Surface-electrode-technology-based high-throughput cell electrofusion chip device
A surface electrode, high-throughput technology, applied in the field of cell electrofusion, can solve problems such as cell clogging
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[0040] Example 1
[0041] See figure 1 , figure 2 with image 3 , A high-throughput cell electrofusion chip device based on surface electrode technology is composed of a high-throughput cell electrofusion chip 1 and a cover sheet 2 with inlet and outlet catheters.
[0042] See image 3 , The high-throughput cell electrofusion chip 1 includes a quartz substrate layer 3, a polymer microchannel layer 5, and a top protective layer 8 from bottom to top.
[0043] The bottom comb-shaped microelectrode array 4, the sidewall surface electrode layer 6, the top comb-shaped microelectrode array layer 7, which are characterized by the bottom comb-shaped microelectrode array layer 4, the sidewall electrode layer 6, and the top comb-shaped microelectrode array layer 7 It is electrically connected to form a "sandwich" structure of the side wall surface electrode array 9, which combines the quartz substrate layer 3 and the polymer microchannel layer 5 to form a smooth flow path 10.
[0044] The bott...
Example Embodiment
[0051] Example 2: How to use this device
[0052] In the experiment, a micro pump can be used to inject the cell suspension into the chip from the injection port 18 in Example 1. When the cell suspension flows through the microchannel 10, the sine wave electrical stimulation signal is loaded through the bonding point 13 or 15. A non-uniform gradient electric field will be formed between the opposite sidewall microelectrodes, and the two cells between the microelectrodes will queue up under the action of the dielectrophoresis force. After the queue is completed, a square wave pulse sequence signal is applied, and the cell pairs that have completed the queue will complete the cell electroporation-cell electrofusion process under the action of the high-intensity pulse electric field between the microelectrodes. After the cell electrofusion process is completed, the micro pump is used to inject the cell culture medium, and the cells in the microchannel flow out through the microchann...
Example Embodiment
[0053] Example 3: Fabrication of high-throughput cell electrofusion chip device
[0054] Using MEMS processing technology, the processing technology is as follows:
[0055] A. Clean the quartz glass sheet;
[0056] B. Place the quartz glass sheet in an evaporation furnace, and evaporate and deposit 2000 的金膜;
[0057] C. Spin-coating AZ4620 on the surface of the gold film, and after exposure and development, it forms the same pattern as the bottom microelectrode array structure;
[0058] D. Put the quartz glass sheet in the gold etching solution and HF etching solution successively to remove the excess gold film to form the bottom microelectrode array structure;
[0059] E. Acetone removes the residual AZ4620 on the surface of the bottom microelectrode array structure;
[0060] F. Cleaning;
[0061] G. Spin-coating PI7510 on the surface of the quartz glass sheet, exposing and developing to form a polymer microchannel layer, and then placing it in a curing oven to solidify PI7510 to form a ...
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