Phase-change heat conductive material and preparation method thereof

Abstract

The invention discloses a phase-change heat conducting material and the preparation method, mainly comprising the silicone 10 to 40 wt percent, the ethylene propylene diene rubber 2 to 20 wt percent, the heat conducting powder 40 to 70 wt percent, the paraffin 5 to 25 wt percent, the tackifier 5 to 35 wt percent and the resin acceptor 0.1 to 1.5 wt percent. The phase-change heat conducting material can be coated on the copper foil, the aluminum foil, the polyethylene naphthalatc film or the polyimide film in solution state in order to increasing the strength. The dissolved with the mixed refrigerant is solid in ambient temperature, so can be conveniently fixed between the radiator and the electronic device, GPU and CPU. When the temperature of the device is up to 40 to 70 degree C, the dissolved with the mixed refrigerant starts to soften and flow, so can fill with the air gap between the interfaces well, reduce the thermal resistance and accelerate the heat transference. The phase-change heat conducting material can be perfectly peeled off when maintaining or replacing the device and also can reuse.

Description

technical field [0001] The invention belongs to the field of organosilicon chemical industry, and relates to a heat-conducting phase-change material that can soften and flow under heating and a preparation method thereof. Background technique [0002] The circuit design of modern electronic instruments and equipment is becoming more and more complex, and the integration level is getting higher and higher. Design engineers strive to install more devices in a smaller area in order to realize the miniaturization of instruments and equipment. To ensure the stable operation of these highly integrated devices, the heat generated by each electronic component must be effectively and timely transferred to the surrounding environment. The usual method is to install metal radiators with high thermal conductivity such as copper and aluminum on the surface of the device, and at the same time increase the heat dissipation area. Further, a fan is installed above the radiator to force air...

AI Technical Summary

Problems solved by technology

However, the use of heat-conducting silicone grease is inconvenient, and it is easy to contaminate the circuit board and cause short-circuit and other faults. After many cycles of cold and heat, it will be lost and dry, which will increase the thermal resistance instead.

Although cross-linked and vulcanized silicone rubber heat-conducting gap-filling materials and heat-conducting insulating materials are convenient to use, they have large thermal resistance and cannot meet the requirements of high thermal conductivity, such as applications in graphics processor chips, central processing unit chips, etc.