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Alloy electrod matched with cobalt antimonide thermoelectric component and one-step process connecting technology

A technology of alloy electrodes and thermoelectric elements, which is applied in the manufacture/processing of thermoelectric devices, thermoelectric device parts, thermoelectric device junction lead-out materials, etc., which can solve the problems of high energy consumption, poor oxidation resistance, electrical conductivity and thermal conductivity advanced questions

Active Publication Date: 2007-08-22
中科西卡思(苏州)科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of Ti as an electrode are relatively high electrical and thermal conductivity, high energy consumption, and poor oxidation resistance

Method used

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  • Alloy electrod matched with cobalt antimonide thermoelectric component and one-step process connecting technology
  • Alloy electrod matched with cobalt antimonide thermoelectric component and one-step process connecting technology
  • Alloy electrod matched with cobalt antimonide thermoelectric component and one-step process connecting technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] The thickness of the molybdenum-copper electrode is 0.5mm. The surface is first sandblasted in a box-type sandblasting machine for 2 minutes, and then ultrasonically treated for 7 minutes. The molybdenum-copper electrode is placed in a Φ10 graphite mold, and the surface of the electrode is uniformly covered with a particle size of 500 mesh. Titanium powder, followed by uniform pre-pressing of cobalt antimonide thermoelectric materials, pre-pressing pressure 10MPa, and then SPS sintering, vacuum degree 1Pa, sintering pressure 30 MPa, heating rate 80 ℃ / min, sintering temperature 520 ℃, and then Keep warm for 10 minutes, and the sintering is completed.

[0016] The resulting Mo-Cu electrode / CoSb 3 No cracks were found in the block after scanning electron microscopy (see Figure 2). Electron probe analysis showed that there was no obvious interfacial diffusion at the interface between the cobalt antimonide-based thermoelectric material and the electrode. The phenomenon of...

Embodiment 2

[0018] The thickness of the molybdenum-copper electrode is 1mm. The surface is first sandblasted in a box-type sandblasting machine for 2 minutes, and then ultrasonically treated for 10 minutes. The molybdenum-copper electrode is placed in a Φ10 graphite mold, and the particle size of 75μm is evenly spread on the surface of the electrode. Titanium powder, and then evenly pre-press the cobalt antimonide thermoelectric material, the pre-press pressure is 10MPa, and then carry out SPS sintering, the vacuum degree is 7Pa, the sintering pressure is 50MPa, the heating rate is 120℃ / min, and the sintering temperature is 560℃, and then Keep warm for 20min.

[0019] The resulting Mo-Cu electrode / CoSb 3 No cracks were found in the block after scanning electron microscope observation. Electron probe analysis showed that there was no obvious interfacial diffusion between the cobalt antimonide-based thermoelectric material and the electrode interface. After 500 hours of 500°C thermal fatigu...

Embodiment 3

[0021]The thickness of the molybdenum-copper electrode is 3mm. The surface is first sandblasted in a box-type sandblasting machine for 2 minutes, and then ultrasonically treated for 10 minutes. The molybdenum-copper electrode is placed in a Φ10 graphite mold, and the surface of the electrode is uniformly covered with titanium with a particle size of 30 μm. powder, and then evenly pre-press the cobalt antimonide thermoelectric material, the pre-press pressure is 10MPa, and then carry out SPS sintering, the vacuum degree is 15Pa, the sintering pressure is 60MPa, the heating rate is 150°C / min, the sintering temperature is 600°C, and then heat preservation for 40min .

[0022] The resulting Mo-Cu electrode / CoSb 3 No cracks were found in the block after scanning electron microscope observation, and there was no obvious interface diffusion between the cobalt antimonide-based thermoelectric material and the electrode interface by electron probe analysis. After 500 hours of 500°C ther...

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Abstract

This invention relates to a one-step connection technology for the thermoelectric element of CoSb base and an alloy electrode (flow connector) matched to it characterizing that said alloy electrode is made of Mo-Cu serial alloy advantaged that related CTE can be designed freely, the electrode is made of Mo-Cu alloy in the thickness of 0.5-3mm, and the preparation character is a one-step connection method by utilizing discharge plasma sinter to connect a MoCu alloy electrode material and a CoSb thermoelectric material at a Ti transition layer with the grain size of 30-75mum to connect the interfaces very well without evident resistance transition.

Description

technical field [0001] The present invention relates to a kind of cobalt antimonide (CoSb 3 ) thermoelectric element matching alloy electrode and one-step connection process, more precisely, the present invention relates to the electrode selection of cobalt antimonide-based thermoelectric device and the connection process between electrode and thermoelectric material, which belongs to the technical field of electrode selection and preparation of thermoelectric components . Background technique [0002] Thermoelectric material is a functional material that converts thermal energy and electrical energy. It uses its own Seebeck effect to directly convert thermal energy into electrical energy. Thermoelectric power generation components made of thermoelectric materials do not require mechanical moving parts and do not undergo chemical reactions. , has the advantages of long life, high reliability, and no pollution to the environment. In addition to being used in the aerospace fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/20H01L35/08H01L35/34H10N10/854H10N10/01H10N10/817
Inventor 陈立东赵德刚李小亚赵雪盈周燕飞柏胜强
Owner 中科西卡思(苏州)科技发展有限公司
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