Cashew phenol modified linetype phenolic resin and method for manufacturing composite laminated board

Abstract

The invention relates to a cashew phenol modified linear formaldehyde-phenol resin and a method for manufacturing composite basal layer clamping plate in the roofing copper production method technique field. The material of the cashew phenol modified linear formaldehyde-phenol resin is cashew phenol, phenol, formaldehyde, acid catalyst and the solvent. The method comprises the following steps: 1, manufacturing the cashew phenol modified linear formaldehyde-phenol resin; 2, preparing resin adhesive by mixing the modified linear formaldehyde-phenol resin, epoxide resin, fire retardant and brightener; 3, dipping the wood-pulp paper with the resin adhesive; drying the paper base-material sheet; getting the paper base semi-solid sheet; formulating glass cloth base-material sheet, copper foil and the paper base semi-solid sheet together; heating; increasing the pressure; manufacturing the composite basal layer clamping plate. The cashew phenol modified linear formaldehyde-phenol resin is provided with the good fire-resisting property, the good punching property and the high planeness; and the wiring board is provided with the high fire-resisting property, which is fit for leadless reflow soldering.

Description

1. Technical field [0001] The invention relates to a cashew nut phenol modified novolac resin and a method for manufacturing a composite base laminate, belonging to the technical field of copper-clad laminate production methods. 2. Background technology [0002] Copper Clad Laminate (referred to as Copper C1ad Laminate, CCL) is the main material for manufacturing printed circuit boards (PCB). Therefore, it is also an indispensable basic electronic material for any electronic machine or component. [0003] Composite base copper clad laminate has good machinability, its mechanical strength, dielectric properties, water absorption, ion migration resistance, etc. are superior to paper base copper clad laminate, and its basic characteristics are equivalent to cloth base copper clad laminate, and the cost is lower In recent years, the international demand for composite-based copper-clad laminates has been increasing year by year. [0004] The manufacturing process of composite b...

AI Technical Summary

Problems solved by technology

[0005] At present, with the lightness, thinness, miniaturization and lead-free of civil electronic devices, the performance requirements of composite-based copper clad laminates are getting higher and higher. The performance of thermoplastic phenolic resins used in production has been difficult to meet. The demand for high-performance copper-clad laminates, the production of composite-based copper-clad laminates cannot meet the performance requirements of electronic information products such as computers, industrial electrical power supplies, and lighting facilities for circuit boards in terms of heat resistance, flatness, and punching. Suitable for lead-free reflow soldering, etc.