Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micrometer silver-copper granule containing nano level surface structure and preparation and application thereof

A technology of surface structure and micron silver, which is applied in the field of micron silver-copper particles and its preparation, can solve problems such as inability to sinter filler particles, achieve stable and reliable product performance, easy process flow, and reduce surface sintering or melting temperature.

Inactive Publication Date: 2008-07-09
李伟强
View PDF0 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, since the melting point of commonly used conductive filler metal silver powder exceeds 900°C, conventional solidification methods cannot fully sinter the filler particles.
All of the above make the wide application of isotropic polymer conductive materials face great challenges

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micrometer silver-copper granule containing nano level surface structure and preparation and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] At room temperature, 1 kilogram of flaky pure silver powder (99.5%) with an average particle size of 30 microns and 2 grams (0.5%) of 3,4-dihydroxyphenylpropionic acid. In 10 liters of ethanol solution, stir at a speed of 100 rpm for 30 minutes, then add 17 grams of silver nitrate and 4 grams of sodium borohydride; continue to stir for 60 minutes at a speed of 100 rpm. The silver powder is filtered out, the solvent is removed from the powder liquid through a centrifuge at 500 rpm, and the excess solvent is removed by a vacuum pump to obtain a micron flake silver powder with a nano surface structure.

[0025] As shown in Figure 1, the tiny particles displayed on the surface of the micron silver powder are nano silver powder produced by this process.

Embodiment 2

[0027] At room temperature, 20 kg of flake-shaped silver-coated copper powder (the mass ratio of silver: copper is 5: 5) with an average particle size of 24 microns was stirred in 200 liters of ethanol solution for 30 minutes. Then add 560 grams of silver chloride powder, 780 grams of citric acid; continue to stir for 120 minutes at a speed of 100 rpm. The powder liquid is filtered through filter paper and drained to obtain micron flake silver-coated copper powder with nanometer surface structure.

Embodiment 3

[0029] At room temperature, 5 kilograms of flaky pure silver powder (99.5%) with an average particle size of 30 microns were dispersed in 50 liters of ethanol solution, stirred for 30 minutes, while 500 milliliters of ethanol solution containing 22 grams of acetaldehyde and 85 grams of nitric acid were added dropwise. 500 milliliters of ethanol solutions of silver, continue to stir 120 minutes with the speed of 100 revs / min. The powder liquid is filtered through filter paper and drained to obtain micron flake silver powder with nanometer surface structure.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Sizeaaaaaaaaaa
Login to View More

Abstract

The invention discloses a micron silver-copper particle with a nanometer-grade surface structure and a preparing method and usage for the particle. The invention takes silver powder, sliver copper clad powder or silver-copper mixed power with micron dimensions as a carrying stroma; firstly disperses the silver powder, the sliver copper clad powder or the silver-copper mixed power body into a solvent, then uses a reducing compound to reduce silver salt into nanometer silver power and precipitate on the surface of the carrying stroma; and finally filters and dries to acquire the micron silver-copper particle with a nanometer-grade surface structure which can be used as fillings for preparing an electromagnetic shielding paint or an conductive adhesive. The invention utilizes a principle of chemical reducing to change the surface topography layout of the sliver-copper particle with nanometer-grade to lead the silver-copper particle to contain a nanometer-grade surface structure, thus reducing the surface sintering or melting temperature and improving the overall conductive performance.

Description

technical field [0001] The invention relates to the field of polymer conductive materials, in particular to a micron silver-copper particle containing a nanoscale surface structure and a preparation method thereof. Background technique [0002] Polymer conductive adhesive has replaced lead / tin soldering materials in many fields, and is widely used in electronics, information and other industries. However, compared with lead / tin soldering materials, the main disadvantages of polymer conductive adhesives are relatively low electrical conductivity and expensive precious metal fillers. [0003] The overall conductivity of the polymer conductive adhesive depends on three factors: the resistance of the metal filler itself, the contact resistance between the fillers, and the contact resistance between the conductive coating and the electronic components. Among them, the most effective way to reduce the overall resistance of polymer conductive adhesives is to reduce the contact res...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B22F1/00B22F9/20
Inventor 李伟强
Owner 李伟强
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com