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Preparation method of high-heat-conduction aluminum nitride ceramic shaped part

An aluminum nitride ceramic, high thermal conductivity technology, applied in the field of electronic packaging materials, can solve the problems of high dielectric constant, high cost, low thermal conductivity, etc., and achieve the effects of reliable product quality, stable production process and low production cost.

Inactive Publication Date: 2013-01-30
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among these ceramic materials, Al 2 o 3 It is the most widely used and most mature heat dissipation material at present, but its thermal conductivity is low, so it cannot meet the requirements of high thermal conductivity
BeO has good comprehensive properties, but its toxicity limits its application
Although SiC has high thermal conductivity, the preparation process is complicated, the cost is high and the dielectric constant is high.

Method used

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  • Preparation method of high-heat-conduction aluminum nitride ceramic shaped part

Examples

Experimental program
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Effect test

Embodiment 1

[0029] Such as figure 1 In the process flow shown, AlN powder (oxygen content 0.6wt%) with an average particle size of 1 micron is used as the basic raw material, propanol is used as the organic solvent, polyethyleneimine (PEI) is used as the dispersant, and yttrium oxide (Y 2 o 3 ) as a sintering aid, using hydantoin epoxy resin as a molding agent, and dipropylenetriamine as a curing agent, after ball milling, molding, curing and drying, degreasing and sintering, the specific production process is as follows:

[0030] Preparation of premix: add 0.30g of polyethyleneimine (PEI) and 1.88g of hydantoin epoxy resin to 12.5g of propanol, stir to dissolve completely to obtain a premix.

[0031] Mixing ball mill: Weigh 48.5g of AlN powder with a purity greater than 99% and yttrium oxide (Y 2 o 3 ) 1.5g into the premixed solution, add zirconia balls (volume ratio of ball to material is about 1:1), and mill in a roller mill for 24 hours to obtain an AlN slurry with a viscosity of 1...

Embodiment 2

[0040] Such as figure 1 In the process flow shown, AlN powder with an average particle size of 1 micron (oxygen content less than 0.6wt%) is used as the basic raw material, propanol is used as the organic solvent, OP-85 emulsifier is used as the dispersant, and yttrium oxide is used as the sintering aid (Y 2 o 3 ) and calcium fluoride (CaF 2 ), using ethylene glycol diglycidyl ether (EGDGE) as a molding agent, and triethylenetetramine as a curing agent, after ball milling, molding, curing and drying, degreasing and sintering, the specific production process is as follows:

[0041] Preparation of premix: Add 1.0g of OP-85 emulsifier and 1.88g of ethylene glycol diglycidyl ether (EGDGE) into 12.5g of propanol, stir to dissolve completely to obtain a premix.

[0042] Mixing ball mill: Weigh 50g of AlN powder with a purity greater than 99%, yttrium oxide (Y 2o 3 ) 1.5g, calcium fluoride (CaF 2 ) 1g, added to the premixed solution, added zirconia balls (volume ratio of ball t...

Embodiment 3

[0051] Such as figure 1 In the process flow shown, AlN powder with an average particle size of 2 microns (oxygen content 0.65wt%) is used as the basic raw material, ethanol is used as the organic solvent, polyethyleneimine (PEI) is used as the dispersant, and yttrium fluoride is used as the sintering aid (YF 3 ) and calcium fluoride (CaF 2 ), using sorbitol polyglycidyl ether (SPGE) as a molding agent, and dipropylenetriamine as a curing agent, after ball milling, molding, curing and drying, degreasing and sintering, the specific production process is as follows:

[0052] Preparation of the premix: Add 0.30 g of polyethyleneimine (PEI) and 1.84 g of sorbitol polyglycidyl ether (SPGE) to 12.25 g of ethanol, and stir to dissolve them completely to obtain the premix.

[0053] Mixing ball mill: Weigh 50g of AlN powder with a purity greater than 99% and yttrium fluoride (Y 2 o 3 ) 1.5g, calcium fluoride 2.0g, added to the premixed solution, added zirconia balls (volume ratio of...

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Abstract

The invention discloses a preparation method of a high-heat-conduction aluminum nitride (AlN) ceramic shaped part. The preparation method is characterized in that aluminum nitride powder is used as a basic raw material, ethanol, propyl alcohol, butanol or other mixture is used as organic solvent, the basic raw material and the organic solvent are mixed with epoxy resin and dispersion agent to form pre-mixed solution, the pre-mixed solution is mixed and spherically ground into sizing agent, the sizing agent is uniformly mixed with solidifier after being vacuum degasified, and then shaped ceramic blank with large strength is formed through technique flows such as pouring molding, solidification, demolding, drying and the like; and an aluminum nitride ceramic shaped component with relative density being more than 97 percent, heat conductivity being more than 160W / m.K and tensile strength being more than 300Mpa is formed through degreasing, sintering and compacting. The method has advantages of simpleness in process, low production cost, good product performance and the like, and different aluminum nitride ceramic parts in different complicated shapes with high heat conduction performance can be prepared.

Description

technical field [0001] The invention belongs to the field of electronic packaging materials or ceramic materials, and in particular relates to a method for preparing AlN ceramics with high thermal conductivity by gel injection molding. Specifically, the invention is a new method for preparing aluminum nitride ceramic special-shaped parts . Background technique [0002] Commonly used ceramic heat dissipation materials mainly include: Al 2 o 3 , BeO, SiC, AlN, etc. Among these ceramic materials, Al 2 o 3 It is currently the most widely used and most mature heat dissipation material, but its thermal conductivity is low, so it cannot meet the high thermal conductivity requirements. BeO has good comprehensive properties, but its toxicity limits its application. Although SiC has high thermal conductivity, its preparation process is complicated, its cost is high and its dielectric constant is high. [0003] In comparison, AlN ceramics have excellent thermal conductivity, and...

Claims

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Application Information

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IPC IPC(8): C04B35/581C04B35/622C04B35/634
Inventor 甘雪萍姜超周科朝李志友张斗
Owner CENT SOUTH UNIV
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