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Phenolic resin mixture, epoxy resin mixture, epoxy resin composition, and cured article

A technology of epoxy resin and phenolic resin, which is applied in the field of novel phenolic resin mixture, can solve problems such as cracking and achieve the effect of easy manufacture

Active Publication Date: 2011-10-05
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the plating thickness is reduced, cracks tend to occur during thermal shock, and high resistance to solder cracking is required for wiring substrates.

Method used

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  • Phenolic resin mixture, epoxy resin mixture, epoxy resin composition, and cured article
  • Phenolic resin mixture, epoxy resin mixture, epoxy resin composition, and cured article
  • Phenolic resin mixture, epoxy resin mixture, epoxy resin composition, and cured article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0185] (1) Chloromethylation reaction of biphenyl

[0186] Into a 300 mL glass flask equipped with a stirrer, a thermometer, and a condenser, 200 mL of cyclohexane, 77.05 g of biphenyl, 33.55 g of paraformaldehyde, and 46.38 g of zinc chloride were added. While vigorously stirring this, hydrogen chloride gas was forcefully blown thereinto, and the reaction was carried out until a uniform solution was obtained. During this period, the liquid temperature was maintained at 50°C. Further, the temperature of the liquid was lowered by 30°C, and hydrogen chloride gas was blown thereinto for 24 hours to continue the reaction to obtain a reaction liquid.

[0187] A small amount of the resulting reaction solution was taken to make a dichloromethane solution for GC-MS determination. As a result, 2.5% of mono(chloromethyl)biphenyl, 72.0% of dichloromethylbiphenyl, 14.9% of tris(chloromethyl)biphenyl, and 5.8% of tetrakis(chloromethyl)biphenyl were detected. In addition, as by-products ...

Embodiment 2

[0194] Synthesis of epoxy resin mixture

[0195] 26.3 g of the phenolic resin mixture of the present invention obtained in Example 1, 52.0 g of epichlorohydrin, 8.6 g of dimethyl sulfoxide, and 30% by weight of sodium hydroxide were added to a 300 mL glass flask equipped with a stirrer, a thermometer, and a condenser. 12.3 g of the aqueous solution was stirred and mixed at 45° C. for 1 hour. Then, 3.95 g of flaky sodium hydroxide was added thereto in portions, stirred at 45° C. for 2 hours, and then stirred at 70° C. for 1 hour. After diluting by adding methyl isobutyl ketone to the obtained reaction liquid, water was added and washed with water by liquid / liquid separation. 0.93 g of 30 weight% sodium hydroxide aqueous solution was added to the obtained organic layer, and it stirred at 70 degreeC for 1 hour. Water washing was performed again by liquid / liquid separation in the same manner as above. The obtained reaction solution was concentrated to obtain 20.5 g of the epoxy...

Embodiment 3 and comparative example 1

[0199] Preparation of Flame Retardant Resin Composition and Evaluation of Its Cured Product

[0200] Use the epoxy resin mixture of the present invention that embodiment 2 gains, or the phenol-biphenyl aralkyl type epoxy resin NC-3000 (57.4 ℃ of softening points, ICI viscosity 0.08 of Nippon Kayaku Co., Ltd. system as comparative example) Pa s, epoxy equivalent 277g / eq, the number average molecular weight measured by GPC is 793, the weight average molecular weight is 1229), prepares the flame retardant resin composition of composition shown in following table 1, with transfer molding machine Molding was performed at 175° C. to obtain a cured product.

[0201] [Table 1]

[0202]

[0203] (Note)

[0204] XLC-3L: phenol aralkyl resin, manufactured by Mitsui Chemicals, Ltd.

[0205] TPP: Triphenylphosphine

[0206] MSR-2212: Kyklos MSR-2212, manufactured by Ryusen Co., Ltd.

[0207] Carnauba No. 1: Carnauba Wax No. 1, manufactured by CERARICA Noda Co., Ltd.

[0208] KBM-3...

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Abstract

Disclosed is a phenolic resin mixture which is produced by subjecting a reaction product containing a by-product produced by the halomethylation of a biphenyl to the methylene cross-linking reaction with phenol. Also disclosed is an epoxy resin mixture produced by epoxidizing the phenolic resin mixture. Further disclosed is an epoxy resin composition containing the epoxy resin mixture. A cured product of the epoxy resin mixture or the epoxy resin composition containing the epoxy resin mixture has excellent flame retardancy, and has a storage modulus that is lower than those of conventional flame-retardant cured epoxy resin products by a value falling within a specific range at 250 DEG C. Therefore, the epoxy resin mixture or the epoxy resin composition containing the epoxy resin mixture is useful as a semiconductor sealing material that is required to have high flame retardancy and excellent lead-free solder resistance.

Description

technical field [0001] The present invention relates to novel phenolic resin mixture, epoxy resin mixture, epoxy resin composition and cured product. Background technique [0002] Epoxy resin composition exhibits excellent electrical properties, heat resistance, chemical resistance, mechanical strength, adhesiveness, moisture resistance (water resistance), dimensional stability, optical properties and other characteristics of its workability and its cured product , and are used in electrical and electronic component materials, reinforced fiber composite materials, resist materials, optical materials, liquid crystal sealing materials, overcoat materials, prepregs (prepreg), molding materials, adhesives, adhesive materials , coatings and other very wide fields. [0003] For example, examples of materials for electric and electronic components include: (1) semiconductor sealing materials, specifically (a) potting, dipping, etc. , transfer molding seal, flip chip (flip chip), ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G61/02C08G59/06C08G59/20
CPCC08G59/063C08L65/00C08L63/00C08G61/02C08G59/621
Inventor 白井一光押见克彦田中荣一须永高男
Owner NIPPON KAYAKU CO LTD
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