Positive-type photosensitive resin composition

A technology of photosensitive resin and composition, applied in optics, optomechanical equipment, instruments, etc., can solve the problems of insufficient storage stability and low sensitivity, and achieve the effect of excellent sensitivity stability and excellent adhesion
CN102292675BActive Publication Date: 2012-08-22TORAY IND INC
3 Cites 5 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TORAY IND INC
Publication Date
2012-08-22

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350 DEG C or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a positive-type photosensitive resin composition. More specifically, the present invention relates to a positive-type photosensitive resin whose exposed portion is dissolved in an alkaline developing solution, suitable for use as a surface protective film of a semiconductor element, an interlayer insulating film, an insulating layer from an organic field to a light-emitting element, or the like combination. Background technique

[0002] Since heat-resistant resins such as polyimide and polybenzoxazole have excellent heat resistance and electrical insulation, they can be used for surface protection films of semiconductor elements such as LSI (Large Scale integration), interlayer insulating film, etc. With the miniaturization of semiconductor elements, a resolution of several μm is also required for surface protection films, interlayer insulating films, and the like. Therefore, the photosensitive polyimide composition ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More