Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof

A high thermal conductivity, silicone technology, applied in chemical instruments and methods, adhesives, adhesive additives, etc., can solve the problems of lack of fluidity, incapable of electronic potting, etc., to make up for low thermal conductivity, excellent fluidity, The effect of high thermal conductivity

Active Publication Date: 2012-02-01
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese invention patent 200810219101.2 discloses a heat-conducting and flame-retardant liquid silicone rubber for electronics, although it has a high thermal conductivity (thermal conductivity: 1.5-2.5W m -1 ·K -1 ) and flame retardant properties, but because of its viscosity above 20Pa s, it lacks good flow properties and cannot be used as an electronic potting compound

Method used

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  • Additive high-thermal-conductivity organic silicon electronic pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] 100 parts by mass of linear vinyl siloxane with a viscosity of 200 mPa·s and a vinyl content of 0.8 wt %, 425 parts by mass of spherical aluminum oxide with a diameter of 50 μm, and 45 parts by mass of boron nitride with a diameter of 0.1 μm. Add 30 parts by mass of silicon carbide whiskers with a diameter of 2.5 μm and an aspect ratio of 20 into a vacuum kneader, dehydrate and blend for 120 minutes at a temperature of 120°C and a vacuum of 0.08 MPa, and grind 3 times with a three-roller machine to obtain a base material .

[0029] 11.9 parts by mass of a hydrogen-containing silicone oil crosslinking agent with a hydrogen content of 0.1%, an appropriate amount of a crosslinking inhibitor, and 100 parts by mass of a base material were fully stirred and mixed for 20 minutes to obtain component A. An appropriate amount of platinum catalyst and 100 parts by mass of the base material were stirred and mixed under a mixer for 20 minutes to obtain component B.

[0030] Take eq...

Embodiment 2

[0032] 80 parts by mass of linear vinyl siloxane with a viscosity of 1000 mPa·s and a vinyl content of 0.3 wt%, 20 parts by mass of a branched vinyl siloxane with a viscosity of 450 mPa·s and a vinyl content of 3.0 wt%. Parts by mass, 100 parts by mass of spherical aluminum oxide of 1 μm, 20 parts by mass of spherical aluminum oxide of 50 μm, 76 parts by mass of boron nitride of 5 μm, silicon carbide whiskers with a diameter of 0.05 μm and an aspect ratio of 10 4 The parts by mass were put into a vacuum kneader, dehydrated and blended for 120 minutes at a temperature of 120° C. and a vacuum of 0.08 MPa, and then ground three times with a three-roll machine to obtain a base material.

[0033] 7.5 parts by mass of a hydrogen-containing silicone oil crosslinking agent with a hydrogen content of 0.3%, an appropriate amount of a crosslinking inhibitor, and 100 parts by mass of a base material were fully stirred and mixed for 20 minutes to obtain component A. An appropriate amount o...

Embodiment 3

[0036]100 parts by mass of linear vinyl siloxane with a viscosity of 500 mPa·s and a vinyl content of 0.45 wt %, 160 parts by mass of spherical aluminum oxide of 5 μm, 30 parts by mass of boron nitride of 2 μm, and a diameter of 0.5 10 parts by mass of silicon carbide whiskers with μm and an aspect ratio of 40 were put into a vacuum kneader, dehydrated and blended for 120 minutes at a temperature of 120°C and a vacuum of 0.08 MPa, and then ground three times with a three-roll machine to obtain a base material.

[0037] 8.2 parts by mass of a hydrogen-containing silicone oil crosslinking agent with a hydrogen content of 0.22%, an appropriate amount of a crosslinking inhibitor and 100 parts by mass of a base material were fully stirred and mixed for 20 minutes to obtain component A. An appropriate amount of platinum catalyst and 100 parts by weight of the base material were stirred and mixed under a mixer for 20 minutes to obtain component B.

[0038] Take equal parts of compone...

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Abstract

The invention discloses an additive high-thermal-conductivity organic silicon electronic pouring sealant and a preparation method thereof. The preparation method comprises the following steps of: adding vinyl-ended polydimethylsiloxane, spherical aluminum oxide, boron nitride and silicon carbide whiskers into a kneader, dehydrating and blending at the temperature of 100-150 DEG C and under the vacuum degree of 0.06-0.1MPa, cooling, and grinding for three times to obtain a substrate; adding a hydrogen-containing silicon oil crosslinking agent and a crosslinking inhibitor into the substrate at normal temperature, and fully stirring to prepare a component A; adding a platinum catalyst into the substrate, and fully stirring to prepare a component B; and uniformly blending the component A and the component B having equal part by weight, and defoaming under the vacuum degree of 0.06-0.1MPa to obtain the additive high-thermal-conductivity organic silicon electronic pouring sealant. The pouring sealant has high flowability and thermal conductivity of higher than 1.0 W.m<-1>.K<-1>, and can be widely applied to the fields of electronic apparatuses, automobiles, chip encapsulation, LED (Light-Emitting Diode) encapsulation and the like having high requirements on heat conducting performance; and a condensate has high mechanical property and high electrical property.

Description

technical field [0001] The invention relates to the technical field of electronic potting materials, in particular to organic silicon electronic potting glue and its preparation technology. Background technique [0002] Addition-type silicone rubber generally uses vinyl-containing polydimethylsiloxane as the base polymer, hydrogen-containing silicone oil as the cross-linking agent, and is cross-linked into an elastomer through a hydrosilylation reaction under the action of a platinum catalyst. Compared with condensation-type silicone rubber, addition-type silicone rubber does not release low-molecular by-products during the vulcanization process, has extremely small shrinkage, can be vulcanized deeply, has no corrosion, and is easy to control the cross-linking structure. The vulcanized product can be vulcanized at room temperature and With the advantages of heating and vulcanization, it is the first choice material for electronic potting adhesives recognized at home and abro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/04C08K7/10C08K3/22C08K3/38C09J183/07C09J183/05C09J11/04C09K3/10
Inventor 陈精华曾幸荣胡新嵩林晓丹李国一李豫黄德裕罗伟
Owner SOUTH CHINA UNIV OF TECH
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