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Thermosetting resin compound containing carboxyl modified polyurethane resin

A technology of resin composition and carboxyl modification, applied in the direction of epoxy resin glue, epoxy resin coating, polyurea/polyurethane adhesive, etc., can solve the problem of difficult to balance heat resistance, difficult to express flexibility, resin gel Solve problems such as melting, and achieve the effect of combining flexibility, excellent heat resistance, and excellent flux resistance

Active Publication Date: 2012-07-04
TOYO INK SC HOLD CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019] However, these butadiene-based resins have the following problems: they must be reacted at high temperature, or due to intramolecular cross-linking due to oxidation specific to the butadiene skeleton, the resin gels during the reaction, or the preservation of the composition is difficult. Significantly less stability
However, since the main chain is an ester skeleton with poor hydrolyzability, there is a problem that the insulation reliability and chemical resistance at high temperature humidification are significantly deteriorated.
In addition, since the dibasic acid is used as the main raw material, it is difficult to achieve flexibility and heat resistance compared to the system using urethane resin or NBR rubber.

Method used

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  • Thermosetting resin compound containing carboxyl modified polyurethane resin
  • Thermosetting resin compound containing carboxyl modified polyurethane resin
  • Thermosetting resin compound containing carboxyl modified polyurethane resin

Examples

Experimental program
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Effect test

Embodiment

[0182] The following examples illustrate the present invention more specifically, but the following examples do not limit the scope of rights of the present invention. In addition, "part" and "%" in an Example represent "weight part" and "weight%", respectively, and Mw means a weight average molecular weight.

[0183]

[0184] For the measurement of Mw, GPC (gel permeation chromatography) "HPC-8020" manufactured by Tosoh Corporation was used. GPC is a liquid chromatography that separates and quantifies substances dissolved in a solvent (THF:tetrahydrofuran) based on the difference in molecular size. In the measurement of the present invention, the chromatographic column is used after connecting two "LF-604" (manufactured by Showa Denko Co., Ltd.: GPC chromatographic column for rapid analysis: size 6mmID × 150mm) in series. It carried out under the condition of 40 degreeC, and the determination of the weight average molecular weight (Mw) was performed in terms of polystyrene...

manufacture example 1

[0186] 292.1 parts of polycarbonate diol (Kuraray Polyol C-2090: manufactured by Kuraray Co., Ltd.: 3-methyl-1, 5-pentanediol / 1,6-hexanediol=9 / 1 (molar ratio) polycarbonate diol: hydroxyl value=56mgKOH / g, Mw=2000), 44.9 parts of tetrahydrophthalic anhydride ( RIKACID TH: manufactured by Nippon Chemical Co., Ltd.) and 350 parts of toluene as a solvent were heated up to 60°C while stirring under a nitrogen stream, and were uniformly dissolved. Next, the temperature of the flask was raised to 110° C., and the reaction was carried out for 3 hours. Then, after cooling to 40° C., 62.9 parts of bisphenol A type epoxy resin (YD-8125: manufactured by Tohto Kasei Co., Ltd.: epoxy equivalent = 175 g / eq) and 4 parts of triphenylphosphine as a catalyst were added, and the temperature was raised. To 110°C, react for 8 hours. After cooling to room temperature, 11.8 parts of tetrahydrophthalic anhydrides were added, and it was made to react at 110 degreeC for 3 hours. After cooling to room...

manufacture example 2～36、 comparative manufacture example 1～9

[0188] Except having changed to the material shown in Tables 1-3, it carried out similarly to manufacture example 1, and obtained the carboxyl group containing modified ester resin (A) solution of this invention.

[0189]

[0190]

[0191]

[0192] C-2090: manufactured by Kuraray Co., Ltd., 3-methyl-1,5-pentanediol / 1,6-hexanediol=9 / 1 (molar ratio) polycarbonate diol

[0193] T-5652: Asahi Kasei Chemical Co., Ltd., C5C6 copolymerized polycarbonate diol

[0194] UHC50-200: manufactured by Ube Industries, Ltd., 1,6-hexanediol / caprolactone=5 / 5 copolymerized polycarbonate diol

[0195] UC-100: Ube Industries, Ltd., 1,4-cyclohexanedimethanol-based polycarbonate diol

[0196] UM90(1 / 3): Ube Industries Co., Ltd., 1,4-cyclohexanedimethanol / 1,6-hexanediol=1 / 3 copolymerized polycarbonate diol

[0197] UM90(1 / 1): manufactured by Ube Industries, Ltd., 1,4-cyclohexanedimethanol / 1,6-hexanediol=1 / 1 copolymerized polycarbonate diol

[0198] UM90(3 / 1): manufactured by Ube Industries...

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Abstract

Provided is a thermosetting resin compound containing carboxyl modified polyurethane resin, characterized by comprising the carboxyl modified polyurethane resin (A) which is at least one compound selected from a group consisting of an epoxy group contained compound, an isocyanate contained compound, and a closed isocyanate group contained compound, and a thermofixation assistant (C). The carboxyl modified polyurethane resin (A) is formed by making the polyatomic compound (a) and at least one anhydride group compound (b) selected from ring type multielement anhydride and aromatic aromatic anhydride produce reaction to generate carboxyl ester resin (c). Then the carboxyl ester resin (c) is made to react with an epoxy compound (d) in I molecules having at least two epoxy groups to produce side chain hydroxyl modified ester resion (e). Then the anhydride group compound (b) is made to react with the side chain hydroxyl modified ester resion (e) to generate the carboxyl modified polyurethane resin (A).

Description

technical field [0001] This invention relates to thermosetting resin compositions for adhesives and coatings. Furthermore, it is related with the thermosetting resin composition used as an adhesive agent and a coating agent for the periphery of electronic materials including a printed wiring board. Background technique [0002] In recent years, the development of the field of electronics has been very significant, especially the miniaturization, weight reduction, and high density of electronic instruments, so that the requirements for these performances are getting higher and higher. In response to such demands, research on thinning, multilayering, and high-definition electronic materials such as printed wiring boards is being actively carried out. Along with this, the adhesives and coating agents used in them require high flexibility, bendability, and adhesion that are not required for thick rigid substrates represented by conventional glass epoxy and the like. properties...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/42C08G59/20C08G18/42C08G18/44C08G18/48C08G18/69C08G18/61C09J163/00C09J175/04C09D163/00C09D175/04H05K1/02
CPCC08G18/4263C08G59/4276C08G63/47C08G63/91C08K5/1515C08L63/00C08L67/08C08L75/06H05K1/03
Inventor 荻原直人小林英宣瞿晟户崎广一松户和规
Owner TOYO INK SC HOLD CO LTD
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