The invention relates to the technical field of
chip packaging, in particular to a rib
cutting forming method of an IDF
lead frame. Comprising the following steps that S1, reverse feeding is conducted, specifically, a frame product to be processed is fed in the mode that pins face downwards, and the product is placed at the feeding position of a conveying belt; s2, automatically detecting an image for the first time: acquiring image information of a product by an industrial camera, comparing the image information with information of a standard template after
processing, and judging a feeding direction and the number of pins; s3, the waste plastic of the glue injection opening is punched in a segmented mode, specifically, a segmented
tool bit is adopted for a rib
cutting stamping die, and the waste plastic of the glue injection opening is removed in a segmented mode; and S4,
cutting off connecting ribs and pin lengths: pressing down the
punching die, cutting off the connecting ribs and waste plastics of adjacent pins in a non-crossed pin area in the frame product, cutting off the connecting ribs and waste plastics of the adjacent pins in a crossed pin area, and synchronously cutting off redundant pin lengths of the adjacent pins. Compared with the prior art, breakage of a plastic
package body during generation is reduced, the problem of pin pseudo
soldering caused by burrs of a formed bottom plate is solved, the production efficiency is improved, and the production cost is reduced.