Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder

A lead-free solder, rosin-type technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of solder joint corrosion, excessive residue after welding, etc., and achieve good soldering performance and excellent Welding effect, no irritating smell effect

Inactive Publication Date: 2008-04-09
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a kind of higher boil

Method used

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  • Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Succinic acid 13

[0018] Polyethylene glycol 2000 5

[0019] Diethylene glycol diethyl ether 10

[0020] Glycerol 12

[0021] Hydrogenated castor oil 3

[0022] Paraffin 2

[0023] Triethanolamine 5

[0024] Octylphenol polyoxyethylene ether 2

[0025] polymerized rosin 48

[0026] Specific preparation method: The specific preparation method is a conventional method. First add the solvent in a reactor with a stirrer, add the activator after weighing the reactor, heat and control the temperature at 150 ° C, stir to dissolve it completely, add polymerized rosin and wait After it is completely dissolved, add stabilizer, paste forming agent, thixotropic agent, surfactant, and then add corrosion inhibitor, stir until the solution is clear and transparent, let it stand, and cool at room temperature, that is, rosin-type halogen-free no-cleaning for lead-free solder wire flux. Then heat the flux and press it into the tin wire with an air press, and finally draw it into...

Embodiment 2

[0028] Adipic acid 15

[0029] Glutaric acid 3

[0030] Octylphenol ethoxylate 0.5

[0031] Polyethylene glycol 2000 6

[0032] Diethylene glycol monoethyl ether 5

[0033] Ethylene glycol 5

[0034] Hydrogenated castor oil 5

[0035] Triethylamine 0.5

[0036] Paraffin 3

[0037] polymerized rosin 30

[0038] Lead-free rosin 27

[0039] Preparation method is identical with example 1.

Embodiment 3

[0041] Sebacic acid 12

[0042] Nonylphenol ethoxylates 4

[0043] Polyethylene glycol 4000 1

[0044] Diethylene glycol monocaprylyl ether 10

[0045] Tetrahydrofurfuryl alcohol 5

[0046] Hydrogenated castor oil 0.5

[0047] Benzotriazole 4

[0048] Paraffin 0.5

[0049] Water white rosin 20

[0050] Fully Hydrogenated Rosin 43

[0051] The preparation method is the same as in Example 1.

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Abstract

The invention relates to a halogen-free non-cleaning soldering flux for a lead-free solder wire, and belongs to the soldering flux field. According to the weight ratio, the invention comprises the following elements that: 4 to 18 wt percent of organic acid active agent, 10 to 30 wt percent of organic solvent, 1 to 6 wt percent of pasting agent, 0.2 to 3wt percent of stabilizer, 0.5 to 5wt percent of thixotropic agent, 0.5 to 4wt percent of surface active agent, 0.5 to 5wt percent of rust inhibition, and the rest comprises colophony. The invention includes no halogen, the speculummetal has no breakthrough after being welded, the insulation resistance is high, and the soldering performance is good, the problem of the potential solder joint short circuit caused by the soldering flux of the prior welding wire that the colophony content is too high, the smoke is large and the derelict is easy to be flaked away is solved, the invention is smooth and has no absorption of moisture under normal temperature, no cleaning is required after being welded, and the welding requirement of normal product can be met.

Description

technical field [0001] The invention relates to a soldering flux, which is especially suitable for a rosin-type halogen-free no-cleaning flux for lead-free solder wires. Background technique [0002] Soldering is an important process in the assembly process of electronic products. The quality of welding directly affects the performance of electronic circuits and electronic devices. Excellent welding quality can provide good stability and reliability for the circuit, and poor welding methods will cause damage to components, which will bring great difficulties to testing, and sometimes leave hidden dangers, affecting the reliability of electronic equipment. As the complexity of electronic products increases, more and more components are used. Some electronic products (especially some large electronic equipment) use hundreds or even thousands of components, and the number of solder joints is tens of thousands. And a bad solder joint will affect the reliability of the entire p...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 雷永平李国伟夏志东周永馨徐广臣徐冬霞张冰冰郭福史耀武
Owner BEIJING UNIV OF TECH
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