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Thermoplastic polyimide resin and preparation method thereof

A polyimide resin and thermoplastic technology, applied in the field of thermoplastic polyimide resin and its preparation, can solve the problems of difficult synthesis, lowering the glass transition temperature of polymers, and impossibility of large-scale application, etc., and achieve good thermal stability , the effect of wide application

Active Publication Date: 2012-08-15
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the above-mentioned first method can effectively improve thermoplasticity and solubility, it is at the expense of reducing the glass transition temperature of the polymer.
In the second method, due to the difficulty in the synthesis of monomers with large side groups or asymmetric structures, it cannot be applied on a large scale

Method used

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  • Thermoplastic polyimide resin and preparation method thereof
  • Thermoplastic polyimide resin and preparation method thereof
  • Thermoplastic polyimide resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] In the present embodiment, the structural formula of thermoplastic polyimide resin is:

[0052]

[0053] The preparation route of this thermoplastic polyimide resin is as follows figure 1 As shown, where A and B are groups: Concrete preparation method comprises the following steps:

[0054] Step 1: At room temperature, 2.5949 grams (0.006 moles) of 4,4'-bis(3-aminophenoxy)diphenyl sulfone and 16 milliliters of N-methylpyrrolidone were added to an agitator equipped with nitrogen protection in the reactor. After 4,4'-bis(3-aminophenoxy)diphenyl sulfone is completely dissolved, add 0.6216 grams (0.00285 moles) of 1,2,3,4-pyrellitic dianhydride, 0.6216 grams (0.00285 moles ) of pyromellitic dianhydride and 0.0889 grams (0.0006 moles) of phthalic anhydride, stirred and reacted for 2 to 24 hours to obtain a light yellow transparent viscous liquid;

[0055] Step 2: Add 8 ml of xylene to the reaction system obtained in step 1, raise the temperature to 180°C, reflux with...

Embodiment 2

[0059] In the present embodiment, the structural formula of thermoplastic polyimide resin is:

[0060]

[0061] The concrete preparation method of this thermoplastic polyimide resin comprises the steps:

[0062] Step 1: At room temperature, 2.5949 grams (0.006 moles) of 4,4'-bis(3-aminophenoxy)diphenyl sulfone and 10 milliliters of m-cresol were added to a reactor equipped with a stirrer and nitrogen protection middle. After 4,4'-bis(3-aminophenoxy)diphenyl sulfone is completely dissolved, add 0.9767 grams (0.00448 moles) of pyromellitic dianhydride, 0.3255 grams (0.00149 moles) of pyromellitic dianhydride , 0.0089 grams (0.00006 moles) of phthalic anhydride and 6 drops of isoquinoline, then the reaction system was heated to 200 ° C and reacted for 8 hours. During the reaction process, the water generated by the reaction is removed from the reaction system by a water removal device to obtain a polyimide solution.

[0063] Step 2: After the reaction system is cooled, drop...

Embodiment 3

[0066] In the present embodiment, the structural formula of thermoplastic polyimide resin is:

[0067]

[0068] The concrete preparation method of this thermoplastic polyimide resin is to comprise the steps:

[0069] Step 1: At room temperature, 2.4631 g (0.006 mol) of 2-bis[4-(4-aminophenoxy)]propane and 16 ml of N-methylpyrrolidone were added to a reaction with a stirrer and nitrogen protection device. After 2-bis[4-(4-aminophenoxy)]propane is completely dissolved, add 0.6445 grams (0.002955 moles) of 1,2,3,4-pyrellitic dianhydride, 0.6445 grams (0.002955 moles) Pyromellitic dianhydride and 0.0267 grams (0.00018 moles) of phthalic anhydride were stirred and reacted for 2 to 24 hours to obtain light yellow transparent viscous liquid;

[0070] Step 2: Add 8 ml of xylene to the reaction system obtained in step 1, raise the temperature to 180°C, reflux with water for 6 hours, and after the water in the reaction system is exhausted, raise the temperature to 185°C to continue...

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Abstract

The invention discloses thermoplastic polyimide resin and a preparation method thereof. According to the thermoplastic polyimide resin, 1, 2, 3, 4--biphenyl-tetracarboxylic acid dianhydride (BPDA) is reacted with other mixed dianhydride formed by common tetracarboxylic acid dianhydride, diamine and phthalic anhydride or aniline to polymerize the mixed dianhydride with the diamine, and the phthalic anhydride or the aniline serves as a blocking agent to control molecular weight, thus obtaining the polyimide resin with good thermal stability and excellent thermoplastic processability. The inherent viscosity of the polyimide resin can reach 0.22dL / g to 0.90dL / g, and the glass-transition temperature of the polyimide resin ranges from 220 DEG C to 420 DEG C, therefore, the polyimide resin has wide application in the preparation of materials such as thermostability engineering plastics, thin films, adhesives and the like.

Description

technical field [0001] The invention relates to the technical field of polyimide materials, in particular to a thermoplastic polyimide resin and a preparation method thereof. Background technique [0002] Polyimide is widely used in electronics, microelectronics, aerospace, etc. due to its excellent heat resistance, low temperature resistance, solvent resistance and flame retardancy, as well as excellent dielectric and mechanical properties , laser, photoelectric and other fields. At the same time, due to the rigid molecular chain and the strong interaction force between molecules of polyimide, it is difficult to dissolve and melt the polymer, which limits the application range of polyimide. [0003] In order to solve the above problems and improve the solubility and melt processability of polyimide, researchers currently focus on the following methods: first, introducing flexible groups into the main chain molecules, such as -O-, -S-, -CH 2 - etc., reduce the rigidity of...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08L79/08C09J179/08
Inventor 方省众张畏锋陈国飞魏海兵王静刚
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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