Preparation method of rare earth ion-doped Lu2O3 light-emitting film
A technology of rare earth ions and light-emitting films, applied in light-emitting materials, chemical instruments and methods, etc., can solve problems such as non-uniform capillary stress, uneven pore size distribution, and film cracking
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Embodiment 1
[0031] 5g LuCl 3 ·6H 2 O powder was added into 50ml of absolute ethanol, and stirred at 100°C for 2h to completely dissolve the powder to obtain a transparent solution. Thereafter, 2.5 g of polyethylene glycol (molecular weight 6000), 6.5 g of citric acid and 6 ml of water were added and stirred at room temperature for 2 h to obtain a transparent sol. According to the concentration requirement, add 0.7ml Eu(NO 3 ) 3 The solution (0.916mol / L) was added to the sol and stirred for about half an hour to obtain the required precursor sol.
[0032] The Si single wafer used to grow thin films needs to be ultrasonically cleaned with ethanol and deionized water for 20 minutes, and then soaked in a mixture of concentrated sulfuric acid and concentrated phosphoric acid (volume ratio: 3:1) for 24 hours to remove impurities on the surface of the silicon wafer. . The pre-configured sol was dropped onto the surface of the Si substrate, and the colloid was evenly coated on the substrate ...
Embodiment 2
[0042] 5g LuCl 3 ·6H 2 O powder was added into 40ml of absolute ethanol, and stirred at 100°C for 2h to completely dissolve the powder to obtain a transparent solution. Thereafter, 2.5 g of polyethylene glycol (molecular weight 6000), 6.5 g of citric acid and 5 ml of water were added and stirred at room temperature for 2 h to obtain a transparent sol. According to the concentration requirement, add 2.6ml Tb(NO 3 ) 3 The solution (0.048mol / L) was added to the sol and stirred for about half an hour to obtain the required precursor sol.
[0043] The Si single wafer used to grow thin films needs to be ultrasonically cleaned with ethanol and deionized water for 20 minutes, and then soaked in a mixture of concentrated sulfuric acid and concentrated phosphoric acid (volume ratio: 3:1) for 24 hours to remove impurities on the surface of the silicon wafer. . The pre-configured sol was dropped onto the surface of the Si substrate, and the colloid was evenly coated on the substrate ...
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