Two-layered flexible substrate, and copper electrolyte for producing same

A technology of flexible substrates and copper electrolytes, applied in the fields of printed circuit manufacturing, circuit substrate materials, electrical components, etc.

Inactive Publication Date: 2012-02-08
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for a double-layer flexible substrate in which a base metal layer is formed by sputtering on an insulator film such as polyimide, and then a copper layer of a predetermined thickness is produced by electroplating, when the copper layer is formed by electroplating, due to the formation of the copper core, The production is disordered, so only crystals with a grain size of less than 1 μm can be obtained

Method used

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  • Two-layered flexible substrate, and copper electrolyte for producing same
  • Two-layered flexible substrate, and copper electrolyte for producing same
  • Two-layered flexible substrate, and copper electrolyte for producing same

Examples

Experimental program
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Embodiment 1～13、 comparative example 1～7

[0057] The additives were added to an aqueous solution prepared with copper sulfate and sulfuric acid to the following concentrations, and the polyimide film with the base metal layer was electroplated under the following plating conditions to produce a copper film of about 8 μm. The plating temperature is 40° C., and the additives and their addition amounts are listed in Table 1. In addition, in Table 1, the unit of the addition amount of an additive is ppm. Hydrochloric acid was used as the source of chloride ions.

[0058] Liquid capacity: 1700ml

[0059] Anode: lead electrode

[0060] Cathode: a wound electrode formed by winding a polyimide film with a base metal layer

[0061] Polyimide film with base metal layer:

[0062] Formed on 37.5μm thick kapton E (manufactured by DuPont) Thick Ni-Cr, then sputtered to form 2000□ thick copper.

[0063] Current time: 2800As

[0064] Current density: 5→15→25→40A / dm 2 , hold each current density for 35 seconds in this order ...

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Abstract

Disclosed is a two-layered flexible substrate which has excellent bending endurance, and furthermore, wherein Kirkendall voids do not arise even if a chip-on-film lead section is tin plated and heat treatment is performed. The disclosed two-layered flexible substrate is provided with a copper layer using a copper electrolyte on one or both faces of an insulating film, and is characterized by the copper crystal grains forming the aforementioned copper layer having a grain size of at least 1 [mu]m and no more than the thickness of the copper layer, and by X-ray diffraction of the aforementioned copper layer having a ratio of the (200) peak strength to the sum of the main six peak strengths { (200) peak strength / ( sum of (111), (200), (220), (311), (400), and (331) peak strengths) } of at least 0.4. Furthermore, the copper electrolyte for forming the aforementioned copper layer is characterized by including as an additive at least one of chloride ions, thiourea, a thiourea derivative, and thiosulfuric acid.

Description

technical field [0001] The present invention relates to a double-layer flexible substrate, and a copper electrolytic solution used in its manufacture, and more specifically, to a double-layer flexible substrate in which a copper layer is formed on an insulator film, and a copper electrolytic solution used in its manufacture. liquid. Background technique [0002] Double-layer flexible substrates are attracting attention as substrates for manufacturing flexible wiring boards. Double-layer flexible substrates are formed by directly placing a copper conductor layer on an insulator film without using an adhesive, so it has the following advantages: the thickness of the substrate itself can be reduced, and the thickness of the coated copper conductor layer can be adjusted to Any thickness. When manufacturing such a double-layer flexible substrate, generally, a base metal layer is formed on an insulator film, and then copper is electroplated on it. [0003] However, in the base ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00B32B15/08C25D3/38H05K1/03
CPCC25D3/38C25D5/56C25D7/00C30B7/12C30B29/02H05K1/0393H05K1/09H05K2203/0723Y10T428/12063Y10T428/25C25D5/617
Inventor 花房干夫
Owner JX NIPPON MINING & METALS CORP
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