Method for preventing volatilization and achieving electromagnetic shielding by processing surface of organic matter component

A technology of electromagnetic shielding and organic matter, which is applied in the fields of magnetic field/electric field shielding, electrical components, vacuum evaporation plating, etc., can solve the problems of difficult mass production, low processing pass rate, complex shape of components, etc., and achieve low cost and excellent preparation process Proven and Reliable Effects

Inactive Publication Date: 2013-05-22
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Secondly, to reduce the hazards of volatilization, it is generally necessary to remove the volatile components as much as possible before use, but it is impossible to fully solve this problem. As the organic matter ages, volatile substances will also be produced; in addition, the use of metal shell packaging is the most commonly used method to solve the problem of volatilization. means
However, some components have complex shapes, low processing pass rate, and difficult mass production. At the same time, the metal shell will increase the volume and quality of the components, which is in contradiction with the weight reduction of the aircraft.

Method used

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  • Method for preventing volatilization and achieving electromagnetic shielding by processing surface of organic matter component
  • Method for preventing volatilization and achieving electromagnetic shielding by processing surface of organic matter component
  • Method for preventing volatilization and achieving electromagnetic shielding by processing surface of organic matter component

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Effect test

Embodiment 1

[0026] Metal Ni monolayer film was deposited by magnetron sputtering system, the target material was Ni with a purity of 99.9%, the purity of argon gas was 99.9%, and the background pressure of the vacuum chamber was 3×10 -4 Pa, the rotating speed of the workpiece holder is 20 rpm. Cleaning of the workpiece to be plated and clamping of the workpiece: Ultrasonic cleaning and dehydration of the workpiece to be plated are carried out with detergent, deionized water, and absolute ethanol respectively. The cleaning time is 10 minutes each time. After drying, transfer it to the work frame for plating. Turn on the mechanical pump and the molecular pump to evacuate until the pressure is lower than 3×10 -4 After Pa, 20 sccm of argon gas is input into the vacuum chamber, so that the pressure in the vacuum chamber is 1 Pa. Turn on the RF power supply, adjust the matcher, glow discharge occurs in the vacuum chamber, increase the incident power, and perform plasma etching cleaning on the ...

Embodiment 2

[0029] The metal Cu / Ni / Cu multilayer film is deposited by magnetron sputtering system, the target material is Cu and Ni with a purity of 99.9%, the purity of argon gas is 99.9%, and the background pressure of the vacuum chamber is 5×10 -4 Pa, the rotating speed of the workpiece holder is 30 rpm. Cleaning of the workpiece to be plated and clamping of the workpiece: Ultrasonic cleaning and dehydration of the workpiece to be plated are carried out with detergent, deionized water, and absolute ethanol respectively. The cleaning time is 10 minutes each time. After drying, transfer it to the work frame for plating. Turn on the mechanical pump and the molecular pump to evacuate until the pressure is lower than 5×10 -4 After Pa, 20 sccm of argon gas is input into the vacuum chamber, so that the pressure in the vacuum chamber is 1 Pa. Turn on the power, adjust the matcher, glow discharge occurs in the vacuum chamber, increase the incident power, and perform plasma etching cleaning on ...

Embodiment 3

[0032] A magnetron sputtering system was used to deposit a nickel-copper composite metal coating, the target materials were Cu and Ni with a purity of 99.9%, the purity of argon gas was 99.9%, and the background pressure of the vacuum chamber was 5×10 -4 Pa, the workpiece holder rotates at 10 rpm. Cleaning of the workpiece to be plated and clamping of the workpiece: Ultrasonic cleaning and dehydration of the workpiece to be plated are carried out with detergent, deionized water, and absolute ethanol respectively. The cleaning time is 10 minutes each time. After drying, transfer it to the work frame for plating. Turn on the mechanical pump and the molecular pump to evacuate until the pressure is lower than 1×10 -4 After Pa, 20 sccm of argon gas is input into the vacuum chamber, so that the pressure in the vacuum chamber is 1 Pa. Turn on the power, adjust the matcher, glow discharge occurs in the vacuum chamber, increase the incident power, and perform plasma etching cleaning o...

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Abstract

The invention provides a low-temperature (not higher than a softening temperature of an organic matter) physical coating method and a reliable process which are used for solving the problems of volatilization pollution and electromagnetic interference of an organic matter component. According to the low-temperature physical coating method and the reliable process, one or multiple metal coatings are coated on the surface of the organic matter, so that the metal coatings can completely wrap the organic matter component and have electromagnetic shielding functions in a static magnetic field or various frequencies. The coatings consist of two types of metals, namely iron, cobalt and nickel which are high in magnetic conductivity as well as gold, silver, copper and aluminum which are high in conductivity, the thicknesses of the coatings are controllable from a nanometer level to a micron level according to requirements, the specific coating method and process can be selected from various plasma vacuum depositions such as sputtering, evaporation, pulse and electric arc according to different materials and working conditions, and the preparation processes are mature and reliable, are relative low in cost and are suitable for industrial production.

Description

[0001] technical field [0002] The invention relates to a method for preventing volatilization on the surface of organic components, reducing or eliminating electromagnetic interference, and improving the service life and reliability of organic components. [0003] Background technique [0004] At present, many organic substances are added with volatile ingredients in the production and preparation process, and have been in service for a long time in the environment. Adverse effects on work equipment. At the same time, some organic electronic components will experience electromagnetic wave interference of different frequencies in the service environment, which will affect the reliability and stability of their work. In order to solve these problems, people have come up with many ways. For example, the use of metal shell packaging is an effective means, but it will increase the weight of the aircraft in high-precision aerospace and weaponry, which will conflict with the we...

Claims

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Application Information

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IPC IPC(8): C23C14/20H05K9/00
Inventor 庞晓露高克玮杨会生王燕斌
Owner UNIV OF SCI & TECH BEIJING
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