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Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive

An epoxy adhesive and adhesive technology, applied in the directions of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of reduced heat resistance, increased water absorption, uneven dispersion of fillers affecting the performance of the cover film, etc. Excellent heat resistance, the effect of increasing compatibility

Inactive Publication Date: 2013-04-17
ZHEJIANG WAZAM NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of a large amount of phosphorus-based flame retardants, on the one hand, the uneven dispersion of fillers affects the performance of the covering film; Large, and small molecule fillers seep or migrate to the surface during subsequent use, affecting subsequent use

Method used

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  • Halogen-free epoxy adhesive and cover film prepared by using halogen-free epoxy adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Take 15 parts by weight of phosphorus-containing epoxy resin FX-305 (TOHTO Chemical Industry Co., Ltd. epoxy equivalent 500g / eq), rubber body modified epoxy resin Epon Resin 58005 (Hexion Specialty Chemicals, Inc., rubber content 40wt %) 25 parts, toughening agent 1072CG (Zeon Corporation, acrylonitrile content 27wt%) 20 parts, 4,4'-diaminodiphenylsulfone 7.26 parts by weight; 1-cyanoethyl-2-ethyl-4-methyl 0.20 parts by weight of imidazole (2E4MZ-CN, Shikoku Chemicals); 15 parts by weight of aluminum hydroxide; 5 parts by weight of phosphorus-containing flame retardant OP-935 (Germany Clariant, phosphorus content 23%); nitrogen-containing flame retardant ( Melapur MC15) 5 parts by weight; 0.20 parts of antioxidant, adjust the solid content of the adhesive to 40wt% with butanone solvent, and mix it into a halogen-free epoxy adhesive.

[0025] The adhesive is coated on a polyimide film with a thickness of 12.5 μm by a coating machine, and then heated in an oven at 120° C....

Embodiment 2

[0028] Phosphorus-containing epoxy resin FX-305 (TOHTO Chemical Industry Co., Ltd. epoxy equivalent 500g / eq) 25 parts by weight; rubber modified epoxy resin Epon Resin 58005 (Hexion Specialty Chemicals, Inc., rubber content 40wt%) 20 parts; toughening agent 1072CG (Zeon Corporation, acrylonitrile content 27wt%) 20 parts; 4,4'-diaminodiphenylsulfone 7.93 parts by weight; 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN Shikoku Chemicals) 0.20 parts by weight; aluminum hydroxide 15 parts by weight; phosphorus-containing flame retardant OP-935 (Germany Clariant, phosphorus content 23%) 7 parts by weight; nitrogen-containing flame retardant (Melapur MC15) 5 parts by weight; 0.20 parts of antioxidant; use butanone solvent to adjust the solid content of the glue to 40wt%, and mix it into a halogen-free epoxy adhesive.

[0029] The adhesive is coated on a polyimide film with a thickness of 12.5 μm by a coating machine, and then heated in an oven at 120° C. for 4 minutes to form a sem...

Embodiment 3

[0032]Phosphorus-containing epoxy resin FX-305 (TOHTO Chemical Industry Co., Ltd. epoxy equivalent 500g / eq) 35 parts by weight; rubber modified epoxy resin Epon Resin 58005 (Hexion Specialty Chemicals, Inc., rubber content 40wt%) 20 parts; toughening agent 1072CG (Zeon Corporation, acrylonitrile content 27wt%) 25 parts; 4,4'-diaminodiphenylsulfone 8.45 parts by weight; 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN Shikoku Chemicals) 0.20 parts by weight; aluminum hydroxide 20 parts by weight; phosphorus-containing flame retardant OP-935 (Germany Clariant, phosphorus content 23%) 5 parts by weight; nitrogen-containing flame retardant (Melapur MC15) 8 parts by weight; 0.20 parts of antioxidant; adjust the solid content of the glue solution to 40wt% with butanone solvent, and mix it into a halogen-free epoxy adhesive.

[0033] The adhesive is coated on a polyimide film with a thickness of 12.5 μm by a coating machine, and then heated in an oven at 120° C. for 4 minutes to form...

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Abstract

The invention discloses a halogen-free epoxy adhesive which is prepared from the following components in parts by weight: 10-80 parts of phosphorus-containing epoxy resin, 10-40 parts of rubber modified epoxy resin, 10-50 parts of a toughening agent, 1-25 parts of a curing agent, 0.01-1.0 part of a curing accelerant, 0-80 parts of inorganic filler, 1-40 parts of a phosphorus-containing fire retardant, 1-40 parts of a nitrogenous fire retardant and 0.01-1.0% of an antioxidant. According to the invention, the components are dispersed into an organic solvent according to the proportion, so that the adhesive with the solid content of 30-50wt% can be obtained. The halogen-free epoxy adhesive does not contain halogen, and uses the phosphorus-containing fire retardant and the nitrogenous fire retardant to cooperate with a flame-retardant adhesive system, thus reducing the dosage of the phosphorus-containing fire retardant, and overcoming the negative effect caused by using a great deal of phosphorus-containing fire retardant; the halogen-free epoxy adhesive is good in fire resistance, excellent in heat resistance, high in reliability and better in mechanical property. The invention also discloses a cover film prepared from the halogen-free epoxy adhesive, and the cover film has the fire resistance of UL 94V-0 level, excellent stripping strength, heat resistance and processing performance.

Description

technical field [0001] The invention belongs to the application field of polymer composite materials, and in particular relates to a halogen-free epoxy adhesive and a covering film prepared by using the same. Background technique [0002] At present, the packaging materials used for flexible circuit boards (FPC), in order to ensure the UL flame retardant grade of the material, have been using bromine-containing epoxy resin and bromine-containing additives to achieve the purpose of flame retardancy, but waste electronic appliances may cause cancer when incinerated The hidden dangers of dioxins in substances. With the implementation of the EU's "Waste Electrical and Electronic Equipment Directive" (WEEEWaste Electrical and Electronic Equipment Directive) and "RoHS Restriction of Hazardous Substances" (RoHS Restriction of Hazardous Substances) directives, electronic The product puts forward the requirement not to contain lead, mercury, cadmium, hexavalent chromium, polybromina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/00C09J11/08C09J11/04C09J7/02
Inventor 潘锦平董辉沈宗华
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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