High-damping halogen-free pouring sealant and preparation method thereof

A technology of potting glue and high damping, which is applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., to achieve the effect of expanding the application range, prolonging the storage time, and reducing hygroscopicity

Inactive Publication Date: 2013-06-26
东莞市松山湖微电子材料研发中心
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the further development of electronic potting devices towards high integration and multi-functionalization, the performance requirements of potting adhesives are getting higher and higher, especially the requirements of high damping and halogen-free. The potting adhesives currently on the market often cannot meet its requirements

Method used

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  • High-damping halogen-free pouring sealant and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0023] Example 1: The high-damping halogen-free potting adhesive of the present invention is prepared according to the following steps: (1) Preparation of component A, firstly, 74.4% cyanate ester modified epoxy resin, 3.0% tetraphenol ethane tetra Add glycidyl ether and 0.5% powdered magnesium foam into a vacuum planetary mixer and stir for 60 minutes, where the vacuum degree is 0.080MPa and the speed is 600r / min; then add 15.0% silicon micropowder and 3.5% cyclopolydimethylsiloxane in sequence , 3.5% diphenyldimethoxysilane, 0.1% carbon black, stirred for 120min, wherein the vacuum degree was 0.080MPa, and the rotational speed was 500r / min; component A was obtained. (2) For the preparation of potting glue, mix components according to 100:5 weight percentage of component A and tetraethylenepentamine, and stir in a vacuum planetary mixer for 60 minutes, where the vacuum degree is 0.080MPa and the rotation speed is 300r / min, that is Obtain the high-damping halogen-free potting ...

Embodiment 2

[0024] Example 2: The high-damping halogen-free potting adhesive of the present invention is prepared according to the following steps: (1) Preparation of component A, firstly, 57.4% cyanate ester modified epoxy resin, 12.0% tetraphenol ethane tetra Add glycidyl ether and 4.5% powdered magnesium foam into a vacuum planetary mixer and stir for 60 minutes, where the vacuum degree is 0.080MPa and the rotation speed is 600r / min; then add 25.0% nano silicon powder, 0.3% methyl vinyl cyclosiloxane in sequence Alkane, 0.3% vinyltriethoxysilane, 0.5% titanium dioxide, stirred for 120min, wherein the vacuum degree was 0.080MPa, and the rotation speed was 500r / min; component A was obtained. (2) For the preparation of potting glue, mix components A and tetraethylenepentamine according to the weight percentage of 100:18, and stir in a vacuum planetary mixer for 60 minutes, where the vacuum degree is 0.080MPa and the rotation speed is 300r / min, that is Obtain the high-damping halogen-free ...

Embodiment 3

[0025] Example 3: The high-damping halogen-free potting adhesive of the present invention is prepared according to the following steps: (1) Preparation of component A, firstly, 65.2% cyanate ester modified epoxy resin, 8.0% pentaerythritol glycidyl ether and 2.5% %Powdered foamed magnesium was added to a vacuum planetary mixer, and stirred for 60min, wherein the vacuum degree was 0.080MPa, and the rotating speed was 600r / min; then 20.0% nanometer silicon carbide, 2.0% cyclodimethylsiloxane, 2.0% N- (β-aminoethyl)-γ-aminopropyltrimethyl(ethyl)oxysilane, 0.3% carbon black, stirred for 120min, wherein the vacuum degree was 0.080MPa, and the rotational speed was 500r / min; component A was obtained. (2) For the preparation of potting glue, mix components A and tetraethylenepentamine according to the weight percentage of 100:11, and stir in a vacuum planetary mixer for 60 minutes, where the vacuum degree is 0.080MPa and the rotation speed is 300r / min, that is Obtain the high-damping ...

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Abstract

The invention relates to high-damping halogen-free pouring sealant and a preparation method thereof. The high-damping halogen-free pouring sealant is obtained by the following method comprising the following steps of: uniformly mixing diluents, filler, foam magnesium damping agent, plasticizer, coupling agent, pigment and epoxy resin in proportion to obtain a component A; and uniformly mixing the component A with curing agent in proportion to obtain the high-damping halogen-free pouring sealant. According to the high-damping halogen-free pouring sealant and the preparation method thereof disclosed by the invention, the pouring sealant, which is prepared by using foam magnesium as damping agent and adopting the halogen-free material, has a higher loss factor and damping performance, good damping and noise-reducing performances and small moisture adsorption; moreover, high-damping halogen-free pouring sealant satisfies the halogen-free equipments and is larger in industrial practical value.

Description

technical field [0001] The invention relates to the technical field of electronic potting glue and is an improvement on the prior art, in particular to a high-damping halogen-free potting glue and a preparation method thereof. Background technique [0002] Potting glue is one of the important materials in the assembly of electronic products. It can prevent moisture, dust and harmful gases from invading electronic devices, reduce the impact of external vibration or external force damage on electronic devices, and stabilize internal parameters of devices. With the further development of electronic potting devices towards high integration and multi-functionalization, the performance requirements of potting adhesives are getting higher and higher, especially the requirements of high damping and halogen-free. The potting adhesives currently on the market often cannot meet its requirements. Contents of the invention [0003] The object of the present invention is to provide a h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J9/00
Inventor 邓小安徐安莲黄云波
Owner 东莞市松山湖微电子材料研发中心
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