Preparation method of insulating metal substrate for high-power LED packaging

Abstract

The invention relates to a preparation method of an insulating metal substrate for high-power LED packaging. The method comprises the following steps of: taking metals such as aluminum, copper and thelike with high heat conductivity as a substrate, wherein the surface of the substrate is a heat conductive insulation layer; and the heat conductive insulation layer is provided with a metallizing layer. The insulating metal substrate is characterized in that: the heat conductive insulation layer is a ceramic film and comprises the components of a ceramic matrix composite material containing ceramic particles with high heat conductivity. The insulating metal substrate is prepared by the following steps: firstly, preprocessing the surfaces of the metals by using a chemical or mechanical method; secondly, deoiling, washing and drying the metals to obtain clean and smooth surface of a workpiece; thirdly, coating a prepared polymer precursor slurry onto the surface of the workpiece with a leaching or spraying method; fourthly, putting the workpiece into a thermal treatment furnace at a temperature between 100 and 1000 DEG C for 3 to 6 hours to obtain a metal substrate with a ceramic insulation layer; and finally, coating a conductive layer on the surface of the ceramic insulation layer by using the technology such as sputtering, evaporation plating, chemical plating and the like to obtain the insulating metal substrate. The method ensures good electric insulativity, heat resistance, processability and mechanical strength of the metal substrate and improves heat conductivity of themetal substrate so as to meet the requirement of a high power LED to a packaging material with high heat conductivity.

Description

Technical field: [0001] The invention relates to a method for preparing an insulating metal substrate with excellent thermal conductivity, and the insulating metal substrate prepared according to the method can be used as a packaging substrate for high-power LED chips. It belongs to the technical field of electronic packaging. Background technique: [0002] With the rapid development of the electronics industry, the volume of electronic products is getting smaller and smaller, but the power density is getting higher and higher, which makes the heat generation of electronic components rise steadily. Of the energy dissipated by the LED chip, only a small portion (<20%) is converted into light, and the majority (>80%) becomes heat. If the heat emitted by the chip is not exported and dissipated in time, a large amount of heat will accumulate inside the LED, the junction temperature of the chip will increase severely, the luminous efficiency will drop sharply, and the reli...

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Problems solved by technology

The main problem of this process is that this oxidation process inevitably forms a considerable number of microporous layers on the surface of the aluminum and brings a large number of defects. These micropores not only affect the thermal conductivity of the insulating layer, but also make the conductive layer not well. attached to the insulation

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