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Method and apparatus for laser to induce plasma to inject into substrate

A plasma and laser-induced technology, applied in the direction of ion implantation plating, metal material coating process, coating, etc., can solve the problem of shallow implantation layer, achieve the effect of deep implantation layer, high hardness, and rapid acquisition

Inactive Publication Date: 2011-10-05
JIANGSU UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Generally speaking, the ion implantation process always has the problem of shallow implantation layer.

Method used

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  • Method and apparatus for laser to induce plasma to inject into substrate
  • Method and apparatus for laser to induce plasma to inject into substrate

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Embodiment Construction

[0024] The details and working conditions of the method and device proposed by the present invention will be described in detail below in conjunction with the accompanying drawings and examples.

[0025] The material of the workpiece is 00Cr12 heat-resistant steel. Use sandpaper to remove the oxide layer on the surface of the workpiece and polish it, and then use absolute ethanol to degrease and clean it; raise the workbench support (10) to a certain height, and place the pretreated workpiece ( 6) Fix and clamp on the workbench (7), paste the temperature sensor (21) on the surface of the workpiece, connect the pulse negative high voltage source (17) connector on the side, then lower the workbench to the working height, adjust the radiation heater ( 8), then seal the contact part (9) between the heater, the workbench support and the high-pressure vacuum chamber; paste a layer of metal foil (13) on the upper glass plate (14), and then put the glass The plate cover is on the cavi...

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Abstract

The invention relates to a method and apparatus for a laser to induce plasmas to inject into a substrate and is directed to the fields of plasma injection apparatus and plasma injection material processing technology. A high energy burst pulse strong laser initiated by a laser impacts on tinsel which absorbs the high energy burst pulse laser energy. The high energy burst pulse laser energy is instantly gasified and ionized, thereby producing hot plasmas. The hot plasmas are composed of metal ions, electrons and uncharged atoms. The plasmas absorb subsequent laser energy to expand and blast. During the blast process of the plasmas, an expulsive force between the electrons and a workpiece connected to the negative potential drives the electrons to move against the workpiece. A positive charge plate neutralizes a part of the electrons. Suction between positive valency metal ions and the negative potential workpiece drives the metal ions to move towards the workpiece. Under the superposedeffects of a shock wave effect formed in the expansion and blast of the plasmas and an attraction effect of an electric field, the metal ions hit on the workpiece at a great speed; hence the injection of the metal ions is completed.

Description

technical field [0001] The invention relates to the technical field of ion implantation devices and ion implantation material processing, in particular to a method and a device for implanting metal ions in the plasma induced by a high-energy pulsed laser into the surface layer of a substrate. Background technique [0002] Implanting ions of other elements on the surface of the material can cause changes in the properties of the substrate. For example, implanting Mo and W ions into steel can enhance the impact resistance; implanting N ions into aluminum alloys can increase hardness; implanting N, W into titanium alloys C ions can improve corrosion resistance and fatigue resistance; Al ions are injected into steel to improve heat resistance, wear resistance and corrosion resistance. This technology is suitable for semiconductors, metal materials, ceramic materials, polymer materials, optical materials, etc. surface modification. It has been widely used in the industrial field...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/317C23C14/48
CPCH01J37/32339C23C14/48H01J37/32412
Inventor 任旭东李应红皇甫喁卓汪诚阮亮何卫峰周鑫楚维张永康戴峰泽张田
Owner JIANGSU UNIV
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