Dissipated metal indium chloride/chloridization 1-methyl-3-butyl imidazole system plating solution
A technology of scattered metal and butylimidazole, applied in the field of electroplating solution of scattered metal indium chloride/1-methyl-3-butylimidazole chloride system, can solve the problems of high energy consumption, high temperature operation, environmental pollution, etc. Achieve the effect of reducing pollution, low melting point, and little pollution
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Embodiment 1
[0016] Indium (In): 80
[0017] Anhydrous Indium Chloride InCl 3 :340
[0018] 1-methyl-3-butylimidazole chloride (MBIC): 269
[0019] Ethylene glycol: 250
[0020] Gelatin: 1
[0021] Dextrin: 20
[0022] Sodium chloride (NaCl): 40
[0023] The above components were taken and mixed into 1000 g of a dispersed metal indium chloride / 1-methyl-3-butylimidazole chloride system electroplating solution.
Embodiment 2
[0025] Indium (In): 90
[0026] Anhydrous Indium Chloride InCl 3 :293
[0027] 1-methyl-3-butylimidazole chloride (MBIC): 360
[0028] Ethylene glycol: 200
[0029] Gelatin: 2
[0030] Dextrin: 25
[0031] Sodium chloride (NaCl): 30
[0032] The above components were taken and mixed into 1000 g of a dispersed metal indium chloride / 1-methyl-3-butylimidazole chloride system electroplating solution.
Embodiment 3
[0034] Indium (In): 100
[0035] Anhydrous Indium Chloride InCl 3 : 230
[0036] 1-methyl-3-butylimidazole chloride (MBIC): 277
[0037] Ethylene glycol: 300
[0038] Gelatin: 3
[0039] Dextrin: 40
[0040] Sodium chloride (NaCl): 50
[0041] The above components were taken and mixed into 1000 g of a dispersed metal indium chloride / 1-methyl-3-butylimidazole chloride system electroplating solution.
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Abstract
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