Process for preparing crystalline silicon solar cell by secondary texturing method

Abstract

The invention relates to a method for preparing a crystalline silicon solar cell. The method specifically comprises the following steps of: 1) performing wet texturing, and performing reactive ion etching, passivation and deionization for secondary texturing; and 2) diffusing a silicon chip obtained by the step 1), and sequentially performing edge etching, removal of phosphorosilicate glass, hydrogen passivation, deposition of a silicon nitride film, silk screening of cathode, anode and back aluminum, and sintering. In the method for preparing the crystalline silicon solar cell, the method for prolonging the optical distance of light in crystalline silicon and reducing light reflection loss is mainly provided; and the crystalline silicon chip prepared by the method provided by the invention has relatively lower surface reflectivity, and the hydrogen passivation performed before the deposition of the silicon nitride film can reduce silicon dangling bonds, form Si-H, reduce surface states, increase short-circuit current and fulfill the aim of improving the conversion efficiency.

Description

technical field [0001] The invention relates to the technical field of solar cell production, in particular to a process for preparing crystalline silicon solar cells by a secondary texturing method. Background technique [0002] Among all kinds of solar cells, crystalline silicon cells have always occupied the most important position. In recent years, great achievements and progress have been made in improving efficiency and reducing cost of crystalline silicon solar cells, further enhancing its dominant position in the future photovoltaic industry. The strength of the silicon wafer's ability to reflect sunlight directly affects the performance of solar cells, and the step that directly affects the silicon wafer's ability to reflect sunlight to sunlight in the production of solar cells is the silicon wafer texturing process. The existing method of making texture mainly uses a large amount of chemical reagents and water sources for cleaning. In this way, most of the chemica...

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Problems solved by technology

The existing method of making texture mainly uses a large number of chemical reagents and water sources for cleaning, so most of the chemical reagents used in the traditional method will bring considerable pollution and danger to the operator and the environment. There is also a more commonly used method The surface treatment method is to use chemical reagents to passivate the silicon wafer and then anneal the treatment method. The disadvantage of this method is that it increases the production cost and increases the process steps. Recombination rate reduction is not very effective