Silicon micro needle surface coating process method based on micro-electromechanical system (MEMS) technology
A processing method and needle surface technology, applied in the field of silicon microneedle surface coating processing based on MEMS technology, can solve problems affecting mechanical properties, uneven thickness of silicon needles, biocompatibility and reliability, and achieve good Effects of biocompatibility and enhanced reliability
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Embodiment 1
[0025] In this embodiment, the surface insulating layer is fabricated by spin-coating polyimide. Polyimide material has good biocompatibility and water resistance. Coating it on the surface of silicon material can enhance the reliability of silicon microneedle working in vivo and realize long-term implantation in vivo.
[0026] Example 1
[0027] like figure 1 As shown, this embodiment includes the following steps:
[0028] Step 1, cleaning the SOI sheet 1, using the SOI sheet 1 as the substrate, and growing the bottom layer on the polished surface of the SOI sheet 1 by PECVD (plasma chemical vapor deposition) method Bottom SiO 2 2 for electrically isolating the metal alloy layer from the silicon substrate, such as figure 1 (a) shown.
[0029] Step 2, on the bottom SiO 2 2 sputtering metal sequentially titanium and Gold, forming a metal alloy layer, and etching out metal interconnection lines 10, pads 9 and contact dots 11, pads 9 are used to electrically connect mi...
Embodiment 2
[0038] like figure 1 As shown, this embodiment includes the following steps:
[0039] Step 1, cleaning the SOI sheet 1, using the SOI sheet 1 as the substrate, and growing the bottom layer on the polished surface of the SOI sheet 1 by PECVD (plasma chemical vapor deposition) method Bottom SiO 2 2 for electrically isolating the metal alloy layer from the silicon substrate, such as figure 1 (a) shown.
[0040] Step 2, on the bottom SiO 2 2 sputtering metal sequentially titanium and Gold, forming a metal alloy layer, and etching out metal interconnection lines 10, pads 9 and contact dots 11, pads 9 are used to electrically connect microelectrodes and external circuits, and contact dots 11 are used as stimulation points , used to stimulate tissues to transmit electrical signals, such as figure 1 (b) shown.
[0041] Step 3, PECVD growing the top layer on the metal alloy layer For insulating metal alloy layer, use buffered HF acid solution to etch top layer SiO 2 , expos...
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Abstract
Description
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Application Information
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