Micrometer silver-copper granule containing nano level surface structure and preparation and application thereof

A technology of surface structure and micron silver, which is applied in the field of micron silver-copper particles and its preparation, can solve problems such as inability to sinter filler particles, achieve stable and reliable product performance, easy process flow, and reduce surface sintering or melting temperature.

Inactive Publication Date: 2008-07-09
李伟强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, since the melting point of commonly used conductive filler metal silver powder exceeds 900°C, conventional solidification methods ca

Method used

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  • Micrometer silver-copper granule containing nano level surface structure and preparation and application thereof

Examples

Experimental program
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Example Embodiment

[0023] Example 1

[0024] At room temperature, 1 kg of flake sterling silver powder (99.5%) with an average particle size of 30 microns and 2 g (0.5%) of 3,4-dihydroxyphenylpropionic acid were used. Stir in 10 liters of ethanol solution at 100 rpm for 30 minutes, then add 17 g of silver nitrate and 4 g of sodium borohydride; continue to stir at 100 rpm for 60 minutes. The silver powder is filtered out, the powder liquid is removed from the solvent by a centrifuge at 500 rpm, and the excess solvent is removed by a vacuum pump to obtain a micron flake silver powder with a nano-surface structure.

[0025] As shown in FIG. 1 , the tiny particles displayed on the surface of the micron silver powder are nanometer silver powders produced by this process.

Example Embodiment

[0026] Example 2

[0027] At room temperature, 20 kg of flake silver-coated copper powder with an average particle size of 24 microns (the mass ratio of silver: copper is 5:5) was stirred in 200 liters of ethanol solution for 30 minutes. Then add 560 grams of silver chloride powder and 780 grams of citric acid; continue to stir for 120 minutes at a speed of 100 rpm. The powder solution is filtered through filter paper and drained to obtain micron flake silver-coated copper powder with nanometer surface structure.

Example Embodiment

[0028] Example 3

[0029] At room temperature, 5 kg of flake pure silver powder (99.5%) with an average particle size of 30 microns was dispersed in 50 liters of ethanol solution, stirred for 30 minutes, and 500 ml of ethanol solution containing 22 grams of acetaldehyde and 85 grams of nitric acid were added dropwise. Ag solution in 500 ml of ethanol and continued stirring at 100 rpm for 120 minutes. The powder solution is filtered through filter paper and drained to obtain micron flake silver powder with nanometer surface structure.

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Abstract

The invention discloses a micron silver-copper particle with a nanometer-grade surface structure and a preparing method and usage for the particle. The invention takes silver powder, sliver copper clad powder or silver-copper mixed power with micron dimensions as a carrying stroma; firstly disperses the silver powder, the sliver copper clad powder or the silver-copper mixed power body into a solvent, then uses a reducing compound to reduce silver salt into nanometer silver power and precipitate on the surface of the carrying stroma; and finally filters and dries to acquire the micron silver-copper particle with a nanometer-grade surface structure which can be used as fillings for preparing an electromagnetic shielding paint or an conductive adhesive. The invention utilizes a principle of chemical reducing to change the surface topography layout of the sliver-copper particle with nanometer-grade to lead the silver-copper particle to contain a nanometer-grade surface structure, thus reducing the surface sintering or melting temperature and improving the overall conductive performance.

Description

technical field [0001] The invention relates to the field of polymer conductive materials, in particular to a micron silver-copper particle containing a nanoscale surface structure and a preparation method thereof. Background technique [0002] Polymer conductive adhesive has replaced lead / tin soldering materials in many fields, and is widely used in electronics, information and other industries. However, compared with lead / tin soldering materials, the main disadvantages of polymer conductive adhesives are relatively low electrical conductivity and expensive precious metal fillers. [0003] The overall conductivity of the polymer conductive adhesive depends on three factors: the resistance of the metal filler itself, the contact resistance between the fillers, and the contact resistance between the conductive coating and the electronic components. Among them, the most effective way to reduce the overall resistance of polymer conductive adhesives is to reduce the contact res...

Claims

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Application Information

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IPC IPC(8): B22F1/00B22F9/20
Inventor 李伟强
Owner 李伟强
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