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Toughening membrane with surface bump microstructure and preparation method thereof

A microstructure and toughening technology is applied in the field of toughened films with raised surface microstructures and their preparation, which can solve problems such as no toughened films, and achieve the improvement of impact-resistant delamination ability, toughening effect, and preparation. simple method effect

Active Publication Date: 2013-01-23
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But this method usually only prepares functional microstructures on the surface of the substrate, such as CN201110205508.1 to prepare conductive graphene microstructures for semiconductor parts, such as CN1702527 to prepare alignment layers for liquid crystal displays, and CN1544308 Colloidal crystal patterning is applied to colloid-based Design and preparation of crystal optical devices, but there are no relevant literature and patent reports for the preparation of toughened films for intercalation of laminated composite materials

Method used

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  • Toughening membrane with surface bump microstructure and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0028](1-1) Dissolve PEK-C (a phenolphthalein-modified polyaryletherketone) or PES in tetrahydrofuran to make a solution, and the mass percentage concentration of the solution is 5% or 20%;

[0029] (1-2) Soft printing to obtain a film with a raised surface microstructure: add the solution dropwise to the structured side of the PDMS soft template with the microstructure of the lotus leaf surface reversely engraved. The raised height of the lotus leaf structure is 10~ 15μm, the width is 5μm, that is, the aspect ratio is 2~3, and then the two sides of the microstructure of the soft template that have been added with the solution are pressed together face to face, and kept at 30°C for 3min, and after peeling off, a double-sided Film with lotus leaf structure;

[0030] (1-3) Post-processing to obtain a toughened film: drying the film to remove residual solvent to obtain a toughened film with a raised microstructure on the surface;

[0031] (1-4) Drill the film with a mechanical p...

Embodiment 2

[0033] (2-1) Polyamic acid or polyetheramic acid or polyimide or polyetherimide precursor polymer such as polyamide ester or polyetheramide ester is dissolved in methanol to form a solution, polymerized The mass percent concentration of the precursor solution is 1% or 2%;

[0034] (2-2) Soft printing to obtain a film with a raised microstructure on the surface: add the solution dropwise to the structured side of the PDMS soft template with the surface microstructure of the grating reversed. The raised height of the grating is 5 μm or 10 μm, and the period 2 μm, that is, the aspect ratio is 2.5 or 5, take another film with a thickness of 7 μm made of this polymer precursor, and then press the microstructure of the two soft templates that have been added with the solution to face the surface of the film. On both sides, keep at 40°C for 5 minutes, and after peeling off, a polymer precursor film with surface convex microstructures on both sides is obtained;

[0035] (2-3) Post-tr...

Embodiment 3

[0038] (3-1) Dissolve polyethersulfone or polyetherimide in DMF to form a solution, and the mass percent concentration of the polymer solution is 15%;

[0039] (3-2) Soft printing to obtain a film with a raised microstructure on the surface: add the solution dropwise to the structured side of the soft template with a tetragonal lattice microstructure on the surface, and the raised height of the tetragonal lattice is 50 μm or 90 μm, the width is 10 μm, that is, the aspect ratio is 5 or 9, and the spacing between the bumps is 30 μm, and then this template is pressed on a PEK-C film placed on a soft template with a flat surface, the film The thickness is 15 μm. Then keep it at 110°C for 10 minutes, and peel it off to get a PES / PEK-C or PEI / PEK-C composite film with a square lattice on one side;

[0040] (3-3) Post-processing to obtain a toughened film: drying the film to remove residual solvent to obtain a toughened film with a raised microstructure on the surface;

[0041] (3-...

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Abstract

The invention belongs to a toughening technology of a laminated composite material of a continuous carbon fiber reinforced resin matrix and relates to a toughening membrane with a surface bump microstructure and a preparation method of the toughening membrane. The toughening membrane is mainly characterized in that a proper toughening macromolecule is selected to obtain a self-support film with the surface bump microstructure for toughening the laminated composite material by a soft template printing (soft lithography) method. According to the toughening membrane and the preparation method of the toughening membrane, the preparation method is simple, and the preparation method is suitable for various thermoplastic resin systems. The toughening membrane may includes various complicated macromolecule surface bump microstructures and different material matrixes to match with various requirements for toughening the laminated composite material.

Description

technical field [0001] The invention belongs to a toughening technology of a continuous carbon fiber reinforced resin-based laminated composite material, and relates to a toughening film with a surface convex microstructure and a preparation method thereof. Background technique [0002] For aerospace composite materials, because they are usually thermosetting resins, the high cross-linking density after curing leads to low mobility of molecular segments, which manifests as intrinsic brittleness of the resin, and for composite materials, it manifests as insufficient interlayer toughness , The problem of limited impact damage resistance, how to improve the impact damage resistance of composite materials through toughening has become an important research issue, and it is also the biggest problem facing the promotion and application of advanced composite materials to aircraft structures. [0003] There are many ways to toughen composite materials, such as direct toughening of t...

Claims

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Application Information

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IPC IPC(8): C08J5/00C08L77/00C08L71/10C08L79/08C08L81/06C08L61/16C08J5/18
Inventor 郭妙才
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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