Alkali aqueous cleaning agent for clearing solder paste on surface of circuit board and manufacturing method thereof

A solder paste and circuit board technology, applied in the field of cleaning agent, can solve the problems of inflammability, explosion, and high price, and achieve the effects of low cost, good protection, and environmental pollution

Inactive Publication Date: 2011-04-20
DALIAN SANDAAOKE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are only two kinds of specially synthesized halogenated hydrocarbon solvents and alcohol solvents that have no impact on the ozone layer. The price of specially synthesized halogenated hydrocarbon solvents is very expensive, almost 50 times that of dichloromethane; although alcohol solvents are cheap , but there are safety hazards such as flammable and explosive

Method used

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Embodiment Construction

[0012] The raw materials and mass percentages contained in the embodiments are as follows: 0.5-10% of dibasic fatty acid; 1-30% of ethanolamine, 0.1-15% of diethylene glycol ethylenediamine, 0.1-5% of benzotriazole; Ethylene oxide polymer 0.5-10%; isomeric alkyl propylene oxide ethylene oxide polymer 0.5-10%; oxygen-containing solvent 0.5-20%; pure water 65-75%.

[0013] The dibasic fatty acid is at least one of sebacic acid, undecanedioic acid and dodecanedioic acid.

[0014] The ethanolamine is at least one of diethanolamine and triethanolamine.

[0015] The oxygen-containing solvent is at least one of 1,2-propanediol, ethylene glycol phenyl ether, ethylene glycol butyl ether, ethylene glycol ethyl ether, diethylene glycol butyl ether, and diethylene glycol ethyl ether.

[0016] The amount of each raw material can be selected within the above range, and the total mass is 100%.

[0017] The manufacturing method is to carry out as follows:

[0018] a. Put pure water into t...

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PUM

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Abstract

The invention discloses an alkali aqueous cleaning agent for clearing solder paste on the surface of a circuit board, comprising the following raw materials in percent by weight: 0.5 to 10% of binary fatty acid; 1 to 30% of ethanolamine , 0.1 to 15% of diethylene glycol ethidene diamine, 0.1 to 5% of benzotriazole, 0.5 to 10% of epoxypropane epoxyethane polymer, 0.5 to 10% of isomerized alkylate epoxypropane epoxyethane polymer, 0.5 to 20% of oxygen-containing solvent and 65 to 75% of pure water. The alkali aqueous cleaning agent is low in using cost, strong in cleaning performance, capable of rapidly and thoroughly cleaning the solder paste on the surface of the circuit board, and capable of completely satisfying the surface cleanliness demands of the circuit board. The alkali aqueous cleaning agent can avoid corrosion to components of the circuit board, and can excellently protect components, welding spots, components of metal and plastic and the like. Furthermore, the alkali aqueous cleaning agent solves the problem existed in the prior art about environmental pollution, fire disaster, explosion disaster and the like, and the alkali aqueous cleaning agent is safe and reliable.

Description

technical field [0001] The invention relates to a cleaning agent for removing solder paste on the surface of circuit boards, in particular to an alkaline aqueous cleaning agent for removing solder paste on the surface of circuit boards with low use cost, strong cleaning power, safety and reliability. Background technique [0002] When soldering electronic components on the circuit board, solder paste is needed, and after soldering, the solder paste needs to be cleaned. The cleaning agents used in the past were solvents such as F113, dichloromethane, trichlorethylene, etc., but these solvents have a serious destructive effect on the ozone layer of the atmosphere and are poisonous to the human body, so they have been banned by various countries; Many alternative solvents such as bromopropane, but only relatively reduce the harm to the ozone layer and human body. At present, there are only two kinds of specially synthesized halogenated hydrocarbon solvents and alcohol solvents...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C11D1/83C11D3/30C11D3/28C11D3/20
Inventor 吕栓锁
Owner DALIAN SANDAAOKE CHEM
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