Conductive paste

A technology of conductivity and paste, which is applied in the direction of conductive coating, conductive pattern formation, conductive layer on insulating carrier, etc., can solve the problems such as difficulty in obtaining paste, and achieve excellent line width reproducibility, good conductivity, and close adhesion excellent effect

Inactive Publication Date: 2012-10-17
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is a problem that it is difficult to obt

Method used

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  • Conductive paste
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Examples

Experimental program
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Effect test

Example Embodiment

[0104] Example

[0105] Hereinafter, examples and comparative examples are shown to specifically describe the present embodiment, but the present invention is not limited to these examples. In addition, the following "%" is a mass basis unless otherwise specified. In addition, the weight average molecular weight is calculated using gel carrier liquid chromatography (HLC-8120 GPC TOSOH CORPORATION) in terms of polystyrene. .

[0106] Synthesis of organic binder resin

Example Embodiment

[0107] Synthesis example 1

[0108] In a reaction vessel equipped with a stirring device, a thermometer, and a condenser, 288 g (0.36 mol) of polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol was added as a polyol component ( Asahi Kasei Chemicals Corporation, T5650J, number average molecular weight 800), 45g (0.09mol) bisphenol A type propylene oxide adduct diol (ADEKA CORPORATION, BPX33, number average molecular weight 500), 81.4g (0.55mol) ) Dimethylolbutyric acid as dimethylolalkanoic acid, 11.8g (0.16mol) of n-butanol as a molecular weight regulator (reaction terminator), and 250g of carbitol acetate as a solvent (manufactured by Daicel Corporation) , Dissolve all the raw materials at 60°C.

[0109] While stirring the polyol component, 200.9 g (1.08 mol) of trimethylhexamethylene diisocyanate as a polyisocyanate was added dropwise through a dropping funnel. After the dropping was terminated, the reaction was continued while stirring at 80°C, and the absorpt...

Example Embodiment

[0111] Synthesis Example 2

[0112] In a reaction vessel equipped with a stirring device, a thermometer, and a condenser, 360g (0.45mol) of polycarbonate diol derived from 1,5-pentanediol and 1,6-hexanediol was added as a polyol component ( Asahi Kasei Chemicals Corporation, T5650J, number average molecular weight 800), 81.4g (0.55mol) of dimethylolbutyric acid as dimethylolalkanoic acid, and 11.8g (0.16mol) as molecular weight regulator (reaction terminator) N-butanol, 250 g of carbitol acetate (manufactured by Daicel Corporation) as a solvent, all the raw materials were dissolved at 60°C.

[0113] While stirring the polyol component, 200.9 g (1.08 mol) of trimethylhexamethylene diisocyanate as a polyisocyanate was added dropwise through a dropping funnel. After the dropping was terminated, the reaction was continued while stirring at 80°C, and the absorption spectrum of the isocyanate group (2280cm -1 ) Disappears and the reaction ends. Carbitol acetate was added so that the s...

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Abstract

The invention provides a conductive paste, which has excellent fitness with an ITO thin film and enables a conductive circuit formed by a low-temperature technology to have excellent conductivity and also good printing adaptability. The conductive paste provided in the invention is characterized by comprising polyurethane resin, conductive powder and an organic solvent. The organic solvent also comprises 30-90 weight percent of high-boiling-point solvents which have a boiling point ranging from 240 degrees to 330 degrees under a 760mmHg condition.

Description

technical field [0001] The present invention relates to a conductive paste and a method for producing a conductive circuit using the same. Background technique [0002] In recent years, in electronic devices using touch panels such as tablet terminals, for example, ITO thin films in which ITO (Indium Tin Oxide) electrodes are formed on thin films such as PET are used. [0003] Such an ITO thin film is formed by forming an ITO layer on the thin film, and removing (etch out) by etching so as to leave an electrode portion. Then, a conductive circuit is formed on the exposed thin film and the ITO layer using a conductive paste in which conductive powder such as Ag is dispersed in an organic binder. [0004] Various low-temperature-fireable conductive pastes for use in low-heat-resistant devices using such thin films have been proposed (for example, refer to Patent Document 1 and the like). However, in the conductive circuit on the ITO thin film, there are problems such as insu...

Claims

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Application Information

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IPC IPC(8): H01B1/20H01B13/00C09D11/10H05K3/12C09D11/52
CPCC09D5/24C09D11/52H01B1/20H01B5/14H05K3/12
Inventor 佐佐木正树小田桐悠斗
Owner TAIYO INK MFG
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