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Method for preparing high temperature sintering electronic argentalium paste from self-crosslinking acrylate resin

An acrylate and high-temperature sintering technology, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as difficulty in slurry preparation and control, and avoid secondary flow phenomena. The performance is easy to control and the process is simple

Inactive Publication Date: 2010-09-22
杭州得力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high solid content requirements of thick-film electronic silver-aluminum paste, which are generally above 80%, there is little room for adjusting the performance indicators of the paste by using auxiliary solvents, resulting in difficulties in the preparation and control of paste.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] First, add 38.0% diethylene glycol butyl ether in the reactor equipped with the condenser, start the agitator and heat it for standby; then add 39.0% methyl methacrylate, 5.0% isooctyl acrylate, 15.0% of glycidyl methacrylate and 3.0% of N-methylol acrylamide were added to the mixing kettle, 0.1% of benzoyl peroxide was added, and the mixture was evenly stirred for standby; When the temperature is ℃, the above-mentioned mixed monomers are added dropwise to the reaction kettle, and all the mixed monomers are controlled to be added within 3 hours. After continuing the reaction for 2 hours, the cross-linked acrylate resin is obtained by cooling and discharging. In addition, 5% spherical silver powder with a fineness of 3 to 20 μm, 10.0% of flake silver powder, 50.0% of aluminum powder, and 15.0% of low melting point lead-free glass powder with a fineness of 3 to 20 μm were added into the mixer and mixed evenly, and 0.5 % silane coupling agent KH550, after stirring evenly, ...

Embodiment 2

[0028] First, add 85.0% diethylene glycol butyl ether acetate in the reactor equipped with the condenser, start the stirrer and heat it for standby; then add 8.0% methyl methacrylate and 2.0% butyl acrylate , 3.0% of glycidyl methacrylate, 1.0% of N-methylol acrylamide, 1.0% of hydroxyethyl acrylate were added to the mixing kettle, 0.3% of azobisisobutyronitrile was added, stirred evenly, and set aside; to be reacted When the temperature of diethylene glycol butyl ether acetate in the kettle rises to 85°C, the above mixed monomers are added dropwise to the reaction kettle, and all mixed monomers are controlled to be added within 2.5 hours. Linked acrylic resin. In addition, 5.0% spherical silver powder with a fineness of 3-20μm, 5.0% flake silver powder, 60% aluminum powder, and 10.0% low-melting lead-free glass powder with a fineness of 3-20μm were added to the mixer and mixed uniformly, and 0.8% was added. silane coupling agent KH560, stir evenly, add 16.0% of the above-men...

Embodiment 3

[0030] First, add 25.0% of diethylene glycol dibutyl ether and 25.0% of diethylene glycol methyl ether acetate in the reactor equipped with the condenser, start the stirrer and heat it for standby; then 28.0% of methyl Methyl acrylate, 5.0% ethyl acrylate, 5.0% isooctyl acrylate, 10.0% glycidyl methacrylate, 1.0% N-methylol acrylamide, 1.0% hydroxypropyl acrylate were added to the mixing kettle , add 0.5% benzoyl peroxide, stir evenly, and set aside; when the temperature of the diethylene glycol ether ester mixed solvent in the reaction kettle rises to 88 °C, dropwise add the above mixed monomers to the reaction kettle, and control all the mixed monomers within 2h After the addition is completed, the reaction is continued for 2 hours, cooling and discharging to obtain a self-crosslinkable acrylate resin. In addition, 8.0% spherical silver powder with a fineness of 3-20μm, 5.0% flake silver powder, 65% aluminum powder, and 5.0% low-melting lead-free glass powder with a fineness...

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Abstract

The invention discloses a method for preparing high temperature sintering electronic argentalium paste from self-crosslinking acrylate resin. The method comprises the following steps of: firstly selecting acrylate monomers, and preparing the self-crosslinking acrylate resin through solution polymerization; mixing ultrafine argentalium powder, lead-free glass powder with low melting point, a surface modifier, an auxiliary agent and a defoaming agent, and dispersing the mixture into the self-crosslinking acrylate resin; and repeatedly grinding the mixture to obtain the electronic argentalium paste. The method for preparing the high temperature sintering electronic argentalium paste has the characteristics of simple process, convenience and feasibility, no need of special equipment, less investment, easy control of product performance and the like.

Description

technical field [0001] The invention relates to a preparation method of self-crosslinking acrylate resin high-temperature sintering electronic silver-aluminum paste. Background technique [0002] Electronic paste is an important electronic fine chemical. Can be widely used in electronics, information, communications, aerospace, computer, electrical manufacturing, precision components and solar energy and many other industries. Its manufacturing technology involves metallurgy, materials, chemical industry, electronic technology and screen printing and other related fields. Due to the wide application range of electronic paste, the wide range of fields involved in research and development, and the high technological content of the products, the developed countries of the world's industrial level have always attached more importance to the research and development of electronic paste products. [0003] In recent years, with the increasing shortage of conventional energy sourc...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B1/22H01L31/0224
Inventor 沈良王杰宋锡瑾
Owner 杭州得力科技股份有限公司