Patterning device
a technology of a patterning device and a ring, which is applied in the field of patterning devices, can solve the problems of limited methods in the minimum amount of volume, high cost of inkjet systems, and inability to achieve high-speed printing, and achieve the effect of facilitating the movement towards and inside the hydrophilic elements
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example 1
On Single Crystal Array Formation
[0117]An aqueous NaCl solution (5 M) or was transported 20 times over an array of hydrophilic-in-hydrophobic micropatches, resulting in an array of single NaCl crystals (FIG. 4).
example 2
Fabrication of an Array for Printing of Oligonucleotides and Aptamer Selection
[0118]Digital microfluidic chips are fabricated as follows: glass wafers are cleaned in acetone and isopropyl alcohol for 5 minutes. A thin layer of chromium (100 nm) is then deposited by magnetron sputtering (Balzers BAE 370, Pfaffikon, Switzerland). The chromium layer is patterned by standard photolithographic processes using 51818 positive photoresist, chrome-on-glass photomasks, and wet etching using Cyantec CR-7 chromium etchant. Next, chips are cleaned in 02-plasma (150 mtorr, 100 W) and primed with silane A174 before being coated with a layer of Parylene-C (3 μm) which was deposited using chemical vapor deposition (AL 200, Plasma Parylene Coating Services, Rosenheim, Germany). A thin layer of TEFLON-AF® (˜200 nm thickness, 3% w / w in Fluorinert FC-40) is subsequently spincoated (1200 rpm) on top of the Parylene-C layer, and baked for 5 minutes at 110° C., and 5 minutes at 200° C. Crenellated actuatio...
example 3
Hydrophilic-in-Hydrophobic Microwells
[0167]Hydrophilic-in-hydrophobic microwells were fabricated as follows. Glass slides were coated with TEFLON-AF® to a thickness of 3.25 μm. Next, a thin Parylene-C membrane (500 nm) was deposited on top of the TEFLON-AF® surface by using chemical vapor deposition. Subsequently, an aluminum hard mask (50 nm thickness) was deposited on top of the polymeric stack by thermal evaporation. This aluminum hard mask was patterned by standard photolithography and wet etching to obtain an array of circular features having 4 μm diameter. The exposed areas of the protective Parylene-C mask and TEFLON-AF® were then etched with reactive ion etching using 02-plasma before the protective Parylene-C mask was removed by mechanical peeling.
[0168]The glass slide containing these hydrophilic-in-hydrophobic micropatterns was subsequently used as a top plate of a double-plate digital microfluidic chip based on electrowetting-on-dielectric (FIG. 8).
[0169]For demonstratin...
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