Preparation method for AuSn20 alloy brazing filler metal used for packaging integrated circuit and usage thereof

A technology of alloy solder and integrated circuit, which is applied in the field of preparation of AuSn20 alloy solder for integrated circuit packaging, can solve the problems of fragility and poor material ductility, and achieve the effects of compact structure, excellent welding performance, and reduced processing difficulty

Active Publication Date: 2011-07-06
BEIJING INST OF NONFERROUS METALS & RARE EARTH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the alloy brazing filler metal is composed of ξ phase and intermetallic compound inside the crystal, and the material has poor ductility and is brittle, so only a small amount of processing is allowed.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Example 1: Production of foil strips

[0039] 1) Prepare high-purity (purity is 5N) gold and high-purity (purity is 5N, 5N is 99.999%) tin materials according to the ratio range of Sn: 20% ± 1%, Au: balance calculation, weighing;

[0040] 2) gold and tin are put into the alumina crucible of vacuum casting furnace;

[0041] 3) Seal the furnace and evacuate to 4Pa;

[0042] 4) Heating up, controlling the heating rate to 30°C / min;

[0043] 5) After all the gold and tin are melted, control the temperature of the melt at 500-600°C and scouring for 5 minutes to fully alloy and fully degas;

[0044] 6) Casting, the pouring temperature is between 500 and 600°C, pouring in graphite mold, and AuSn is obtained after cooling 20 alloy rod.

[0045] 7) Processed into strips using the quenching strip technology: using a vacuum quenching strip machine, the AuSn 20 The alloy rod is placed in a quartz tube with a bottom hole and heated by a high-frequency induction coil;

[0046] 8) ...

Embodiment 2

[0053] Embodiment 2: disc alloy product

[0054] Step 1) to step 12) are the same as in Example 1, first obtain an AuSn20 alloy thin strip with a thickness of 0.05-0.08mm; then roll and shape it, and the thickness after processing is 0.05±0.005mm, and then carry out stamping processing to prepare Φ2.5mm×thickness 0.1mm wafer product. The processed AuSn 20 Alloy wafer products are cleaned with acidic cleaning solution and alkaline cleaning solution by soaking and stirring methods to remove pollution caused during processing and make the surface of the product clean and bright.

Embodiment 3

[0055] Embodiment 3: disc alloy product

[0056] Step 1) to step 12) are the same as in Example 1, first obtain an AuSn20 alloy thin strip with a thickness of 0.05-0.08mm; then roll and shape it, and the thickness after processing is 0.05±0.005mm, and then carry out stamping processing to prepare Outer diameter Φ1.0mm-inner diameter Φ0.6mm (or other specifications) circular products. The processed AuSn 20 Alloy ring-shaped products are cleaned with acidic cleaning solution and alkaline cleaning solution by soaking and stirring to remove pollution caused during processing and make the surface of the product clean and bright.

[0057] It is a creative point of the present invention to process the AuSn20 alloy brazing filler metal into strips by adopting the technology of quenching and stripping. The linear speed is 30-40m / s; the distance between the bottom hole of the quartz tube and the surface of the copper roller is 1-4mm.

[0058] In each of the above-mentioned embodiment...

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PUM

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Abstract

The invention relates to a preparation method for an AuSn20 alloy brazing filler metal used for packaging an integrated circuit, which comprises the following steps: preparing gold and tin in proportions; placing the gold and tin into a casting furnace; sealing the furnace and vacuumizing the furnace; rising the temperature till the gold and tin are completely melted, controlling the temperature of the melt at 500-600 DEG C, refining for the purpose of alloying the gold and tin and degassing, and pouring the alloy in a graphite mould; placing an acquired AuSn20 alloy bar into a quartz tube and heating; sealing the furnace and vacuumizing till the pressure is 4-6Pa; rising the temperature and controlling the temperature rising; after melting the alloy bar, controlling the temperature of the melt to be 500-600 DEG C, and refining for 2-3 minutes; performing the melt-spinning process by using a vacuum quenching melt-spinning machine, controlling the temperature of the melt within 500-600 DEG C in the melt-spinning process, and introducing high-pressure nitrogen from an upper port of the quartz tube, wherein the nitrogen pressure is 10-15Pa; and spraying the alloy melt onto a speedily rotating metal wheel of the vacuum quenching melt-spinning machine from a bottom hole on the quartz tube, thereby acquiring a belt material. The belt material can be milled into a foil belt material or be punched into a slice or annular deeply processed product in the corresponding specification. By using the method, the product having excellent integrated circuit property can be prepared.

Description

technical field [0001] The invention relates to a preparation technology of precious metal alloy solder, in particular to an AuSn alloy for integrated circuit packaging. 20 Preparation method and application of alloy solder. Background technique [0002] AuSn 20 As a low-temperature solder, it is used to package semiconductor transistors with gold-plated shells. The solder alloy has low melting point (278° C.) and vapor pressure, good wettability and fluidity, and also has excellent corrosion resistance and high thermal conductivity. The strength of joints welded with this alloy solder is not affected by thermal shock. [0003] It can be seen from the binary alloy phase diagram that AuSn 20 The alloy forms a eutectic at 278°C, which consists of a hexagonal ξ phase and an intermetallic compound AuSn in the solid state. AuSn in as-cast and annealed states 20 Alloys are brittle and difficult to machine. [0004] Existing AuSn 20 The brazing filler metal is thermally com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K35/30
Inventor 张昆章明溪黄小凯
Owner BEIJING INST OF NONFERROUS METALS & RARE EARTH
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