Preparation method for silicon carbide preform based on water-based adhesive

Abstract

The invention discloses a preparation method for a silicon carbide preform based on a water-based adhesive. The method comprises the following steps of: composing the water-based adhesive by aluminium dihydrogen phosphate, wax emulsion and deionized water, and preheating silicon carbide particles and the water-based adhesive at first; then adding the silicon carbide particles and the water-based adhesive in a kneading machine at 50-70 DEG C, stirring and mixing while heating, and volatilizing water; when the water content of the mixture is 4-6%, taking out the mixture from the kneading machine and drying the mixture in an oven at 90-120 DEG C; and then sieving and granulating the dried mixture, performing dry-pressing moulding and sintering treatment on the granulated powder to obtain the silicon carbide preform. The method is simple in technical process, good in the flowability of granulated powder, low in sintering temperature and capable of moulding to prepare large-size preform; and the preform is high in open porosity and strength.

Description

technical field [0001] The invention relates to a method for preparing a silicon carbide prefabricated part based on a water-based adhesive, and belongs to the technical field of preparation of metal-based composite materials for electronic packaging. Background technique [0002] The thermal expansion coefficients of traditional packaging metal materials aluminum alloy and oxygen-free copper are large, and the expansion coefficients of substrates such as aluminum oxide, aluminum nitride, and low-temperature co-fired ceramics are greatly different; thermal conductivity of expansion alloys represented by Kovar alloys is low ; W ~ Cu alloy density, there are some deficiencies. High volume fraction silicon carbide particles reinforced aluminum matrix composites (hereinafter referred to as: aluminum silicon carbide) can be designed according to the needs of different product performance. Thermal expansion coefficient, thermal conductivity, and air tightness are important perfor...

AI Technical Summary

Problems solved by technology

[0004] The Chinese patent No. 02139732.5 uses an aluminum phosphate solution and a binder composed of polyethylene glycol, dextrin, and glutinous rice flour to prepare silicon carbide prefabricated parts. The binder granulation powder has poor fluidity and low bonding strength, making it difficult to form large-scale prefabricated parts; on the other hand, the aluminum phosphate solution is self-prepared, which is not suitable for large-scale industrial production

[0005] The Chinese patent No. 200780014043.3 uses silica sol as the adhesive for silicon carbide preforms. On the one hand, the strength of the preform is low, and on the other hand, the sintering temperature is high, resulting in the formation of amorphous silicon oxide on the surface of silicon carbide particles, which affects the final Thermal Conductivity of Composite Materials

Images