Heat dissipation substrate for led

A heat-dissipating substrate, heat-resistant technology, applied in circuit thermal devices, heat exchange equipment, lighting and heating equipment, etc., can solve the problems of low machinability, inability to three-dimensional processing, and the inability of LED heat-dissipating substrates to bend, and achieve excellent heat dissipation performance , the effect of low thermal resistance, excellent mechanical workability

Inactive Publication Date: 2013-02-20
UBE IND LTD
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such LED heat dissipation substrates containing a large amount of inorganic fillers may have low workability, and during processing (machining), the fillers may be scattered around, which may cause problems.
In addition, this kind of LED heat dissipation substrate cannot be bent, nor can it be three-dimensionally processed (or manufactured)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation substrate for led
  • Heat dissipation substrate for led
  • Heat dissipation substrate for led

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0167] (Reference Example 1: Preparation of jelly of heat-resistant polyimide S1)

[0168] To N-methyl-2-pyrrolidone, add p-phenylenediamine (PPD) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA) at a molar ratio of 1000:998, so that the monomer concentration is 18% (by weight, the same applies below). Subsequently, the mixture was reacted at 50°C for 3 hours. The polyamic acid solution thus obtained had a solution viscosity of about 1680 poise at 25°C.

Embodiment 2

[0169] (Reference Example 2: Preparation of jelly for heat-resistant bonding polyimide S2)

[0170] To N-methyl-2-pyrrolidone, add 1,3-bis(4-aminophenoxy)benzene (TPE-R) and 2,3,3',4' in a molar ratio of 1000:200:800 - Biphenyltetracarboxylic dianhydride (a-BPDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA) so that the monomer concentration was 18%. Subsequently, 0.5% by weight of triphenyl phosphate was added thereto with respect to the monomer, and the mixture was reacted at 40° C. for 3 hours. The polyamic acid solution thus obtained had a solution viscosity of about 1680 poise at 25°C.

Embodiment 3 and 4

[0171] (Reference Examples 3 and 4: Preparation of thermocompression bonding multilayer polyimide films A1 and A2)

[0172] Use the film-forming machine that three-layer extrusion die (multi-flow channel die) is equipped with, cast the polyamic acid solution that reference example 1 and 2 make with the thickness casting of different three-layer extrusion dies on metal support body, then Continuously dried under hot air at 140°C, and peeled off the support to form a self-supporting film. The self-supporting film peeled off from the support was gradually heated in a furnace from 150°C to 450°C to remove the solvent and carry out the imidization reaction. Thus, three-layer long polyimide films of two different thicknesses were prepared and wound into rolls.

[0173] The properties of the thus obtained three-layer polyimide film (layer configuration: S2 / S1 / S2) were evaluated, and the results are as follows.

[0174] (Thermal compression bonding multilayer polyimide film A1)

[...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

A heat dissipation substrate for an LED has copper foil or copper alloy foil layered on one side of a polyimide film and also has aluminum foil or aluminum alloy foil layered on the other side thereof. The thermal resistance between the surface of the copper foil or the copper alloy foil and the surface of the aluminum foil or the aluminum alloy foil is 1.8 DEG C / W or less.

Description

technical field [0001] The invention relates to an LED heat dissipation substrate. More specifically, the present invention relates to a thin, bendable and three-dimensionally processable LED heat dissipation substrate. Background technique [0002] In recent years, demand for LED lighting devices including LEDs (Light Emitting Diodes) as light sources is rapidly increasing due to their low power consumption and long life. However, when an LED is lit, it generates heat. When the generated heat heats the LED to a high temperature, the luminous efficiency of the LED may be significantly reduced, and the lifetime of the LED may be affected. Especially high-power, high-brightness LEDs will generate a lot of heat when they are turned on. Therefore, in order to avoid an increase in the temperature of the LEDs, the heat dissipation of the LEDs becomes particularly important. [0003] Therefore, a heat-dissipating substrate having excellent heat-dissipating performance is used as...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64
CPCH05K1/0203H01L33/641H05K3/022H05K2201/10106F28F21/089H05K1/189H05K2201/0355H05K2201/0154H01L33/48
Inventor 山口茂康中山修长尾圭吾河内山拓郎水垂敦
Owner UBE IND LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap