Halogen-free and lead-free solder paste and preparation method

A technology of halogen-free lead-free solder paste and lead electronics, which is applied in the field of electronic soldering materials, can solve the problems that the quality of solder paste cannot meet the requirements, the active temperature and activity of flux components are not good, and achieve the best ICT test performance, contact Excellent denaturing performance and less corrosive effect

Active Publication Date: 2012-07-04
惠州市斯泰尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Since July 1, 2006, electronic products put on the market must not contain harmful substances such as lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers. For this reason, lead-free solders have been developed and applied all over the world in recent years. In order to reduce environmental pollution and maintain product safety, but the solder paste produced by lead-

Method used

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  • Halogen-free and lead-free solder paste and preparation method
  • Halogen-free and lead-free solder paste and preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0028] Take 30g of diethylene glycol monobutyl ether, 7g of castor oil, and 13g of polyisobutylene and add them into a temperature-controlled emulsifier for heating, stir at a temperature of 120°C at a speed of 200r / min for 10 minutes, and then add 7.0g of white petrolatum , 20g of polymerized rosin 604#, 14g of special-grade hydrogenated rosin AX-E were added in turn and stirred at a speed of 800r / min for 10 minutes to obtain a mixed solution, cooled to 100°C, and 1.0g of succinic acid, 1.0 g of sebacic acid and 2.0 g of glutaric acid were stirred at a speed of 1000 r / min for 10 minutes to obtain a secondary mixed solution, cooled to a temperature of 70 ° C, and 4.0 g of polyamide wax was added and stirred at a speed of 1200 r / min for 10 minutes to obtain Cool the mixed solution three times to 55°C, add 0.4g fluorocarbon surfactant FS100 and 0.6g diethanolamine in turn, stir at 1200r / min for 5 minutes, then evacuate to a vacuum value of 0.06MPa while stirring, until the temper...

Embodiment 2

[0030] Take 23.8g of diethylene glycol monobutyl ether, 8g of castor oil, and 12g of polyisobutylene, add them into a temperature-controlled emulsifier and heat them, stir at 125°C at a speed of 200r / min for 5 minutes, and then add 8.0g of white Petroleum jelly, 20g of polymerized rosin 604#, 15g of special-grade hydrogenated rosin AX-E were added sequentially and stirred at a speed of 800r / min for another 5 minutes to obtain a mixed solution, cooled to 105°C, and 2.0g of succinic acid, 2.0 g of sebacic acid and 3.0 g of glutaric acid were stirred at a speed of 1000 r / min for 5 minutes, and the temperature of the secondary mixed solution was lowered to 75 ° C, and 5.0 g of polyamide wax was added and stirred at a speed of 1200 r / min for 5 minutes. The temperature of the mixed solution obtained three times was lowered to 50°C, and 0.4g of fluorocarbon surfactant FS100 and 0.8g of diethanolamine were added in sequence, and then stirred at a speed of 1200r / min for 5 minutes, and t...

Embodiment 3

[0032]Take 26.3g of diethylene glycol monobutyl ether, 6g of castor oil, and 15g of polyisobutylene into a temperature-controlled emulsifier for heating, stir at 120°C at a speed of 200r / min for 10 minutes, and then add 5.0g of white Petroleum jelly, 25g of polymerized rosin 604#, 14g of special-grade hydrogenated rosin AX-E were added sequentially and stirred for another 10 minutes at a speed of 800r / min to obtain a primary mixed solution, which was cooled to 100°C, and 1.0g of succinic acid, 1.0 g of sebacic acid and 2.0 g of glutaric acid were stirred at a speed of 1000 r / min for 10 minutes to obtain a secondary mixed solution cooled to a temperature of 70 ° C, and 4.0 g of polyamide wax was added and stirred at a speed of 1200 r / min for 10 minutes to obtain The temperature of the three mixed solutions was lowered to 50°C, and 0.2g of fluorocarbon surfactant FS100 and 0.5g of diethanolamine were added in sequence, and then stirred at a speed of 1200r / min for 10 minutes, and ...

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Abstract

The invention relates to a halogen-free and lead-free solder paste and a preparation method. The preparation method is characterized in that the method comprises the steps of adding diethylene glycol monobutyl ether, castor oil and polyisobutene in a temperature control emulsifying machine and mixing, then adding albolene, polymerized rosin and hydrogenated rosin and mixing again to obtain first mixing solution, reducing the temperature of the first mixing solution, adding succinic acid, sebacic acid and glutaric acid, and mixing again to obtain second mixing solution, reducing the temperature of the second mixing solution, adding polyamide wax and mixing again to obtain third mixing solution, reducing the temperature of the third mixing solution, adding a fluorocarbon surfactant and diethanol amine, then stirring and vacuuming until the temperature is restored to the room temperature, standing for 24h with low temperature, then adding lead-free electronic-grade tin alloyed powder Sn96.5Ag3.0Cu0.5, and stirring to obtain the halogen-free and lead-free solder paste. After being welded, the halogen-free and lead-free solder paste has the advantages and effects of fewer residues, extremely high surface insulation resistance, low corrosion, no needing of cleaning, good thixotropic property and electric conductivity, bright welding points after welding and incapability of collapsing easily.

Description

technical field [0001] The invention relates to a halogen-free lead-free solder paste, which is used for spot coating welding of connectors and belongs to the field of electronic welding materials. [0002] The invention also relates to a preparation method of the halogen-free lead-free solder paste. technical background [0003] Since July 1, 2006, electronic products put on the market must not contain harmful substances such as lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers. For this reason, lead-free solders have been developed and applied all over the world in recent years. In order to reduce environmental pollution and maintain product safety, but the solder paste produced by lead-free solder contains halides such as fluorine, chlorine, bromine and iodine in the flux used, in accordance with the IEC halogen-free standard, the EU "RoHS" standard and the US IPC- TM-650, Halogens are prohibited. At present, there...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 胡玉朱君竺周志峰
Owner 惠州市斯泰尔科技有限公司
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