Inflaming-retarding epoxy resin for electronic packaging material and copper-clad plate and synthesis method thereof

An electronic packaging material and epoxy resin technology, applied in epoxy resin coatings, chemical instruments and methods, fireproof coatings, etc., can solve problems such as the prohibition of the use of phosphorus-based flame retardants, the decline in the reliability of electronic products, and toxic gases. Achieve high flame retardant efficiency, strong environmental protection, and improve the effect of flame retardancy

Active Publication Date: 2011-11-30
天津凯华绝缘材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in fact, phosphorus-based flame retardants are still not considered the most ideal environmental protection materials, because phosphorus-based flame retardants will cause oxidation of lakes and rivers due to hydrolysis, which will lead to another environmental issue; on the other hand, phosphorus-based flame

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A method for synthesizing a flame-retardant epoxy resin for electronic packaging materials and copper-clad laminates, the components and steps are as follows:

[0038] (1) In a 1L four-neck flask equipped with a heating mantle, agitator, thermometer, distillation column and condenser tube, add 560g NPEL127E (Taiwan Nanya, bisphenol A epoxy resin, epoxy value 0.5435~0.5682eq / 100g ), heated up to 120°C, turned on the vacuum pump, stirred for 0.5h, and turned off the vacuum pump;

[0039] (2) Add 139.3g of 5,5-dimethylhydantoin and 0.7g of ethyl triphenylphosphine bromide, adjust the temperature to 140-170°C and protect with nitrogen, react for 1-3 hours; the color becomes light Yellow transparent liquid, no reaction;

[0040] (3) cooling and discharging, after cooling and pressing, light yellow transparent solid flame retardant epoxy resin can be obtained;

[0041] (4) After testing, the epoxy value of the flame retardant epoxy resin is 0.133eq / 100g, the softening point...

Embodiment 2

[0043] A method for synthesizing a flame-retardant epoxy resin for electronic packaging materials and copper-clad laminates, the components and steps are as follows:

[0044] (1) In a 1L four-neck flask equipped with a heating mantle, agitator, thermometer, distillation column and condenser tube, add 520g NPEL127E (Taiwan Nanya, bisphenol A epoxy resin, epoxy value 0.5435~0.5682eq / 100g ), heated up to 120°C, turned on the vacuum pump, stirred for 0.5h, and turned off the vacuum pump;

[0045] (2) Add 79g of S-binaphthyldiol and 1.2g of ethyltriphenylphosphine bromide, raise the temperature to 130-140°C, mix well with nitrogen, then raise the temperature to 150-180°C, react for 2-4 hours, and cool down to 130~140℃;

[0046] (3) Add 96g of 5,5-dimethylhydantoin and 0.1g of ethyl triphenylphosphine bromide, adjust the temperature to 140-170°C and protect it with nitrogen, and react for 1-3 hours; the color turns light yellow Transparent liquid, no reaction;

[0047] (4) Coolin...

Embodiment 3

[0050] A method for synthesizing a flame-retardant epoxy resin for electronic packaging materials and copper-clad laminates, the components and steps are as follows:

[0051](1) In a 1L four-neck flask equipped with a heating mantle, agitator, thermometer, distillation column and condenser tube, add 522g NPEL127E (Taiwan Nanya, bisphenol A epoxy resin, epoxy value 0.5435~0.5682eq / 100g ), heat up to 120°C, turn on the vacuum pump, stir for 0.5h, and turn off the vacuum pump;

[0052] (2) Add 43.5g of S-binaphthyldiol and 1.13g of ethyltriphenylphosphine bromide, raise the temperature to 130-140°C, mix well with nitrogen, then raise the temperature to 150-180°C, react for 2-4 hours, and cool down to 130~140℃;

[0053] (3) After adding 66g of 4-carboxyphenylboronic acid and 0.13g of ethyltriphenylphosphine bromide, adjust the temperature to 160-190°C, react for 2-4 hours, and drop to 130-140°C;

[0054] (4) After adding 65g of 5,5-dimethylhydantoin and 0.07g of ethyltriphenylph...

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Abstract

The invention provides an inflaming-retarding epoxy resin for an electronic packaging material and a copper-clad plate and a synthesis method thereof. In the invention, the inflaming-retarding epoxy resin for the electronic packaging material and the copper-clad plate is prepared from liquid epoxy resin, polycyclic diphenol/polycyclic dicarboxylic acid, organic boric acid and a nitrogen-containing heterocyclic compound by using a sectional type synthesis method in the presence of a catalyst through controlling reaction temperature, reaction time and other conditions, wherein the epoxide number of the epoxy resin is 0.05-0.2eq/100g, the softening point of the epoxy resin is 70-130 DEG C, the nitrogen content of the epoxy resin is 0.5-5wt%, and the boron content of the epoxy resin is 0-1.6wt%. According to the invention, the inflaming-retarding property and water tolerance of the epoxy resin are further improved through combining the flame resistance of condensed ring or biphenyl and inflaming-retarding properties of nitrogen-containing heterocyclic ring and organic boron, thereby meeting the non-halogen non-phosphorus requirements of an electronic component packaging material and a copper-clad plate.

Description

technical field [0001] The invention belongs to the field of coatings for electronic packaging materials, and relates to epoxy resins, in particular to a flame-retardant epoxy resin used for electronic packaging materials and copper-clad laminates and a synthesis method thereof. Background technique [0002] Epoxy resin is a product obtained by the polycondensation reaction of a compound with an epoxy group and a polyhydric hydroxyl or polyol compound. It is one of the most widely used matrix resins in polymer-based composite materials. It has high strength, excellent Adhesiveness, chemical corrosion resistance, electrical insulation performance, mechanical properties, and easy processing, low shrinkage, small linear expansion coefficient and low cost are widely used in electronic components such as varistors, ceramic capacitors, diodes, and triodes. Device packaging. [0003] However, since the limiting oxygen index (LOI) of epoxy resin is low, only 19.5, it is a flammable...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L63/02C08K5/55C08K5/3445C09D163/00C09D163/02C09D5/18C09K3/10
Inventor 沈纪洋
Owner 天津凯华绝缘材料股份有限公司
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