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Photocurable resin composition, dry film, cured article, and printed wiring board

A technology of photocurable resin and composition, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as hindering photoreaction, difficult high filling, lower resolution, etc., to achieve excellent resolution, Excellent heat and cold shock resistance

Inactive Publication Date: 2012-10-24
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the other hand, there is a problem that high filling is difficult because these inorganic fillers hinder photoreaction and lower resolution

Method used

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  • Photocurable resin composition, dry film, cured article, and printed wiring board
  • Photocurable resin composition, dry film, cured article, and printed wiring board
  • Photocurable resin composition, dry film, cured article, and printed wiring board

Examples

Experimental program
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Effect test

Embodiment

[0184] The present embodiment will be specifically described below by showing examples and comparative examples, but the present invention is of course not limited to the following examples. In addition, "parts" and "%" described below are all mass standards unless otherwise stated.

[0185] (Synthesis of carboxyl-containing resins)

Synthetic example 1

[0187] Add 119.4 g of novolak-type cresol resin (manufactured by Showa Polymer Co., Ltd., trade name: Shonol (registered trademark) CRG951, OH equivalent: 119.4), 1.19g of potassium hydroxide and 119.4g of toluene, nitrogen replacement was carried out in the system while stirring, and the temperature was raised.

[0188] Then, slowly drop 63.8g of propylene oxide, at 125~132℃, 0~4.8kg / cm 2 The reaction was carried out for 16 hours. Thereafter, it was cooled to room temperature, and 1.56 g of 89% phosphoric acid was added and mixed in the reaction solution to neutralize potassium hydroxide to obtain an epoxy resin with a non-volatile content of 62.1% and a hydroxyl value of 182.2 g / eq. Propane reaction solution. An average of 1.08 moles of alkylene oxide was added per 1 equivalent of phenolic hydroxyl group.

[0189] Then, the alkylene oxide reaction solution of 293.0g gained novolak type cresol resin, 43.2g acrylic acid, 11.53g methanesulfonic acid, 0.18g methyl hydroquinon...

Synthetic example 2

[0193] In a 5-liter detachable flask equipped with a thermometer, a stirrer, and a reflux cooler, 1245 g of polycaprolactone diol (manufactured by DAICEL CHEMICAL INDUSTRIES, LTD., trade name: PLACCEL (registered trademark) 208, molecular weight 830), 201 g dimethylol propionic acid as dihydroxy compound with carboxyl groups, 777 g isophorone diisocyanate as polyisocyanate and 119 g acrylic acid-2- Hydroxyethyl ester, and 0.5 g each of p-methoxyphenol and di-tert-butylhydroxytoluene.

[0194] Heating to 60°C while stirring was stopped, and 0.8 g of dibutyltin dilaurate was added. When the temperature in the reaction vessel begins to drop, heat it again, continue stirring at 80°C, and confirm the absorption spectrum of the isocyanate group (2280cm -1 ) disappears, the reaction ends, and a viscous liquid urethane acrylate compound is obtained. Next, the obtained urethane acrylate compound was adjusted to non-volatile matter=50 mass % using carbitol acetate.

[0195] In this w...

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Abstract

Disclosed are: a photocurable resin composition which can be developed with an alkali, has excellent resolution properties, and enables the production of a cured article having excellent (wet) heat resistance and thermal impact resistance; a dry film; a cured product of the composition; and a printed wiring board produced using the cured product. The photocurable resin composition is characterized by comprising a resin containing a carboxyl group, a photopolymerization initiator, and surface-treated neuburg siliceous earth particles.

Description

technical field [0001] This invention relates to the printed wiring board using the photocurable resin composition used for solder resist etc., a dry film, these cured products, and these cured products, for example. Background technique [0002] In recent years, solder resists for some consumer printed circuit boards and most industrial printed circuit boards have used heat and / or Or a liquid developing type solder resist that is finally cured (mainly cured) by light irradiation. In addition, in response to the increase in the density of printed wiring boards accompanying the reduction in weight and size of electronic equipment in recent years, improvement in handleability and high performance of solder resists are required. [0003] On the other hand, in consideration of environmental issues, alkali-developing photosolder resists using an aqueous alkali solution as a developing solution have become mainstream. As such an alkali-developing photosolder resist, an epoxy acr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004C08K9/00H01L21/027H05K3/28
CPCC08F290/067H05K3/287C08F290/147C08J5/18C08F290/061G03F7/0047G03F7/032G03F7/033G03F7/035G03F7/0755G03F7/0045G03F7/0382H01L21/0271
Inventor 伊藤信人冈本大地吉田贵大有马圣夫
Owner TAIYO HLDG CO LTD
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