However, attempts to make an acceptable electroplateable polymer using the relatively small metal containing fillers alone encounter a number of barriers.

First, the most conductive fine metal containing fillers such as silver are relatively expensive.

The loadings required to achieve the particle-to-particle proximity to achieve acceptable conductivity increases the cost of the polymer / filler blend dramatically.

The metal containing fillers are accompanied by further problems.

They tend to cause deterioration of the mechanical properties and processing characteristics of many resins.

This significantly limits options in resin selection.

A required heavy loading of metal filler severely restricts ability to manipulate processing properties in this way.

A further problem is that metal fillers can be abrasive to processing machinery and may require specialized screws, barrels, and the like.

Another major obstacle involved in the electroplating of electrically conductive polymers is a consideration of adhesion between the electrodeposited metal and polymeric substrate (metal / polymer adhesion).

Despite being electrically conductive, a simple metal-filled polymer offers no assured bonding mechanism to produce adhesion of an electrodeposit since the metal particles may be encapsulated by the resin binder, often resulting in a resin-rich “skin”.

However, here the metal particles are generally encapsulated by the resin binder, often resulting in a resin rich “skin”.

For the above reasons, electrically conductive polymers employing metal fillers have not been widely used as bulk substrates for electroplateable articles.

An additional physical obstacle confronting practical electroplating onto electrically conductive polymers is the initial “bridge” of electrodeposit onto the surface of the electrically conductive polymer.

However, if the contact resistance is excessive or the substrate is insufficiently conductive, the electrodeposit current favors the rack tip to the point where the electrodeposit will not bridge to the substrate.

Moreover, a further problem is encountered even if specialized racking or cathodic contact successfully achieves electrodeposit bridging to the substrate.

The conductive polymeric substrate may be relatively limited in the amount of electrodeposition current which it alone can convey.

In a fashion similar to the bridging problem discussed above, the electrodeposition current favors the electrodeposited metal and the lateral growth can be extremely slow and erratic.

This restricts the size and “growth length” of the substrate conductive pattern, increases plating costs, and can also result in large non-uniformities in electrodeposit integrity and thickness over the pattern.

Further, an electrically conductive polymer “seed” pattern defining the traces is often relatively thin, less than about 25 micrometers, and therefore may have relatively low current carrying capacity.

These factors of course often work against achieving the desired result.

A fundamental problem remaining unresolved by the Adelman teaching is the relatively high resistivity of carbon loaded polymers.

Thus, the electrodeposit bridging and coverage rate problems described above remained unresolved by the Adelman teachings.

Said material addition may have insignificant affect on the current carrying capacity of the structure (i.e. it does not appreciably reduce resistivity or increase thickness).

One or more growth rate accelerators may be present in a directly electroplateable resin (DER) to achieve combined, often synergistic results.

The limited thickness of the ink reduces the current carrying capacity of this trace thus preventing direct electroplating in a practical manner.

Due to multiple performance problems associated with their intended end use, the instant inventor is unaware of any recognizable commercial success for attempts to directly electroplate electrically conductive polymers in applications intended to produce decorative “bright” electroplated objects.

One readily recognizes that the demand for such functional applications for electroplated articles is relatively recent and has been particularly explosive during the past decade.

Treatment of both sides of the substrate in a roll to roll process may adversely affect the surface of the DER material and may lead to deterioration in plateability.

For example, it has been observed that primers on both sides of a roll of PET film have adversely affected plateability of DER inks printed on the PET.

Such selective positioning of metals can often be expensive and difficult.

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