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Light emitting diode (LED) epoxy encapsulation adhesive

An epoxy encapsulation and encapsulation technology, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of poor weather resistance of epoxy resin, large LED light decay, and reduced light output efficiency, etc. Vacuum defoaming, anti-yellowing performance improvement, fast hardening effect

Inactive Publication Date: 2013-06-12
SUZHOU BANGCEN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, due to the poor weather resistance of epoxy resin, it will turn yellow when exposed to ultraviolet rays outdoors for a long time, which will eventually lead to a decrease in the light extraction efficiency of the LED, resulting in a large light decay of the LED.

Method used

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  • Light emitting diode (LED) epoxy encapsulation adhesive
  • Light emitting diode (LED) epoxy encapsulation adhesive
  • Light emitting diode (LED) epoxy encapsulation adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] The LED epoxy encapsulation adhesive of this embodiment consists of a main agent and a hardener.

[0063] The composition of the main agent is:

[0064]

[0065] hardener:

[0066]

[0067] Preparation of main ingredients: Add 350 kg of Nanya EPOXYEL 128E resin, 0.04 kg of defoamer (TEGO 910), 3.5 kg of reactive diluent (EPODIL749) into a 500L reactor, and then add 0.035 kg of bluing agent (VIOLET B) and heat to Stir at 100°C for 1 hour, filter and pack.

[0068] Hardener preparation: The 500L reactor is anhydrous and oxygen-free, first add 175 kg of MHHPA, 56 kg of triethyl phosphite, 14.2 kg of tetraethylammonium bromide, 0.175 kg of ultraviolet absorber (irgnox 1010), 7 kg of methanol 1 kg was heated to 80°C and kept stirring for 1 hour, then 175 kg of MHHPA and 1.75 kg of release agent (INT1810) were added and kept stirring for 1 hour, then filtered and packed.

[0069] When using, preheat 1000g of main agent at 60°C for 1 hour, then add 1000g of hardener a...

Embodiment 2

[0074] The LED epoxy encapsulation adhesive of this embodiment consists of a main agent and a hardener.

[0075] The composition of the main agent is:

[0076]

[0077] hardener:

[0078]

[0079] Preparation of main ingredients: Add Nanya EPOXY EL 127 resin, defoamer (TEGO 910) and blueting agent (VIOLET B) into a 500L reactor, heat to 110°C and stir for 0.5 hours, filter and pack.

[0080] Preparation of hardener: first add 50% MHHPA triethyl phosphite, tetrabutylammonium bromide, ultraviolet absorber (irgnox 1010), and 7 kg of methanol to 80 ° C for heat preservation and stirring in a 500 L reaction kettle without water and oxygen After 0.8 hours, add the remaining 50% of MHHPA and release agent (INT1810), keep stirring for 1.2 hours, filter and pack.

[0081] When using, preheat 1000g of main ingredient at 80°C for 0.5 hour, then add 1000g of hardener and stir for 8 minutes. Vacuumize for 6 minutes under the condition of 6mm Hg vacuum degree and temperature of 50°...

Embodiment 3

[0086] The LED epoxy encapsulation adhesive of this embodiment consists of a main agent and a hardener.

[0087] The composition of the main agent is:

[0088]

[0089] hardener:

[0090]

[0091] Main ingredient preparation: Add Nanya EPOXY EL 128E resin, defoamer (TEGO 910), reactive diluent (EPODIL749) into a 500L reactor, then add blueting agent (VIOLET B), heat to 90°C and stir for 1.2 hours, filter Subpackage.

[0092] Hardener preparation: 500L reaction kettle is anhydrous and oxygen-free, first add 50% MHHPA triethyl phosphite, tetraethylammonium chloride, ultraviolet absorber (irgnox 1010), methanol 7 kg and heat to 75 ° C Stir for 1.2 hours, then add the remaining MHHPA, remover (INT1810) and keep stirring for 0.8 hours, then filter and pack.

[0093] When using, preheat 1000g of main agent at 70°C for 50 minutes, then add 1000g of hardener and stir for 10 minutes. Under the conditions of 10mm Hg vacuum degree and temperature of 50°C, vacuumize for 6 minute...

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Abstract

The invention relates to light emitting diode (LED) epoxy encapsulation adhesive and a preparation method thereof. Aiming at the defects that the epoxy resin has poor weather resistance and is aged and yellowed under the irradiation of ultraviolet, an ultraviolet absorbent is added into the conventional LED epoxy encapsulation adhesive. The ultraviolet absorbent can absorb the light with wavelength of about 290 to 400 nanometers; and by chemical redox reaction, color molecules are finally decomposed and faded, and ultraviolet resistant effect is achieved. The LED encapsulation adhesive prepared by the method overcomes the defect that the common epoxy encapsulation adhesive cannot be used for long time under the environment of ultraviolet or high temperature; and in addition, because the yellowing resistance of the adhesive is promoted, the baking temperature and the baking time in the product encapsulation process can be improved when the adhesive is used, and the mechanical property of a product is greatly improved.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy encapsulation adhesive for LEDs. Background technique [0002] Most people think that energy-saving lamps can save 4 / 5 of energy, which is a great innovation, but LEDs can save 1 / 4 of energy than energy-saving lamps, which is a greater reform of solid light sources. In addition, LED also has other advantages, such as high light quality, basically no radiation, which is a typical green lighting source; reliable and durable, low maintenance cost and so on. It is precisely because LED has the above characteristics that other solid light sources cannot match, LED will become the mainstream light source in the lighting industry in 10 years. [0003] At present, although LEDs can't meet the lighting requirements, most of the decorative lighting such as indicator lights and neon lights have applied LEDs due to their advantages such as rich light colors and long life. With the exp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J11/06H01L33/56
Inventor 姚金花
Owner SUZHOU BANGCEN TECH
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