A surface paste fuse of nano carborundum-alumina porcelain base and its making method

A nano-silicon carbide and alumina ceramic technology, applied in the manufacture of fuses, emergency protection devices, electrical components, etc., can solve the problems of reducing the high voltage resistance of fuses, incomplete fuse blowing, etc., to reduce the size and improve the yield. , the effect of good thermal conductivity and toughness

Active Publication Date: 2009-06-03
NANJING SART SCI & TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Quartz glass has a strong ability to withstand high pressure, but it will volatilize when the fuse is blown at high temperature, causing micropores to appear on the surface of the alumina ceramic substrate, and the molten metal components of the fuse body enter the micropores to form a layer with a certain conductivity. Leakage current layer, resulting in incomplete blowing of the fuse
The glass layer with a low softening temperature is used as a fusing aid material (printed on the fuse layer) to make the fuse fuse at a lower temperature, thereby reducing the volatilization of silicon oxide on the substrate surface during fusing, inhibiting the formation of a leakage layer, and improving Reliability of complete fusing; but such a change also reduces the high voltage withstand capability of the fuse

Method used

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  • A surface paste fuse of nano carborundum-alumina porcelain base and its making method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] Preparation of Al by Heterogeneous Precipitation 2 o 3 , that is, when adding an appropriate amount of AlCl 3 ·6H 2 O is added to deionized water, ammonia water is added to generate Al(OH) 3 Precipitation, the SiC powder (the particle diameter produced by the Beijing Chemical Industry Institute of the Chinese Academy of Sciences is 30nm) is uniformly dispersed in the solution, and the Al is obtained by filtering, drying, calcining, ball milling and other processes 2 o 3 The powder-wrapped SiC particle composite material is taken out and molded by a grinding tool to prepare a square sheet of 60mm×49.5mm and a thickness of 0.8mm. Divide the ceramic sheet into 1.6mm x 0.8mm rectangular pieces (suitable for 0603 chip fuses) by using the scoring line of the abrasive tool, and perform hot pressing and sintering at 1650-1750 degrees Celsius to obtain a sintered body. The used pressure of hot pressing is 30Mpa, and the holding time is 2 hours. The content of SiC in the pr...

Embodiment 2

[0076] SiC-Al 2 o 3 The preparation of the composite nano-powder is the same as that in Example 1. After the powder is formed by static pressure with an abrasive tool, no lines are drawn, and it is directly hot-pressed and sintered. The other processes are the same as in Example 1, except that a laser is used for slicing to prepare small rectangular pieces of 1.6mm x 0.8mm through vertical and horizontal cutting. The manufactured 0603 type fuse screened out 0.8% of the unqualified appearance size, 6.5% of the unqualified film thickness of the printed circuit screened out, and 100% of qualified size fuses in the bending test (GB9364 standard), and It can 100% meet the experimental test conditions of "fulcrum distance 9cm, 1mm / s bending 2cm" which is twice the standard 9364. The ceramic substrate fuse of the present invention does not break or crack when the breaking test is performed at a voltage of 63V. When the chip fuse is broken at 63V, more than 50% of the fuses are bro...

Embodiment 3

[0078] The material preparation process is the same as in Example 2. The difference in the process of preparing a chip fuse is that it is prepared into a small rectangular piece of 1.6mm x 0.8mm by mechanical punching through longitudinal and transverse cutting, and the rest of the steps are the same. The produced 0603 type fuse screens out 8% of the unqualified appearance size, 8.5% of the unqualified film thickness of the printed circuit screened out, and 100% of fuses with qualified dimensions in the bending test (GB9364 standard). 100% meet the experimental test conditions of "fulcrum distance 9cm, 1mm / s bending 2cm" (twice the standard 9364 level). The 0603 chip fuse prepared under the process conditions did not appear to be broken or broken when the fuse was broken in the breaking test at a voltage of 63V. After breaking, the insulation resistance was above 200MΩ, twice the rated current (the rated current of this example was 5A). The average fusing time was 4.1 seconds....

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Abstract

This invention relates to one nanometer carbon silicon to alumina compound ceramics materials for base slice element surface fuse and its process method, wherein, the nanometer carbon silicon to alumina ceramics base slice surface fuse comprises metal fuse wire, insulation layer, sealing layer and metal terminal; the invention is characterized by the following: the said ceramics base slice is made from nanometer alumina for 70 to 97 percent mole and nanometer carbon silicon for 1 to 30 percent moles.

Description

technical field [0001] The invention is an application of nanotechnology in the field of preparation of electronic components, and provides a surface-mounted chip fuse with nano-silicon carbide-alumina composite ceramic material as the main component of the substrate and a preparation method thereof. Background technique [0002] The surface mount chip fuse is composed of substrate 1, metal fuse 2, insulating layer 3, encapsulation layer 4 and metal terminal 5, such as figure 1 . Among them, the substrate is the supporting structure and main component of the surface mount chip fuse (SMD chip fuse), and its performance directly affects the mechanical properties such as hardness and toughness of the product, as well as thermal and electrical properties such as thermal conductivity and insulation resistance. Existing surface mount chip fuses are usually based on materials such as alumina ceramics and high polymers. Ceramic material substrates have good insulation and heat resi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H85/04H01H85/05H01H85/17H01H69/02C04B35/10
Inventor 邓昱崔旭高韩小兵南西荣杨漫雪
Owner NANJING SART SCI & TECH DEV
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