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Positive-type photosensitive resin composition

A technology of photosensitive resin and composition, applied in optics, optomechanical equipment, instruments, etc., can solve the problems of insufficient storage stability and low sensitivity, and achieve the effect of excellent sensitivity stability and excellent adhesion

Active Publication Date: 2012-08-22
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The conventionally known photosensitive resin composition mentioned above can improve the adhesiveness with the substrate after the heat treatment, but the storage stability is insufficient, and there is a problem of low sensitivity in particular.

Method used

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  • Positive-type photosensitive resin composition
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  • Positive-type photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0092] The present invention will be described below with reference to Examples and the like, but the present invention is not limited to these examples. In addition, the evaluation of the positive photosensitive resin composition in an Example was performed by the following method.

[0093] (1) Evaluation of storage stability of sensitivity

[0094] Preparation of photosensitive resin film

[0095] A positive-type photosensitive resin composition (hereinafter referred to as varnish) was coated on a 6-inch silicon wafer so that the film thickness after prebaking was 8 μm, and then a hot plate (mark-developer Mark-Tokyo Electron Co., Ltd.) was used 7) Prebake at 120° C. for 3 minutes to obtain a photosensitive resin film.

[0096] How to measure film thickness

[0097] Using Lambda Ace STM-602 manufactured by Dainippon SCREEN Co., Ltd., the film after prebaking and development was measured with a refractive index of 1.629, and the cured film with a refractive index of 1.773....

Synthetic example 1

[0110] Synthesis Example 1 Synthesis of an acid anhydride (a) having a hydroxyl group

[0111] Under a stream of dry nitrogen, 18.3 g (0.05 moles) of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHF) and 34.2 g (0.3 moles) of allyl glycidyl ether were dissolved in 100 g of γ-butyrolactone (GBL), cooled to -15°C. 22.1 g (0.11 mol) of trimellitic anhydride acid chloride dissolved in 50 g of GBL was added dropwise so that the temperature of the reaction liquid did not exceed 0°C. After completion of the dropwise addition, the reaction was carried out at 0°C for 4 hours. The solution was concentrated with a rotary evaporator, and poured into 1 L of toluene to obtain an acid anhydride (a) having a hydroxyl group represented by the following formula.

[0112]

Synthetic example 2

[0113] Synthesis Example 2 Synthesis of diamine compound (b) having hydroxyl group

[0114] 18.3 g (0.05 mol) of BAHF were dissolved in 100 mL of acetone and 17.4 g (0.3 mol) of propylene oxide, and cooled to -15°C. Thereto, 20.4 g (0.11 mol) of 3-nitrobenzoyl chloride dissolved in 100 mL of acetone was added dropwise. After completion of the dropwise addition, the reaction was carried out at -15°C for 4 hours, and then returned to room temperature. The precipitated white solid was filtered, and vacuum-dried at 50 degreeC.

[0115] 30 g of the solid was placed in a 300 mL stainless steel autoclave, dispersed in 250 mL of methyl cellosolve, and 2 g of 5% palladium-carbon was added. Hydrogen was introduced into it with a balloon, and the reduction reaction was carried out at room temperature. After about 2 hours, the reaction was terminated after confirming that the balloon was no longer deflated. After the completion of the reaction, the palladium compound serving as a cata...

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Abstract

Disclosed is a positive-type photosensitive resin composition which has excellent storage stability, particularly excellent sensitivity stability, and can be formed into a cured film having excellent adhesion onto a substrate when heated at 350 DEG C or higher or heated in the air. The positive-type photosensitive resin composition comprises (a) a polymer having, as the main component, at least one structure selected from the group consisting of a polyimide precursor structure, a polybenzoxazole precursor structure, and a polyimide structure, (b) a quinonediazide compound, (c) a silane coupling agent having a styryl group, (d) a silane coupling agent having an epoxy group, an oxetanyl group, a methacryloxy group, an acryloxy group, an amino group, an amide group or mercapto group and an alkoxysilyl group, and (e) a solvent.

Description

technical field [0001] The present invention relates to a positive-type photosensitive resin composition. More specifically, the present invention relates to a positive-type photosensitive resin whose exposed portion is dissolved in an alkaline developing solution, suitable for use as a surface protective film of a semiconductor element, an interlayer insulating film, an insulating layer from an organic field to a light-emitting element, or the like combination. Background technique [0002] Since heat-resistant resins such as polyimide and polybenzoxazole have excellent heat resistance and electrical insulation, they can be used for surface protection films of semiconductor elements such as LSI (Large Scale integration), interlayer insulating film, etc. With the miniaturization of semiconductor elements, a resolution of several μm is also required for surface protection films, interlayer insulating films, and the like. Therefore, the photosensitive polyimide composition ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/023C08G73/10C08G73/22G03F7/075H01L21/027
CPCC08L79/04G03F7/0751G03F7/0233C08K5/29C08G73/22C08K5/5425C08L79/08C08K5/5435C08G73/10C08L63/00G03F7/022G03F7/039
Inventor 宫部伦次藤田阳二
Owner TORAY IND INC
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