Method for manufacturing ceramic-based flexible circuit board

A flexible circuit board and manufacturing method technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of poor thermal conductivity and heat dissipation, single circuit board advantages, and difficulty in improving reliability, and achieve good thermal conductivity and excellent 3D connection characteristics. , to solve the effect of high temperature resistance

Inactive Publication Date: 2011-03-23
广东达进电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy welding of components, but its thermal conductivity and heat dissipation are poor, the expansion and contraction size is difficult to control, and the reliability is also difficult to improve;
[0004] Flexible circuit board (soft board): it has the characteristics of small size, light weight, movable, bending, and twisting surface without damaging the wires, and can comply with different shapes and special package sizes, and has a wide range of 3D assembly and dynamic applications; weakness Its dimensional stability is extremely poor, the wiring density is low, it is not resistant to high temperature, and it is not easy to make multilayer boards.
[0005] Ordinary alumina ceramic circuit board: it has

Method used

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  • Method for manufacturing ceramic-based flexible circuit board
  • Method for manufacturing ceramic-based flexible circuit board

Examples

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Example Embodiment

[0045] Example 1

[0046] The manufacturing method of a ceramic-based flexible circuit board of the present invention includes the following steps:

[0047] A. Making aluminum nitride ceramic circuit boards

[0048] a1. Make the inner layer pattern on the pre-treated aluminum nitride ceramic copper clad laminate; mainly include: incoming inspection → degreasing → pickling → drying → lamination → exposure → development → etching → film removal → drying, etc. Process

[0049] The specific method is: clean the surface of the aluminum nitride ceramic copper clad substrate that has passed the inspection, and use sodium persulfate to microetch the copper clad layer of the aluminum nitride ceramic copper clad substrate to remove the oil and surface on the copper clad layer Compared with the use of physical methods to clean the circuit board substrate, it is more effective to prevent damage to the aluminum nitride ceramic copper-clad substrate. The micro-etched aluminum nitride ceramic coppe...

Example Embodiment

[0096] Example 2

[0097] The manufacturing method of a ceramic-based flexible circuit board of the present invention includes the following steps:

[0098] A. Making aluminum nitride ceramic circuit boards

[0099] a1. Make inner layer patterns on the pre-treated aluminum nitride ceramic copper clad board;

[0100] Mainly include: incoming inspection → degreasing → pickling → drying → lamination → exposure → development → etching → film removal → drying and other processes;

[0101] The specific method is: clean the surface of the aluminum nitride ceramic copper clad substrate that has passed the inspection, and use ammonium persulfate to microetch the copper layer of the aluminum nitride ceramic copper clad substrate to remove the oil and surface on the copper clad layer Compared with the use of physical methods to clean the circuit board substrate, it is more effective to prevent damage to the aluminum nitride ceramic copper-clad substrate. The micro-etched aluminum nitride ceramic ...

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Abstract

The invention discloses a method for manufacturing a ceramic-based flexible circuit board, which is characterized by comprising the following steps of: A. manufacturing an aluminum nitride ceramic circuit board; B. manufacturing a flexible circuit board; C. laminating the aluminum nitride ceramic circuit board and the flexible circuit board; D. manufacturing a through hole passing through the upper surface and the lower surface of the multilayer board on the multilayer board obtained in the step C by adopting laser drilling equipment, processing the hole with a conducting material and then drying to obtain a through hole; E. printing solder resist ink in the positions on the multilayer board, at which electronic elements do not need to be welded; F. silk printing characters at preset positions on the multilayer board; and G. cutting the circuit board into predetermined specifications by adopting laser cutting equipment to obtain the ceramic-based rigid flexible multilayer circuit board. The invention aims to overcome the defects in the prior art and provide the manufacturing method of the ceramic-based flexible circuit board with simple process, good 3D connection performance and good thermal conductivity.

Description

technical field [0001] The invention relates to a method for manufacturing a ceramic-based flexible circuit board. Background technique [0002] At present, there are ordinary epoxy resin multilayer boards in the industry, there are flexible circuit boards (soft boards), rigid-flexible circuit boards with epoxy resin + flexible circuit boards, and ordinary Al 2 o 3 As the main component of ceramic circuit boards, their advantages and disadvantages are as follows: [0003] Ordinary epoxy resin multilayer board: has a series of advantages such as many layers, high wiring density, mature technology, and easy welding of components, but its thermal conductivity and heat dissipation are poor, the expansion and contraction size is difficult to control, and the reliability is also difficult to improve; [0004] Flexible circuit board (soft board): it has the characteristics of small size, light weight, movable, bending, and twisting surface without damaging the wires, and can comp...

Claims

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Application Information

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IPC IPC(8): H05K3/46
Inventor 王斌陈华巍盛从学姚超谢兴龙杨晓乐
Owner 广东达进电子科技有限公司
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