Conductive paste
A technology of conductivity and paste, which is applied in the direction of conductive coating, conductive pattern formation, conductive layer on insulating carrier, etc., can solve the problems such as difficulty in obtaining paste, and achieve excellent line width reproducibility, good conductivity, and close adhesion excellent effect
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[0104] Example
[0105] Hereinafter, examples and comparative examples are shown to specifically describe the present embodiment, but the present invention is not limited to these examples. In addition, the following "%" is a mass basis unless otherwise specified. In addition, the weight average molecular weight is calculated using gel carrier liquid chromatography (HLC-8120 GPC TOSOH CORPORATION) in terms of polystyrene. .
[0106] Synthesis of organic binder resin
Example Embodiment
[0107] Synthesis example 1
[0108] In a reaction vessel equipped with a stirring device, a thermometer, and a condenser, 288 g (0.36 mol) of polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol was added as a polyol component ( Asahi Kasei Chemicals Corporation, T5650J, number average molecular weight 800), 45g (0.09mol) bisphenol A type propylene oxide adduct diol (ADEKA CORPORATION, BPX33, number average molecular weight 500), 81.4g (0.55mol) ) Dimethylolbutyric acid as dimethylolalkanoic acid, 11.8g (0.16mol) of n-butanol as a molecular weight regulator (reaction terminator), and 250g of carbitol acetate as a solvent (manufactured by Daicel Corporation) , Dissolve all the raw materials at 60°C.
[0109] While stirring the polyol component, 200.9 g (1.08 mol) of trimethylhexamethylene diisocyanate as a polyisocyanate was added dropwise through a dropping funnel. After the dropping was terminated, the reaction was continued while stirring at 80°C, and the absorpt...
Example Embodiment
[0111] Synthesis Example 2
[0112] In a reaction vessel equipped with a stirring device, a thermometer, and a condenser, 360g (0.45mol) of polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol was added as a polyol component ( Asahi Kasei Chemicals Corporation, T5650J, number average molecular weight 800), 81.4g (0.55mol) of dimethylolbutyric acid as dimethylolalkanoic acid, and 11.8g (0.16mol) as molecular weight regulator (reaction terminator) N-butanol, 250 g of carbitol acetate (manufactured by Daicel Corporation) as a solvent, all the raw materials were dissolved at 60°C.
[0113] While stirring the polyol component, 200.9 g (1.08 mol) of trimethylhexamethylene diisocyanate as a polyisocyanate was added dropwise through a dropping funnel. After the dropping was terminated, the reaction was continued while stirring at 80°C, and the absorption spectrum of the isocyanate group (2280cm -1 ) Disappears and the reaction ends. Carbitol acetate was added so that the s...
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