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Conductive, plasma-resistant member

一种等离子体、气体等离子体的技术，应用在半导体/固态器件制造、电气元件、离子注入镀覆等方向，能够解决经济上和技术困难、缺乏实际效用等问题，达到抑制颗粒污染、改善耐受性的效果

Inactive Publication Date: 2008-03-05
SHIN ETSU CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is economically and technically very difficult to apply the method to real components
Therefore, this approach lacks sufficient practical utility

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Thermal spray powders were prepared as follows: Weighed 15 grams of disk atomized yttrium metal powder with an iron content of 352 ppm and 485 grams of yttrium oxide powder and mixed these powders in a V-blender for 1 hour. Next, the aluminum alloy substrate with a size of 100 × 100 × 5 mm was degreased with acetone and then roughened on one side by sandblasting with alumina grit. The thermal spray powder is then sprayed onto the substrate by a plasma sprayer using argon and hydrogen as the plasma gas, with an output of 40 kW, a spray distance of 120 mm and a powder feed rate of 20 g / min, thus forming a thickness of approximately 200 μm coating, thus giving a test sample.

[0036] Another test sample was formed in the same manner as above, except that an alumina substrate was used instead of an aluminum alloy substrate. Thermal sprayed coatings deposited on alumina substrates were dissolved in hydrochloric acid and the resulting solutions were analyzed by inductively c...

Embodiment 2

[0038] Thermal spray powders were prepared as follows: 25 grams of gas-atomized yttrium metal powder with an iron content of 120 ppm and 475 grams of yttrium oxide powder were weighed and these powders were mixed in a V-blender for 1 hour. Next, an aluminum alloy substrate with a size of 100 × 100 × 5 mm was degreased with acetone, and then thermal spray powder was sprayed onto the substrate by a plasma sprayer using argon and hydrogen as the plasma gas, with an output of 40 kW, spraying With a distance of 120 mm and a powder feed rate of 20 g / min, a coating with a thickness of approximately 200 μm was formed to give a test sample.

[0039] Another test sample was formed in the same manner as above, except that an alumina substrate was used instead of an aluminum alloy substrate. The thermal sprayed coating deposited on the alumina substrate was dissolved in hydrochloric acid, and the resulting solution was analyzed by ICP emission spectroscopy, whereby the coating was found t...

Embodiment 3

[0041] Thermal spray powders were prepared as follows: 50 grams of rotating electrode atomized metal yttrium powder with an iron content of 80 ppm and 450 grams of yttrium oxide powder were weighed and these powders were mixed in a V-shape blender for 1 hour. Next, an aluminum alloy substrate with a size of 100 × 100 × 5 mm was degreased with acetone, and then thermal spray powder was sprayed on the substrate by a plasma sprayer using argon and hydrogen as plasma gas, with an output of 40 kW, spraying The distance was 120 mm and the powder feed rate was 20 g / min, which resulted in a coating with a thickness of approximately 200 μm, giving test samples.

[0042] Another test sample was formed in the same manner as above, except that an alumina substrate was used instead of an aluminum alloy substrate. The thermal sprayed coating deposited on the alumina substrate was dissolved in hydrochloric acid, and the resulting solution was analyzed by ICP emission spectroscopy, whereby it...

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PUM

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Abstract

An electrically conductive, plasma-resistant member adapted for exposure to a halogen-based gas plasma atmosphere includes a substrate having formed on at least part of a region thereof to be exposed to the plasma a thermal spray coating composed of yttrium metal or yttrium metal in admixture with yttrium oxide and / or yttrium fluoride so as to confer electrical conductivity. Because the member is conductive and has an improved erosion resistance to halogen-based corrosive gases or plasmas thereof, particle contamination due to plasma etching when used in semiconductor manufacturing equipment or flat panel display manufacturing equipment can be suppressed.

Description

technical field [0001] The present invention relates to an electrically conductive, plasma-resistant component capable of resisting attack by a halogen-based plasma and having a coating providing electrical conductivity, wherein at least a part of the component to be exposed to the plasma has a coating formed by thermal spraying thereon, The coating is made from metal yttrium, a mixture of metal yttrium and yttrium oxide, a mixture of metal yttrium and yttrium fluoride, or a mixture of metal yttrium and yttrium oxide and yttrium fluoride. Such members may be suitable for use, for example, in semiconductor manufacturing equipment or in flat panel display manufacturing equipment (for example, equipment used to manufacture liquid crystal displays, organic electroluminescent devices, or inorganic electroluminescent devices) exposed to plasma components or parts. Background technique [0002] In order to prevent workpieces from being contaminated by impurities, semiconductor man...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C4/00C23C14/00C23C16/50C23F4/00H01L21/3065
CPCC23C4/06C23C4/08Y10T428/31678C23C4/11C23C4/137
Inventor 前田孝雄牧野勇一中野瑞植原一郎
Owner SHIN ETSU CHEM CO LTD
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