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Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof

A low-temperature co-firing, glass technology, applied in circuits, electrical components, layered products, etc., can solve the problems of blank LTCC commercial materials and unreported invention patents.

Active Publication Date: 2012-12-19
NANJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the domestic research on LTCC materials is in its infancy, and the invention patents of composite material systems related to glass and ceramics with independent intellectual property rights have not yet been reported, and the commercialization of LTCC materials is still blank

Method used

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  • Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof
  • Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof
  • Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1-3

[0031] Table 1 shows the content of each component of the calcium barium magnesium borosilicate glass in specific examples 1-3 of the present invention. Weigh each component as shown in Table 1, after mixing for 8 hours, keep it in a platinum crucible at 1400°C for 2 hours to completely melt and homogenize it, pour it into distilled water to obtain transparent calcium barium magnesium borosilicate It is cullet, and the obtained cullet is wet ball milled (with agate balls) to obtain calcium barium magnesium borosilicate glass powder with an average particle size of 0.7 μm. After tape casting and drying according to the formula in Table 2, the raw tape used in the present invention was obtained. Slice the raw tape, print the circuit with Au paste, through-hole, fill the hole, stack 20 layers, and press it under isostatic pressure (3000psi) at 80°C. Then raise the temperature from room temperature at 1°C / min to 400°C for 2 hours to ensure that the organic matter in the sample is...

Embodiment 4-6

[0039] Table 4 shows the content of each component of the calcium barium magnesium borosilicate glass in specific examples 4-6 of the present invention. Weigh each component as shown in Table 4, after mixing for 8 hours, keep it in a platinum crucible at 1550°C for 4 hours to completely melt and homogenize it, pour it into distilled water to obtain transparent calcium barium magnesium borosilicate It is cullet, and the obtained cullet is subjected to wet ball milling (with agate balls) to obtain calcium barium magnesium borosilicate glass powder with an average particle size of 2 μm. After tape casting and drying according to the formula in Table 5, the raw tape used in the present invention was obtained. Slice the raw material tape, print 40 pieces with Au paste, print 40 pieces of circuits, through holes, fill holes with Ag paste, and stack 80 layers in total. The following is printed with Ag paste and isostatically pressed at 100°C (3000psi) compression molding. Then rais...

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Abstract

The invention provides a low-temperature cofiring glass and ceramic multilayer microcircuit substrate and a preparation method thereof, belonging to the technical field of a new material compound from glasses with low softening points and low loss and ceramics and preparation thereof. The preparation method of the low-temperature cofiring glass and ceramic multilayer microcircuit substrate particularly comprises the following steps of: quenching founded glass into water in a high-temperature state; carrying out coarse crushing; ball-milling into glass powder; and mixing with ceramic powder into composite powder materials according to a certain proportion. The composite materials of the glass with the lower softening points and the low loss and the ceramics are prepared with an organic system into a sizing agent so as to generate a raw ceramic material belt through curtain coating; and cofiring the metal size agent for printing microcircuit patterns at low temperature to obtain the multilayer microcircuit package substrate. The glass and ceramic material has the advantages of continuously adjustable relative dielectric constant from 6.0 to 9.0, low dielectric loss, microcircuit three-dimensional integration, high-temperature resistance, good frequency and temperature stability, and the like and is a novel microelectronic package material which has extensive application prospectin circuits, i.e. a high-speed circuit, a filter, a power switch, a microstrip antenna array, a high-power waveguide, and the like.

Description

technical field [0001] The invention relates to a low-temperature co-fired glass and ceramic multilayer microcircuit substrate and a preparation method thereof, belonging to the field of organic, inorganic and metal composite materials. Background technique [0002] With the rapid development of microelectronic technologies such as hybrid integrated circuit (HIC) and microwave multi-chip module (MCM). The requirements for electronic packaging materials for manufacturing high-speed interconnect circuits and substrates for multilayer printed microcircuits are becoming more and more urgent. The new idea and new technology of Low Temperature Co-fired Ceramics (LTCC) proposed by Hughes Corporation of the United States in the 1980s has enabled the rapid development of microelectronic planar two-dimensional packaging technology to highly reliable three-dimensional three-dimensional packaging technology. System packaging stage. In the high-end fields of national defense and civili...

Claims

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Application Information

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IPC IPC(8): C03C3/064C03C3/089B32B9/00H01L23/498H01L21/48
Inventor 周洪庆韦鹏飞戴斌王杰邵辉刘明
Owner NANJING UNIV OF TECH
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