Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for improving conductive solder welding electronic packaging strength based on electrowetting principle

An electro-wetting, soldering technology, applied in welding equipment, circuits, electrical components, etc., can solve the problems of reduced welding strength and reliability of solder joints, and achieve the effect of low power consumption and remarkable effect.

Active Publication Date: 2012-11-14
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a method based on the principle of electrowetting to improve the strength of conductive solder welding electronic packaging, which is used to solve the problems of reduced welding strength and reliability of solder joints in the existing packaging technology due to the small size of solder joints

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for improving conductive solder welding electronic packaging strength based on electrowetting principle
  • Method for improving conductive solder welding electronic packaging strength based on electrowetting principle
  • Method for improving conductive solder welding electronic packaging strength based on electrowetting principle

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0050] In a first embodiment, the solder joint structure is single or multiple solder balls applied to a single substrate.

[0051] The method for improving the strength of an electronic package welded by conductive solder based on the electrowetting principle of the present invention includes: manufacturing a base substrate; and performing electrowetting treatment.

[0052] The making of described base substrate comprises:

[0053] 1-1. Provide a substrate 10, form a metal layer 12 on the substrate 10, pattern the metal layer 12 to form a lower electrode, and form a Figure 1a structure shown.

[0054] In this embodiment, the method for forming the metal layer 12 is an evaporation process or a sputtering process, and the metal layer is to thickness of Ti / Au. The patterned metal layer 12 is used to form the lower electrode using a wet etching process (Wet Etching), which specifically includes: using photoresist as a mask, wet etching to form a pattern, and removing th...

no. 2 example

[0079] In the second embodiment, the solder joint structure is a single or multiple solder balls applied in a flip-chip soldering structure. As one of the most active chip bonding technologies currently researched and developed, flip-chip bonding technology can realize direct bonding between bumps and printed circuit boards or other substrates. It has small lead inductance, small crosstalk between signals, short signal transmission delay, and good electrical performance Good and other advantages, can achieve the highest installation density, the highest number of I / O and lower cost, etc., more suitable for high-frequency, high-speed electronic products, and have applications in communication fields such as mobile phones and optoelectronics.

[0080] It should be noted that, in the second embodiment, for the convenience of description, the substrate is a silicon wafer with good electrical conductivity as an example for illustration, and details can be found in the following desc...

no. 3 example

[0093] We know that in many MEMS and SIP structures, hermetic packages will be used. Therefore, in the third embodiment, the solder joint structure is a single or multiple solder rings applied to a hermetic package.

[0094] It should be noted that in the third embodiment, for the convenience of description, the substrate is a silicon wafer with good electrical conductivity as an example for illustration, and details are described in the following description.

[0095] The making of described base substrate comprises:

[0096] First, a first silicon substrate 30 is provided, and the first silicon substrate 30 is used as a first electrode; a second silicon substrate 31 is provided, and the second silicon substrate 31 is used as a second electrode;

[0097] Then, a first dielectric layer 32 is formed on the first silicon substrate 30; in this embodiment, the first dielectric layer 32 is silicon nitride or silicon oxide with a thickness of 1 μm to 5 μm.

[0098] A welding ring ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
melting pointaaaaaaaaaa
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides a method for improving conductive solder welding electronic packaging strength based on electrowetting principle, which includes the steps of: making a substrate base plate which is provided with a solder joint structure and a conductive electrode; carrying out electrowetting treatment, heating the substrate base plate to a temperature above the melting point of the solder to enable the solder to be in molten state; and applying voltage to the conductive electrode of the substrate base plate to reduce the surface tension of the solder by making use of the electrowetting effect, so as to increase the contact area of the solder joint structure and the substrate base plate. Compared with the prior art, the method provided by the invention has the advantages that electrowetting principle is adopted in the technical scheme, so the contact area of the solder joint structure can be increased and correspondingly the welding strength of the solder joint structure can be improved and the reliability of a semiconductor device can be improved.

Description

technical field [0001] The invention relates to the field of manufacturing semiconductor devices, in particular to a method for improving the strength of electronic packages welded by conductive solder based on the principle of electrowetting. Background technique [0002] In recent years, with the continuous progress of microelectronics technology, the integrated circuit manufacturing industry has developed rapidly. Electronic packaging is one of the important steps in the manufacturing process of microelectronic devices, and it has always been advancing along with the advancement of the microelectronics industry. When the performance of the device chip reaches a certain level, electronic packaging becomes a key factor to improve the electrical performance and reliability of the device, and becomes an important part of the microelectronic device manufacturing industry that is equally important to circuit design and chip manufacturing. [0003] With the continuous developme...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60B23K1/20
CPCH01L2924/0002H01L24/11H01L2224/11H01L2924/01322H01L2924/1461H01L2924/00H01L2924/00012
Inventor 李昕欣程融
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com