Production method of submicron-order tin-copper alloy powder

A technology of tin-copper alloy and production method, which is applied in the field of production of sub-micron tin-copper alloy powder, can solve the problems of large particles, uneven surface and high sintering temperature of tin-copper alloy powder, and achieves uniform particle size distribution and powder flow. Good performance and large specific surface area

Active Publication Date: 2013-03-06
JIANGSU BOQIAN NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the particle size of the tin-copper powder prepared by the spray method is 15-50um, and the particle size is relatively large, resulting in a thicker welding coating, a large amount of tin-copper powder used, and a higher cost; The contact surface between the powders is small, and the welding conductivity is poor; due to the short solidification time and large particles during spray forming, the powder cannot be formed under the action of its surface tension, resulting in concave and convex surfaces on the powder surface, and the surface is not smooth. smooth
The above reasons all lead to the high sintering temperature and slow sintering speed of the tin-copper alloy powder made by spraying method during welding, which cannot meet the requirements of refined electronic products.

Method used

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  • Production method of submicron-order tin-copper alloy powder

Examples

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Embodiment 1

[0023] The production method of tin-copper alloy powder in this embodiment is carried out in a reaction system consisting of a high-temperature evaporator with a plasma generator, a particle controller, and an alloy powder collector, which are sequentially connected at the top, and specifically includes the following steps:

[0024] (1) First, the tin raw materials and copper raw materials are fed into the crucible in the high-temperature metal evaporator through the feeding port at the flow rate of 0.8kg / h and 2.4kg / h. After the air tightness of the equipment is qualified, the reaction system is vacuumed. Then flush the reaction system through a valve at the bottom of the high-temperature evaporator and fill it with nitrogen, keeping the internal atmosphere of the system inert and the pressure at 110kPa;

[0025] (2) Turn on the plasma generator set on the top of the high-temperature evaporator to generate high-frequency plasma gas as the heating source, heat the tin and copper raw...

Embodiment 2

[0032] The production method of tin-copper alloy powder in this embodiment is carried out in a reaction system of a high-temperature evaporator, a particle controller, and an alloy powder collector connected in sequence, and specifically includes the following steps:

[0033] (1) First, the tin raw materials and copper raw materials are fed into the crucible in the high-temperature metal evaporator through the feeding port at a flow rate of 1.5kg / h and 1.5kg / h. After the air tightness of the equipment is qualified, the reaction system is vacuumed. Then flush the reaction system through a valve at the bottom of the high-temperature evaporator and fill it with nitrogen, keeping the internal atmosphere of the system inert and the pressure at 110kPa;

[0034] (2) Turn on the plasma generator set on the top of the high-temperature evaporator to generate high-frequency plasma gas as the heating source, heat the tin and copper raw materials to a molten state, and continue to raise the temp...

Embodiment 3

[0041] The production method of tin-copper alloy powder in this embodiment is carried out in a reaction system consisting of a high-temperature evaporator with a plasma generator, a particle controller, and an alloy powder collector, which are sequentially connected at the top, and specifically includes the following steps:

[0042] (1) First, add the tin and copper raw materials into the crucible in the high-temperature metal evaporator through the feeding port at the flow rate of 0.8kg / h and 2.4kg / h. After the air tightness of the equipment is qualified, the reaction system is vacuumed. Then flush the reaction system through a valve at the bottom of the high-temperature evaporator and fill it with nitrogen, keeping the internal atmosphere of the system inert and the pressure at 110kPa;

[0043] (2) Turn on the plasma generator set on the top of the high-temperature evaporator to generate high-frequency plasma gas as the heating source, heat the tin and copper raw materials to a mo...

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Abstract

The invention discloses a production method of submicron-order tin-copper alloy powder. The production method comprises the following steps of: adding raw materials, namely tin and copper, into a crucible in a high-temperature metal evaporator, and filling inert gas into the crucible to flush a reaction system; evaporating tin-copper alloy gases by starting a plasma generator on the top of the high-temperature metal evaporator as a heating source; cooling the tin-copper alloy gases by introduced inert gas, thus obtaining a gas-solid mixture of tin-copper alloy; and conveying the gas-solid mixture of the tin-copper alloy onto the outer wall of a gas-solid separator in an alloy powder collector through introducing inert gas into evaporator, and filling the inert gas to concentrate tin-copper alloy particles into a collection hopper at the bottom of the collector, thus the obtaining spherical tin-copper alloy powder. The submicron-order tin-copper alloy powder produced by the method has the advantages of being spherical, being low in oxygen content, reaching grain sizes ranging from 100nm to 3000nm, being uniform in size distribution, large in specific surface area and strong in surface activity, and needing low energy in oxidation.

Description

Technical field [0001] The invention relates to the technical field of metal powders, in particular to a production method of submicron tin-copper alloy powder. Background technique [0002] With the rapid development of electronic products in the direction of portable, miniaturization, networking and multimedia, surface mount technology (SMT) has become more and more widely used in the electronics industry. Among the many technologies involved in SMT, soldering technology is SMT Core technology, with the application of reflow soldering technology, solder paste has become the most important process material in SMT. At present, the solder paste used in SMT, in addition to flux and carrier, has 85% to 92% of solder alloy powders with different alloy compositions. These solder alloy powders include Sn-Cu series, Sn-Pb-Ag series, Sn- Pb-Bi series and lead-free series, such as Sn-Ag series, Sn-Cu series, Sn-Zn series and so on. Solder alloy powder is the only functional component th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/12
Inventor 赵登永陈钢强高书娟王光杰
Owner JIANGSU BOQIAN NEW MATERIALS
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