Repairable type epoxy resin encapsulating glue and preparation method thereof

A technology of epoxy resin and encapsulant, which is applied to electrical components, circuits, electrical solid devices, etc., can solve the problems of inconvenience for users to repair defective products and high glass transition temperature, and achieve easy repair, ensure packaging quality, and improve electrical Effects of performance and mechanical properties

Inactive Publication Date: 2011-04-13
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the glass transition temperature (Tg) of many epoxy resin encapsulants on t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The preparation method of this reworkable epoxy resin encapsulant comprises the following steps in sequence:

[0028] (1) Under the condition of 110°C, dry calcium carbonate (its fineness is 1500 mesh) and aluminum hydroxide (its fineness is 1250 mesh) respectively, and the drying process lasts for 3 hours to remove calcium carbonate and aluminum hydroxide moisture in

[0029] (2) Take bisphenol A type epoxy resin (its viscosity is 10000cps, epoxy equivalent is 180) 25Kg, bisphenol F type epoxy resin (its viscosity is 2500cps, epoxy equivalent is 150) 75Kg, alkyl shrinkage Glyceryl ethers (both C 10 -C 15 Alkyl glycidyl ether) 0.2Kg, dicyandiamide 6Kg, thixotropic agent (both nanoscale fumed silica) 0.2Kg, carbon powder (both non-conductive nanoscale carbon powder) 0.5Kg, calcium carbonate (all Inactive calcium carbonate, whose fineness is 1500 mesh) 30Kg and aluminum hydroxide (whose fineness is 1250 mesh) 80Kg;

[0030](3) Add bisphenol A type epoxy resin, bisphen...

Embodiment 2

[0037] The preparation method of this reworkable epoxy resin encapsulant comprises the following steps in sequence:

[0038] (1) Calcium carbonate (its fineness is 800 mesh) and aluminum hydroxide (its fineness is 1000 mesh) are dried respectively, and drying temperature is 110 ℃, and drying process continues 3 hours;

[0039] (2) Take by weighing bisphenol A type epoxy resin (its viscosity is 12000cps, epoxy equivalent is 210) 40Kg, bisphenol F type epoxy resin (its viscosity is 3500cps, epoxy equivalent is 165) 60Kg, alkyl shrinkage Glyceryl ether 3Kg (all C 10 -C 15 Alkyl glycidyl ether), dicyandiamide 8Kg, thixotropic agent 1Kg (both nanoscale fumed silica), carbon powder 0.1Kg, calcium carbonate 50Kg and aluminum hydroxide 75Kg;

[0040] (3) Add bisphenol A type epoxy resin, bisphenol F type epoxy resin, alkyl glycidyl ether, dicyandiamide, thixotropic agent, carbon powder, calcium carbonate and aluminum hydroxide to clean, dry and have In the reaction vessel of coolin...

Embodiment 3

[0047] The preparation method of this reworkable epoxy resin encapsulant comprises the following steps in sequence:

[0048] (1) Calcium carbonate (its fineness is 1500 mesh) and aluminum hydroxide (its fineness is 800 mesh) are dried respectively, and drying temperature is 115 ℃, and drying process continues 2.5 hours;

[0049] (2) Take bisphenol A type epoxy resin (its viscosity is 11000cps, epoxy equivalent is 200) 30Kg, bisphenol F type epoxy resin (its viscosity is 4500cps, epoxy equivalent is 180) 70Kg, alkyl shrinkage Glyceryl ether 8Kg (all C 10 -C 15 Alkyl glycidyl ether), dicyandiamide 8Kg, thixotropic agent 3Kg (both are nanoscale fumed silica), carbon powder 2Kg (both are non-conductive nanoscale carbon powder), calcium carbonate 80Kg and aluminum hydroxide 55Kg 1. Dispersant 1Kg (both glyceryl tristearate);

[0050] (3) Add bisphenol A type epoxy resin, bisphenol F type epoxy resin, alkyl glycidyl ether, dicyandiamide, thixotropic agent, carbon powder, calcium ...

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Abstract

The invention relates to repairable type epoxy resin encapsulating glue. The repairable type epoxy resin encapsulating glue is characterized by comprising the following components in parts by weight: 20 to 40 parts of bisphenol A type epoxy resin, 60 to 80 parts of bisphenol F type epoxy resin, 0.1 to 10 parts of alkyl glycidyl ether, 5 to 10 parts of dicyandiamide, 1 to 8 parts of imidazole accelerator, 0.1 to 5 parts of thixotropic agent, 0.1 to 5 parts of carbon dust, 20 to 80 parts of calcium carbonate, 40 to 100 parts of aluminium hydroxide and 0.1 to 3 parts of organosilicon defoamer. The epoxy resin encapsulating glue comprises appropriate parts of the bisphenol F type epoxy resin and the alkyl glycidyl ether and can be solidified at the temperature of 120 DEG C to 150 DEG C, and a condensate has a proper vitrification temperature, can be repaired at the temperature of 135 DEG C to 180 DEG C, has stronger hardness and thixotropy, has better electrical and mechanical properties, and can effectively protect semiconductor electronic devices and components on a circuit board.

Description

technical field [0001] The invention relates to an epoxy resin encapsulating glue with the function of repairing, which is used for the packaging of semiconductor electronic products, and a preparation method of the epoxy resin encapsulating glue. Background technique [0002] The existing epoxy resin encapsulant is generally composed of epoxy resin, curing agent, accelerator, filler and various additives, and can be applied to the packaging of various semiconductor electronic products. However, the glass transition temperature (Tg) of many epoxy resin encapsulants on the market is too high, which is not convenient for users to repair defective products. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a kind of reworkable epoxy resin encapsulant and the preparation method of this epoxy resin encapsulant, this epoxy resin encapsulant has a suitable glass transition temperature after curing, It can be repaired at ...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08K13/02C08K3/04C08K3/22C08K3/26C08K5/3445C08K5/3447C08K3/36C08K5/103H01L23/29
Inventor 周振基周博轩
Owner NICHE TECH KAISER SHANTOU
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